IP Library Granted Patent US 7,970,198
Granted Patent B2
US 7,970,198 · App. 11/898,648 · Granted Jun 28, 2011

Method for performing pattern decomposition based on feature pitch

Assignee: ASML Masktools B.V.
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Quick Facts
Patent No.
US 7,970,198
App. No.
11/898,648
Granted
Jun 28, 2011
Kind
B2
Abstract

A method for decomposing a target pattern containing features to be printed on a wafer. The method includes the steps of: (a) defining a kernel representing a function having positive values within an inner radius and negative values in an outer radius; (b) defining the features utilizing a plurality of pixels; (c) disposing the kernel over a first pixel of the plurality of pixels; (d) determining the value of the kernel at location of each of the plurality of pixels, storing the value for each of the plurality of pixels so as to define a pixel value for each of the plurality of pixels; (e) adding a previously stored value associated with a given pixel of the plurality of pixels with the pixel value of the given pixel determined in step (d); (f) disposing the kernel over another pixel of the plurality of pixels, and repeating steps (d)-(f) until each of the plurality of pixels has been processed; and (g) determining placement of the pixel in a first pattern or a second pattern based on the pixel value of the given pixel.

Claims (53)

1. A method for decomposing a target pattern containing features to be printed on a wafer, into multiple patterns, comprising the steps of:

(a) defining a kernel representing a function having positive values within an inner radius and negative values in an outer radius;

(b) defining said features utilizing a plurality of pixels;

(c) disposing said kernel over a first pixel of said plurality of pixels;

(d) determining the value of the kernel at location of each of said plurality of pixels, storing said value for each of said plurality of pixels so as to define a pixel value for each of said plurality of pixels;

(e) adding a previously stored value associated with a given pixel of said plurality of pixels with said pixel value of the given pixel determined in step (d);

(f) disposing said kernel over another pixel of said plurality of pixels, and repeating steps (d)-(f) until each of said plurality of pixels has been processed; and

(g) determining placement of each of said plurality of pixels in a first pattern or a second pattern based on the pixel value of the given pixel.

2. A method for decomposing a target pattern containing features to be printed on a wafer according to claim 1 , wherein said outer radius corresponds to a pitch value which is less than a minimum pitch for a process to be utilized to image said multiple patterns.

3. A method for decomposing a target pattern containing features to be printed on a wafer according to claim 1 , wherein when disposing said kernel over a given pixel, the center of the kernel is disposed over said given pixel.

4. A method for decomposing a target pattern containing features to be printed on a wafer according to claim 1 , wherein the value associated with each of said plurality of pixels is initially assigned to zero.

5. A method for decomposing a target pattern containing features to be printed on a wafer according to claim 1 , wherein said pixels having a positive value are assigned to said first pattern, and pixels having a negative value are assigned to said second pattern.

6. A method for decomposing a target pattern containing features to be printed on a wafer according to claim 1 , wherein a given feature may be segmented into multiple portions, with a first portion of said segmented feature being assigned to said first pattern and a second portion of said segmented feature being assigned to said second pattern.

7. A non-transitory computer readable storage medium storing a computer program for decomposing a target pattern containing features to be printed on a wafer, into multiple patterns, when executed, causing a computer to perform the steps of:

(a) defining a kernel representing a function having positive values within an inner radius and negative values in an outer radius;

(b) defining said features utilizing a plurality of pixels;

(c) disposing said kernel over a first pixel of said plurality of pixels;

(d) determining the value of the kernel at location of each of said plurality of pixels, storing said value for each of said plurality of pixels so as to define a pixel value for each of said plurality of pixels;

(e) adding a previously stored value associated with a given pixel of said plurality of pixels with said pixel value of the given pixel determined in step (d);

(f) disposing said kernel over another pixel of said plurality of pixels, and repeating steps (d)-(f) until each of said plurality of pixels has been processed; and

(g) determining placement of each of said plurality of pixels in a first pattern or a second pattern based on the pixel value of the given pixel.

8. A non-transitory computer readable storage medium according to claim 7 , wherein said outer radius corresponds to a pitch value which is less than a minimum pitch for a process to be utilized to image said multiple patterns.

9. A non-transitory computer readable storage medium according to claim 7 , wherein when disposing said kernel over a given pixel, the center of the kernel is disposed over said given pixel.

10. A non-transitory computer readable storage medium according to claim 7 , wherein the value associated with each of said plurality of pixels is initially assigned to zero.

11. A non-transitory computer readable storage medium according to claim 7 , wherein said pixels having a positive value are assigned to said first pattern, and pixels having a negative value are assigned to said second pattern.

12. A non-transitory computer readable storage medium according to claim 7 , wherein a given feature may be segmented into multiple portions, with a first portion of said segmented feature being assigned to said first pattern and a second portion of said segmented feature being assigned to said second pattern.

13. A device manufacturing method comprising the steps of:

(a) defining a kernel representing a function having positive values within an inner radius and negative values in an outer radius;

(b) defining features utilizing a plurality of pixels;

(c) disposing said kernel over a first pixel of said plurality of pixels;

(d) determining the value of the kernel at location of each of said plurality of pixels, storing said value for each of said plurality of pixels so as to define a pixel value for each of said plurality of pixels;

(e) adding a previously stored value associated with a given pixel of said plurality of pixels with said pixel value of the given pixel determined in step (d);

(f) disposing said kernel over another pixel of said plurality of pixels, and repeating steps (d)-(f) until each of said plurality of pixels has been processed;

(g) determining placement of each of said plurality of pixels in a first pattern or a second pattern based on the pixel value of the given pixel; and

(h) manufacturing a device using masks corresponding to said first pattern and said second pattern.

14. A device manufacturing method according to claim 13 , wherein said outer radius corresponds to a pitch value which is less than a minimum pitch for a process to be utilized to image said multiple patterns.

15. A device manufacturing method according to claim 13 , wherein when disposing said kernel over a given pixel, the center of the kernel is disposed over said given pixel.

16. A device manufacturing method according to claim 13 , wherein the value associated with each of said plurality of pixels is initially assigned to zero.

17. A device manufacturing method according to claim 13 , wherein said pixels having a positive value are assigned to said first pattern, and pixels having a negative value are assigned to said second pattern.

18. A device manufacturing method according to claim 13 , wherein a given feature may be segmented into multiple portions, with a first portion of said segmented feature being assigned to said first pattern and a second portion of said segmented feature being assigned to said second pattern.

19. A method for generating masks to be utilized in a photolithography process, said method comprising the steps of:

(a) defining a kernel representing a function having positive values within an inner radius and negative values in an outer radius;

(b) defining features utilizing a plurality of pixels;

(c) disposing said kernel over a first pixel of said plurality of pixels;

(d) determining the value of the kernel at location of each of said plurality of pixels, storing said value for each of said plurality of pixels so as to define a pixel value for each of said plurality of pixels;

(e) adding a previously stored value associated with a given pixel of said plurality of pixels with said pixel value of the given pixel determined in step (d);

(f) disposing said kernel over another pixel of said plurality of pixels, and repeating steps (d)-(f) until each of said plurality of pixels has been processed;

(g) determining placement of each of said plurality of pixels in a first pattern or a second pattern based on the pixel value of the given pixel; and

(h) generating a first mask corresponding to said first pattern, and a second mask corresponding to said second pattern.

20. A method for generating masks according to claim 19 , wherein said outer radius corresponds to a pitch value which is less than a minimum pitch for a process to be utilized to image said multiple patterns.

21. A method for generating masks according to claim 19 , wherein when disposing said kernel over a given pixel, the center of the kernel is disposed over said given pixel.

22. A method for generating masks according to claim 19 , wherein the value associated with each of said plurality of pixels is initially assigned to zero.

23. A method for generating masks according to claim 19 , wherein said pixels having a positive value are assigned to said first pattern, and pixels having a negative value are assigned to said second pattern.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 2, 2021
From: TERVELA INC.
To: NETCHARTS-GB, LLC
Reel/Frame 055806/0853 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 7, 2014
From: ASML MASKTOOLS B.V.
To: ASML NETHERLANDS B.V.
Reel/Frame 032170/0425 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 27, 2008
From: PARK, JUNG CHUL
To: ASML MASKTOOLS B.V.
Reel/Frame 020594/0738 →
Continuity (2)
Provisional Application 60844079 · Sep 13, 2006
Related Publication 20080144969A1 · Jun 19, 2008