Method, program product and apparatus for performing mask feature pitch decomposition for use in a multiple exposure process

1. A computer-implemented method of decomposing a target pattern having features to be imaged on a substrate so as to allow said target pattern features to be imaged in a multi-exposure process, said computer-implemented method comprising the steps of:

identifying one or more factors of a particular lithography process to be utilized to image exposure masks corresponding to said target pattern in the multi-exposure process;

generating, by the computer system, a set of decomposition rules based on said identified factors, wherein each decomposition rule corresponds to one or more predetermined characteristic categories of target pattern features, and wherein said set of decomposition rules collectively defines whether a given target pattern feature will be assigned to a first exposure mask or a second exposure mask according to said target pattern feature's predetermined characteristic category; and

applying said set of decomposition rules to each of said target pattern features so as to assign each of said target pattern features to one of said first exposure mask or said second exposure mask.

2. The method of claim 1 , wherein said decomposition rules designate each feature as being a critical feature or a non-critical feature, said designation being based on the critical dimension of the given feature and the spacing of the given feature to adjacent features.

3. The method of claim 2 , wherein said decomposition rules allow for a given feature to be divided into multiple segments, with said multiple segments be assigned to different exposure masks of said first exposure mask and said second exposure mask.

4. The method of claim 3 , wherein said decomposition rules prioritize treatment of critical features over non-critical features such that the preference is to not segment critical features during the assignment process.

5. A mask formed utilizing the method of claim 1 .

6. The method of claim 1 , wherein said factors comprise illumination system characteristics.

7. The method of claim 1 , wherein said factors comprise lithography process parameters.

8. The method of claim 7 , wherein said lithography process parameters include one or more of wavelength, numerical aperture and type of resist.

9. The method of claim 1 , wherein said characteristic categories include: linear dimension of a feature, shape of a feature, pitch of a feature, mixed pitch range of features in dense and isolated areas, random spacing width between adjacent features, adjacent features with critical spacing therebetween but having different critical dimensions, and junctions of a feature.

10. A computer program product for controlling a computer comprising a storage device readable by the computer, means recorded on the storage device for directing the computer to decompose a target pattern having features to be imaged on a substrate so as to allow said target pattern features to be imaged in a multi-exposure process, the process comprising the steps of:

identifying one or more factors of a particular lithography process to be utilized to image exposure masks corresponding to said target pattern in the multi-exposure process;

generating a set of decomposition rules based on said identified factors, wherein each decomposition rule corresponds to one or more predetermined characteristic categories of target pattern features, and wherein said set of decomposition rules collectively defines whether a given target pattern feature will be assigned to a first exposure mask or a second exposure mask according to said target pattern feature's predetermined characteristic category; and

applying said set of decomposition rules to each of said target pattern features so as to assign each of said target pattern features to one of said first exposure mask or said second exposure mask.

11. The computer program product of claim 10 , wherein said decomposition rules designate each feature as being a critical feature or a non-critical feature, said designation being based on the critical dimension of the given feature and the spacing of the given feature to adjacent features.

12. The computer program product of claim 11 , wherein said decomposition rules allow for a given feature to be divided into multiple segments, with said multiple segments be assigned to different exposure masks of said first exposure mask and said second exposure mask.

13. The computer program product of claim 12 , wherein said decomposition rules prioritize treatment of critical features over non-critical features such that the preference is to not segment critical features during the assignment process.

14. A computer-implemented method for forming exposure masks for imaging a target pattern having features to be imaged on a substrate in a multi-exposure process, said method comprising the steps of:

identifying one or more factors of a particular lithography process to be utilized to image said exposure masks corresponding to said target pattern in the multi-exposure process;

generating, by the computer system, a set of decomposition rules based on said identified factors, wherein each decomposition rule corresponds to one or more predetermined characteristic categories of target pattern features, and wherein said set of decomposition rules collectively defines whether a given target pattern feature will be assigned to a first exposure mask or a second exposure mask according to said target pattern feature's predetermined characteristic category;

applying said set of decomposition rules to each of said target pattern features so as to assign each of said target pattern features to one of said first exposure mask or said second exposure mask; and

generating said first exposure mask and said second exposure mask containing the respective target pattern features assigned to each exposure mask.

15. The method of claim 14 , wherein said decomposition rules designate each feature as being a critical feature or a non-critical feature, said designation being based on the critical dimension of the given feature and the spacing of the given feature to adjacent features.

16. The method of claim 15 , wherein said decomposition rules allow for a given feature to be divided into multiple segments, with said multiple segments be assigned to different exposure masks of said first exposure mask and said second exposure mask.

17. The method of claim 16 , wherein said decomposition rules prioritize treatment of critical features over non-critical features such that the preference is to not segment critical features during the assignment process.

18. The method of claim 14 , further comprising the step of performing optical proximity correction treatment to said first exposure mask and said second exposure mask.

19. A mask formed utilizing the method of claim 14 .