IP Library Granted Patent US 8,008,993
Granted Patent B2
US 8,008,993 · App. 12/088,721 · Granted Aug 30, 2011

Thin-film bulk-acoustic wave (BAW) resonators

Assignee: NXP B.V.
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,008,993
App. No.
12/088,721
Filed
Aug 15, 2008
Granted
Aug 30, 2011
Kind
B2
Art Unit
2817
USPC
333/187
Abstract

A thin-film bulk acoustic wave (BAW) resonator, such as SBAR or FBAR, for use in RF selectivity filters operating at frequencies of the order of 1 GHz. The BAW resonator comprises a piezoelectric layer ( 14 ) having first and second surfaces on opposing sides, a first electrode ( 16 ) extending over the first surface, and a second electrode ( 12 ) extending over the second surface, the extent of the area of overlap (R 1 ) of the first and second electrodes determining the region of excitation of the fundamental thickness extensional (TE) mode of the resonator. The insertion loss to the resonator is reduced by providing a dielectric material ( 18 ) in the same layer as the first electrode ( 16 ) and surrounding that electrode. The material constituting the dielectric material ( 18 ) has a different mass, typically between 5% and 15%, from the material comprising the first electrode ( 16 ) it surrounds. The mass of the dielectric material ( 18 ) can be lower or higher than the mass of the first electrode ( 16 ). Planarisation of the dielectric material ( 18 ) enhances the performance of the device.

Claims (16)

1. A bulk acoustic wave (BAW) resonator comprising first and second layers and an intervening piezoelectric layer, the first and second layers comprising respective first and second overlapping regions of metal for use as electrodes, the first layer further comprising a region of dielectric material external to the region of the overlap and at least partially surrounding the first metal region, wherein the dielectric material has a mass different from the mass of the first metal region;

characterised in that the difference in mass of the dielectric material and the first metal region is between about 5% and about 15% and characterised in that the mass of the dielectric material is less than the mass of the first metal region.

2. A BAW resonator as claimed in claim 1 , characterised in that the first metal region comprises platinum and the dielectric material comprises tantalum pentoxide.

3. A BAW resonator as claimed in claim 1 , characterised in that the first metal region comprises molybdenum and the dielectric material comprises silicon dioxide.

4. A BAW resonator as claimed in claim 1 , characterised in that the dielectric material has the same thickness as the first metal region.

5. A BAW resonator as claimed in claim 1 , characterised in that the second layer comprises a region of dielectric material external to the region of overlap and at least partially surrounding the second metal region.

6. A BAW resonator as claimed in claim 1 , wherein the region of dielectric material is spaced from the first metal region.

7. A BAW resonator as claimed in claim 1 , characterised in that the resonator comprises a Solidly-mounted-Bulk-Acoustic wave-Resonator.

8. A BAW resonator as claimed in claim 1 , characterised in that the resonator comprises a Film-Bulk-Acoustic-wave-Resonator.

9. A filter comprising a plurality of BAW resonators as claimed in claim 1 .

10. A radio frequency apparatus including a filter comprising a plurality of BAW resonators as claimed in claim 1 .

11. A BAW resonator as claimed in claim 1 , wherein the difference in mass is selected in order to avoid overlap between a passband of the first metal region and a radiation band of the region of the dielectric material.

12. A method of reducing insertion loss in the passband of a filter comprising a plurality of bulk acoustic wave (BAW) resonators, each of the BAW resonators comprising first and second layers and an intervening piezoelectric layer, the first and second layers comprising respective first and second overlapping regions of metal for use as electrodes, the method comprising forming in the first layer a region of dielectric material external to the region of the overlap and at least partially surrounding the first metal region, wherein the dielectric material has a mass different from the mass of the first metal region;

characterised in that the difference in mass of the dielectric material and the first metal region is between about 5% and about 15% and characterised in that the mass of the dielectric material is less than the mass of the first metal region.

13. A method as claimed in claim 12 , characterised by forming the dielectric material to have the same thickness as the first metal region.

14. A method as claimed in claim 12 , wherein the difference in mass is selected in order to avoid overlap between a passband of the first metal region and a radiation band of the region of the dielectric material.

Assignments (13)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
PATENT RELEASE Recorded Aug 17, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 039707/0471 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12092129 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
MERGER Recorded Jun 16, 2016
From: TRIQUINT SEMICONDUCTOR, INC.
To: QORVO US, INC.
Reel/Frame 039050/0193 →
SECURITY AGREEMENT SUPPLEMENT Recorded Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 038017/0058 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 4, 2011
From: NXP B.V.
To: TRIQUINT SEMICONDUCTOR, INC.
Reel/Frame 026703/0713 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 15, 2008
From: MILSOM, ROBERT FREDERICK; VANHELMONT, FREDERIK WILLEM MAURITS; JANSMAN, ANDREAS BERNARDUS MARIA; RUIGROK, JAAP; LOEBL, HANS-PETER
To: NXP B.V.
Reel/Frame 021394/0907 →
Priority Claims (1)
EP 05109109 · Sep 30, 2005 · regional
Continuity (1)
Related Publication 20090153268A1 · Jun 18, 2009