Patent Assignment
Reel/Frame 026703/0713
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded: 2011-08-04
Received: 2011-08-04
Pages: 8
Assignor
NXP B.V.
Executed: 2011-07-01
Assignee
TRIQUINT SEMICONDUCTOR, INC.
2300 NE BROOKWOOD PARKWAY, HILLSBORO, OR, 97124, UNITED STATES
Covered Applications
(23)
BULK ACOUSTIC WAVE RESONATOR
App. No. 12/989,488
→
BULK ACOUSTIC WAVE RESONATOR DEVICE
App. No. 11/915,702
→
THIN FILM ACOUSTIC REFLECTOR STACK
App. No. 11/721,972
→
THIN-FILM BULK-ACOUSTIC WAVE (BAW) RESONATORS
App. No. 12/088,721
→
RESONATOR STRUCTURE AND METHOD OF PRODUCING IT
App. No. 10/574,684
→
LADDER-TYPE THIN-FILM BULK ACOUSTIC WAVE FILTER
App. No. 10/574,434
→
ELECTRO-ACOUSTIC RESONATOR WITH A TOP ELECTRODE LAYER THINNER THAN A BOTTOM ELECTRODE LAYER
App. No. 10/538,110
→
RESONATOR FILTER STRUCTURE HAVING EQUAL RESONANCE FREQUENCIES
App. No. 10/542,834
→
DUPLEXER AND METHOD OF ISOLATING AN RX-BAND AND A TX-BAND
App. No. 10/535,055
→
Bulk acoustic wave resonator with means for suppression of pass-band ripple in bulk acoustic wave filters
App. No. 10/527,115
→
HIGH FREQUENCY MODULE
App. No. 10/523,429
→
BULK WAVE RESONATOR AND BULK WAVE FILTER
App. No. 10/514,588
→
FILTER STRUCTURE
App. No. 10/514,587
→
FILTER SYSTEM COMPRISING A BULK ACOUSTIC WAVE RESONATOR
App. No. 10/486,451
→
FILTER SYSTEM WITH BULK WAVE RESONATOR HAVING A REFLECTINO LAYER COMPOSITION THAT VARIES WITH THE LAYER THICKNESS
App. No. 10/486,452
→
ELECTRONIC DEVICE HAVING AN ELECTRONIC COMPONENT WITH A MULTI-LAYER COVER, AND METHOD
App. No. 10/169,498
→
ARRANGEMENT WITH TWO PIEZOELECTRIC LAYERS, AND METHOD OF OPERATING A FILTER DEVICE
App. No. 10/128,815
→
BULK ACOUSTIC WAVE DEVICE
App. No. 09/884,218
→
BULK ACOUSTIC WAVE FILTER WITH OPTIMIZED SERIES AND SHUNT RESONATOR STATIC CAPACITANCES
App. No. 09/882,086
→
TUNABLE PIEZOELCTRIC FILTER ARRANGEMENT USING A DIELECRIC MATERIAL WITH A VOLTAGE-DEPENDENT DIELECTRIC CONSTANT
App. No. 09/826,699
→
TUNABLE FILTER ARRANGEMENT COMPRISING RESONATORS WITH REFLECTION LAYERSI
App. No. 09/826,684
→
METHOD OF MANUFACTURING A PIEZOELECTRIC FILTER WITH AN ACOUSTIC RESONATOR SITUATED ON AN ACOUSTIC REFLECTOR LAYER FORMED BY A CARRIER SUBSTRATE
App. No. 09/790,298
→
METHOD OF MANUFACTURING A HYBRID INTEGRATED CIRCUIT COMPRISING A SEMICONDUCTOR ELEMENT AND A PIEZOELECTRIC FILTER
App. No. 09/790,346
→