IP Library › Granted Patent US 7,971,167
Granted Patent B2
US 7,971,167 · App. 12/032,117 · Granted Jun 28, 2011

Semiconductor design support device, semiconductor design support method, and manufacturing method for semiconductor integrated circuit

Assignee: Ricoh Company, Ltd.
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Quick Facts
Patent No.
US 7,971,167
App. No.
12/032,117
Granted
Jun 28, 2011
Kind
B2
Abstract

A semiconductor design support device for designing a semiconductor integrated circuit includes a behavioral description, an RTL description, and a latency analyzer. The behavioral description describes an algorithm of processing performed by hardware in a motion level. The RTL description is generated by reading the behavioral description and recognizes a concept including register and clock synchronism peculiar to the hardware. The latency analyzer analyzes a result of a logic simulation performed on the RTL description to calculate a latency in each block representing an operation in a predetermined unit in the behavioral description.

Claims (19)

1. A semiconductor design support device for designing a semiconductor integrated circuit, the device comprising:

a behavioral description configured to describe an algorithm of processing performed by hardware in a motion level;

an RTL description generated by reading the behavioral description, the RTL description configured to recognize a concept including register and clock synchronism particular to the hardware;

a latency analyzer configured to analyze a result of a logic simulation performed on the RTL description to calculate a latency in each block representing an operation in a predetermined unit in the behavioral description;

a correspondence table in which each block in the behavioral description corresponds to a state in the RTL description; and

a correspondence table generator configured to generate the correspondence table.

2. The semiconductor design support device according to claim 1 ,

wherein the latency analyzer refers to the result of the logic simulation and the correspondence table generated by the correspondence table generator to calculate the latency in each block in the behavioral description.

3. A manufacturing method for manufacturing a semiconductor integrated circuit, the method comprising:

describing an algorithm of processing performed by hardware in a motion level to generate a behavioral description;

reading the behavioral description to generate an RTL description for recognizing a concept including register and clock synchronism particular to the hardware;

analyzing a result of a logic simulation performed on the RTL description to calculate a latency in each block representing an operation in a predetermined unit in the behavioral description;

designing a circuit based on the calculated latency;

creating a layout of the circuit;

generating a photomask based on the layout of the circuit;

transferring a pattern of the photomask onto a semiconductor wafer; and

generating a correspondence table in which each block in the behavioral description corresponds to a state in the RTL description.

4. The manufacturing method according to claim 3 , further comprising:

referring to the result of the logic simulation and the correspondence table to calculate the latency in each block in the behavioral description.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 31, 2023
From: RICOH COMPANY, LTD.
To: SEMICONDUCTOR DESIGN TECHNOLOGIES LLC
Reel/Frame 062552/0702 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 15, 2008
From: TSUKAMOTO, YASUTAKA
To: RICOH COMPANY, LTD.
Reel/Frame 020517/0185 →
Priority Claims (1)
JP 2007-038603 · Feb 19, 2007 · national
Continuity (1)
Related Publication 20080201673A1 · Aug 21, 2008