Patent Assignment
Reel/Frame 032170/0425
Assignment of Assignor's Interest
Recorded: 2014-02-07
Pages: 21
Assignor
ASML MASKTOOLS B.V.
Executed: 2013-12-20
Assignee
ASML NETHERLANDS B.V.
DE RUN 6501, VELDHOVEN, NL-5504 DR, NETHERLANDS
Covered Properties
(105)
Lithographical Mask for Controlling the Dimensions of Resist Patterns
Patent:
5,256,505 →
Application:
07/933,393 →
Mask for Photolithography
Patent:
5,242,770 →
Application:
07/821,793 →
Method for Improved Lithographic Patterning in a Semiconductor Fabrication Process
Patent:
5,340,700 →
Application:
08/149,122 →
Masks for Improved Lithographic Patterning for Off-Axis Illumination Lithography
Patent:
5,447,810 →
Application:
08/194,097 →
Method for Generating Proximity Correction Features for a Lithographic Mask Pattern
Patent:
5,663,893 →
Application:
08/433,730 →
Photolithography Mask Using Serifs and Method Thereof
Patent:
5,707,765 →
Application:
08/654,459 →
Vertex Based Geometry Engine System for Use in Integrated Circuit Design
Patent:
5,887,155 →
Application:
08/687,043 →
Optical Proximity Correction Method for Intermediate-Pitch Features Using Sub-Resolution Scattering Bars on a Mask
Patent:
5,821,014 →
Application:
08/808,587 →
Method of Fine Feature Edge Tuning with Optically-Halftoned Mask
Patent:
6,114,071 →
Application:
09/055,355 →
Method of Patterning Sub-0.25 Lambda Line Features with High Transmission, "Attenuated" Phase Shift Masks
Patent:
6,312,854 →
Application:
09/270,052 →
Method of Patterning Sub-0.25LAMBDA Line Features with High Transmission, "Attenuated" Phase Shift Masks
Hybrid Phase-Shift Mask
Hybrid Phase-Shift Mask
System and method providing optical proximity correction for features using phase-shifted halftone transparent/semi-transparent features
Patent:
6,335,130 →
Application:
09/562,445 →
Optical Proximity Correction
Optical Proximity Correction
Patent:
40,084 →
Application:
11/055,790 →
Optical Proximity Correction Method Utilizing Serifs Having Variable Dimensions
Assist Features for Use in Lithographic Projection
Method and Apparatus for Fast Aerial Image Simulation
Method and Apparatus for Detecting Aberrations in a Projection Lens Utilized for Projection Optics
Method and Apparatus for Detecting Aberrations in an Optical System
Method and Apparatus for Minimizing Optical Proximity Effects
Method of Identifying an Extreme Interaction Pitch Region, Methods of Designing Mask Patterns and Manufacturing Masks, Device Manufacturing Methods and Computer Programs
Method of Identifying an Extreme Interaction Pitch Region, Methods of Designing Mask Patterns and Manufacturing Masks, Device Manufacturing Methods and Computer Programs
Method of Identifying an Extreme Interaction Pitch Region, Methods of Designing Mask Patterns and Manufacturing Masks, Device Manufacturing Methods and Computer Programs
Method and Apparatus for Generating Masks Utilized in Conjunction with Dipole Illumination Techniques
Method for Improved Lithographic Patterning Utilizing Multiple Coherency Optimized Exposures and High Transmission Attenuated Psm
Method for Improved Lithographic Patterning Utilizing Optimized Illumination Conditions and High Transmission Attenuated Psm
Optical Proximity Correction Method Utilizing Phase-Edges as Sub-Resolution Assist Features
Optical Proximity Correction Method Utilizing Phase-Edges as Sub-Resolution Assist Features
Method of Two Dimensional Feature Model Calibration and Optimization
Method of Two Dimensional Feature Model Calibration and Optimization
Method of Removing Assist Features Utilized to Improve Process Latitude
Method and Apparatus for Decomposing Semiconductor Device Patterns into Phase and Chrome Regions for Chromeless Phase Lithography
Method and Apparatus for Decomposing Semiconductor Device Patterns into Phase and Chrome Regions for Chromeless Phase Lithography
Method and Apparatus for Performing Rule-Based Gate Shrink Utilizing Dipole Illumination
Method and Apparatus for Defining Mask Patterns Utilizing a Spatial Frequency Doubling Technique
Orientation Dependent Shielding for Use with Dipole Illumination Techniques
Orientation Dependent Shielding for Use with Dipole Illumination Techniques
Automatic Optical Proximity Correction (Opc) Rule Generation
Method and Apparatus for Providing Lens Aberration Compensation by Illumination Source Optimization
Method and Apparatus for Performing Model-Based Layout Conversion for Use with Dipole Illumination
Method and Apparatus for Performing Model-Based Layout Conversion for Use with Dipole Illumination
Method and Apparatus for Performing Model-Based Layout Conversion for Use with Dipole Illumination
Method of Achieving Cd Linearity Control for Full-Chip Cpl Manufacturing
Method of Achieving Cd Linearity Control for Full-Chip Cpl Manufacturing
Method of Optical Proximity Correction Design for Contact Hole Mask
Method and Apparatus for Providing Optical Proximity Features to a Reticle Pattern for Deep Sub-Wavelength Optical Lithography
Method and Apparatus for Providing Optical Proximity Features to a Reticle Pattern for Deep Sub-Wavelength Optical Lithography
Source and Mask Optimization by Changing Intensity and Shape of the Illumination Source
Scattering Bar Opc Application Method for Sub-Half Wavelength Lithography Patterning
Scattering Bar Opc Application Method for Sub-Half Wavelength Lithography Patterning
Scattering bar OPC application method for sub-half wavelength lithography patterning
Scattering Bar Opc Application Method for Sub-Half Wavelength Lithography Patterning
Method, Program Product and Apparatus for Generating Assist Features Utilizing an Image Field Map
Method, Program Product and Apparatus of Simultaneous Optimization for Na-Sigma Exposure Settings and Scattering Bars Opc Using a Device Layout
Method and Apparatus for Performing Model Based Placement of Phase-Balanced Scattering Bars for Sub-Wavelength Optical Lithography
Feature Optimization Using Enhanced Interference Mapping Lithography
Method for Performing Transmission Tuning of a Mask Pattern to Improve Process Latitude
Eigen Decomposition Based Opc Model
Feature Optimization Using Interference Mapping Lithography
Optimized Polarization Illumination
Optimized Polarization Illumination
Optimized Polarization Illumination
Method of Manufacturing Reliability Checking and Verification for Lithography Process Using a Calibrated Eigen Decomposition Model
Method of Predicting and Minimizing Model Opc Deviation Due to Mix/Match of Exposure Tools Using a Calibrated Eigen Decomposition Model
Method of Predicting and Minimizing Model Opc Deviation Due to Mix/Match of Exposure Tools Using a Calibrated Eigen Decomposition Model
Apparatus, Method and Program Product for Suppressing Waviness of Features to Be Printed Using Photolithographic Systems
Optical Proximity Correction Using Chamfers and Rounding at Corners
Method, Program Product and Apparatus for Model Based Scattering Bar Placement for Enhanced Depth of Focus in Quarter-Wavelength Lithography
Method, Program Product and Apparatus for Model Based Scattering Bar Placement for Enhanced Depth of Focus in Quarter-Wavelength Lithography
Method for Performing Full-Chip Manufacturing Reliability Checking and Correction
Method of Performing Resist Process Calibration/Optimization and Doe Optimization for Providing Ope Matching Between Different Lithography Systems
Method of Performing Resist Process Calibration/Optimization and Doe Optimization for Providing Ope Matching Between Different Lithography Systems
Apparatus, Method and Computer Program Product for Performing a Model Based Optical Proximity Correction Factoring Neighbor Influence
Method, Program Product and Apparatus for Improving Calibration of Resist Models Used in Critical Dimension Calculation
Method, Program Product and Apparatus for Optimizing Illumination for Full-Chip Layer
Method, Program Product and Apparatus for Performing Mask Feature Pitch Decomposition for Use in a Multiple Exposure Process
Method, Program Product and Apparatus for Performing Double Exposure Lithography
Method, Program Product and Apparatus for Performing Double Exposure Lithography
Cpl Mask and a Method and Program Product for Generating the Same
Method and Apparatus for Generating Opc Rules for Placement of Scattering Bar Features Utilizing Interface Mapping Technology
Method of Performing Multiple Stage Model Calibration for Optical Imaging Simulation Models
Method for Decomposition of a Customized Doe for Use with a Single Exposure into a Set of Multiple Exposures Using Standard Does with Optimized Exposure Settings
Method, Program Product and Apparatus for Model Based Geometry Decomposition for Use in a Multiple Exposure Process
Method, Program Product and Apparatus for Model Based Geometry Decomposition for Use in a Multiple Exposure Process
Method, Program Product and Apparatus for Obtaining Short-Range Flare Model Parameters for Lithography Simulation Tool
Method and Apparatus for Performing Dark Field Double Dipole Lithography (Ddl)
Method and Apparatus for Performing Dark Field Double Dipole Lithography (Ddl)
Cpl Mask and a Method and Program Product for Generating the Same
Method, Program Product and Apparatus for Translating Geometrical Design Rules into Boundary Conditions in the Imaging Space So as to Define Test Patterns for Use in Optical Model Calibration
Apparatus and Method for Separating a Circuit Pattern into Multiple Circuit Patterns
Method for Performing Pattern Pitch-Split Decomposition Utilizing Anchoring Features
Method for Performing Pattern Decomposition Based on Feature Pitch
Method and Apparatus for Performing Model-Based Opc for Pattern Decomposed Features
Method and Apparatus for Performing Model-Based Opc for Pattern Decomposed Features
Method, program product and apparatus for modeling resist development of a lithography process
Method, Program Product and Apparatus for Predicting Line Width Roughness and Resist Pattern Failure and the Use Thereof in a Lithography Simulation Process
Method, Program Product and Apparatus for Generating a Calibrated Pupil Kernel and Method of Using the Same in a Lithography Simulation Process
Method, Program Product and Apparatus for Performing Decomposition of a Pattern for Use in a Dpt Process
Method, Program Product and Apparatus for Perfoming Decomposition of a Pattern for Use in a Dpt Process
Method for Performing Pattern Decomposition Based on Feature Pitch
Method and Apparatus for Performing Model-Based OPC for Pattern Decomposed Features
Method and Apparatus for Performing Dark Field Double Dipole Lithography (DDL)
Method for Improved Manufacturability and Patterning of Sub-Wavelength Contact Hole Mask
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignors Interest.
Jan 16, 1992
From: CHEN, JANG F.; MATTHEWS, JAMES A.
To: MICROUNITY SYSTEMS ENGINEERING, INC.
Reel/Frame 005995/0449 →
Assignment of Assignors Interest.
Aug 21, 1992
From: CHEN, JANG F.; MATTHEWS, JAMES A.
To: MICROUNITY SYSTEMS ENGINEERING, INC.
Reel/Frame 006256/0499 →
Assignment of Assignor's Interest
Feb 9, 1994
From: CHEN, JANG F.; MATTHEWS, JAMES A.
To: MICROUNITY SYSTEMS ENGINEERING INC.
Reel/Frame 006872/0842 →
Assignment of Assignor's Interest
May 3, 1995
From: WAMPLER, KURT E.; LAIDIG, THOMAS L.
To: MICROUNITY SYSTEMS ENGINEERING, INC.
Reel/Frame 007516/0013 →
Assignment of Assignor's Interest
Jul 25, 1996
From: LAIDIG, THOMAS
To: MICROUNITY SYSTEMS ENGINEERING, INC.
Reel/Frame 008139/0279 →
Assignment of Assignor's Interest
Feb 28, 1997
From: CHEN, JANG FUNG; WAMPLER, KURT E.; LAIDIG, THOMAS L.
To: MICROUNITY SYSTEMS ENGINEERING, INC.
Reel/Frame 008425/0632 →
Assignment of Assignor's Interest
May 14, 1997
From: CHEN, J. FUNG
To: MICROUNITY SYSTEMS ENGINEERING, INC.
Reel/Frame 008509/0573 →
Assignment of Assignor's Interest
May 12, 1998
From: CHEN, J. FUNG; WAMPLER, KURT E.; LAIDIG, TOM
To: MICROUNITY SYSTEMS ENGINEERING, INC.
Reel/Frame 009172/0764 →
Assignment of Assignor's Interest
Jun 2, 1999
From: CHEN, J. FUNG; CALDWELL, ROGER; LAIDIG, TOM; WAMPLER, KURT E.
To: MICROUNITY SYSTEMS ENGINEERING, INC.
Reel/Frame 010003/0874 →
Assignment of Assignor's Interest
Aug 20, 1999
From: MICROUNITY SYSTEMS ENGINEERING, INC.
To: ASM LITHOGRAPHY HOLDING, N.V.
Reel/Frame 010180/0179 →
Assignment of Assignor's Interest
Jun 28, 2000
From: ASM LITHOGRAPHY HOLDING, N.V.
To: ASML MASKTOOLS NETHERLANDS B.V.
Reel/Frame 010936/0440 →
Assignment of Assignor's Interest
Jun 28, 2000
From: MICROUNITY SYSTEMS ENGINEERING, INC.
To: ASM LITHOGRAPHY HOLDING, N.V.
Reel/Frame 010945/0426 →
Assignment of Assignor's Interest
Aug 11, 2000
From: MICROUNITY SYSTEMS ENGINEERING, INC.
To: ASM LITHOGRAPHY HOLDING, N.V.
Reel/Frame 011120/0593 →
Assignment of Assignor's Interest
Aug 11, 2000
From: MICROUNITY SYSTEMS ENGINEERING, INC.
To: ASM LITHOGRAPHY HOLDING, N.V.
Reel/Frame 011111/0818 →
Assignment of Assignor's Interest
Aug 14, 2000
From: ASM LITHOGRAPHY HOLDING, NV
To: ASML MASKTOOLS NETHERLANDS B.V.
Reel/Frame 011128/0096 →
Assignment of Assignor's Interest
Aug 14, 2000
From: ASM LITHOGRAPHY HOLDING, N.V.
To: ASML MASKTOOLS NETHERLANDS B.V.
Reel/Frame 011128/0170 →
Assignment of Assignor's Interest
Oct 12, 2000
From: CHEN, J. FUNG; PETERSEN, JOHN S.
To: ASML MASKTOOLS NETHERLANDS B.V.
Reel/Frame 011224/0044 →
Assignment of Assignor's Interest
Dec 6, 2000
From: CHEN, J. FUNG
To: ASML MASKTOOLS NETHERLANDS
Reel/Frame 011343/0606 →
Assignment of Assignor's Interest
Aug 14, 2001
From: PETERSEN, JOHN S.; CHEN, JANG FUNG
To: ASML MASKTOOLS NETHERLANDS B.V.
Reel/Frame 012071/0659 →
Assignment of Assignor's Interest
Aug 14, 2001
From: CHEN, JANG FUNG; CALDWELL, ROGER; LAIDIG, THOMAS; WAMPLER, KURT E.
To: ASML MASKTOOLS NETHERLANDS B.V.
Reel/Frame 012071/0694 →
Assignment of Assignor's Interest
Aug 28, 2001
From: LAIDIG, THOMAS; WAMPLER, KURT E.
To: ASML MASKTOOLS NETHERLANDS B.V.
Reel/Frame 012121/0793 →
Assignment of Assignor's Interest
Oct 11, 2001
From: BASELMANS, JOHANNES JACOBUS MATHEUS; SCHLUTER, MARKUS; FLAGELLO, DONIS GEORGE; SOCHA, ROBERT JOHN
To: ASM LITHOGRAPHY B.V.; ASML MASKTOOLS NETHERLANDS B.V.
Reel/Frame 012248/0390 →
Assignment of Assignor's Interest
Nov 30, 2001
From: LIEBCHEN, ARMIN
To: ASML MASKTOOLS NETHERLANDS B.V.
Reel/Frame 012334/0038 →
Corrected Recordation Form Cover Sheet to Correct the Assignee's Address, Previously Recorded at Reel/Frame 12334/0038 (Assignment of Assignor's Interest)
Mar 6, 2002
From: LIEBCHEN, ARMIN
To: ASML MASKTOOLS NETHERLANDS B.V.
Reel/Frame 012636/0897 →
Assignment of Assignor's Interest
Mar 26, 2002
From: CHEN, J. FUNG
To: ASML MASKTOOLS NETHERLANDS B.V.
Reel/Frame 012723/0942 →