IP Library Granted Patent US 8,058,768
Granted Patent B2
US 8,058,768 · App. 11/915,702 · Granted Nov 15, 2011

Bulk acoustic wave resonator device

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Quick Facts
Patent No.
US 8,058,768
App. No.
11/915,702
Granted
Nov 15, 2011
Kind
B2
Abstract

A bulk acoustic wave, BAW, resonator device comprising first and second metal layers ( 10, 20 ) and an intervening piezoelectric layer ( 30 ), the first metal layer ( 10 ) comprising spaced first and second portions ( 12, 14 ), wherein the first and second portions ( 12, 14 ) are each arranged as a plurality of interconnected fingers ( 16, 18 ), and wherein each of the plurality of fingers ( 16 ) of the first portion ( 12 ) is acoustically coupled to at least one of the fingers ( 18 ) of the second portion ( 14 ). In one embodiment the fingers of the first portion ( 12 ) are interlaced with the fingers ( 18 ) of the second portion ( 14 ), thereby providing direct coupling. In another embodiment the acoustic coupling between the fingers of the first and second portions is provided indirectly by further portions ( 15 ) of the first metal layer ( 10 ).

Claims (16)

1. A bulk acoustic wave, BAW, resonator device comprising first and second metal layers and an intervening piezoelectric layer, the first metal layer comprising spaced first and second portions, wherein the first and second portions are each arranged as a plurality of interconnected fingers, and wherein each of the plurality of fingers of the first portion is acoustically coupled to at least one of the fingers of the second portion, and the second metal layer comprises spaced third and fourth portions, wherein the third and fourth portions are each arranged as a plurality of interconnected fingers, wherein the fingers of the third portion are arranged opposed to the fingers of the first portion and the fingers of the fourth portion are arranged opposed to the fingers of the second portion, wherein the first metal layer comprises a first plurality of further portions arranged to provide acoustic coupling between the fingers of the first portion and the fingers of the second portion, the second metal layer comprises a second plurality of further portions arranged to provide acoustic coupling between the fingers of the third portion and the fingers of the fourth portion, and wherein the first portion is coupled to an input port and the second portion is coupled to an output port.

2. A BAW resonator device as claimed in claim 1 , further comprising a third metal layer located within the piezoelectric layer.

3. A BAW resonator device as claimed in claim 2 , wherein the third metal layer comprises a fifth portion and a sixth portion, wherein the fifth portion is rectangular in shape and substantially encompasses the area of the fingers of the first portion with additional finger portions corresponding to the further portion and wherein the sixth portion is substantially the same shape as the second portion.

4. A BAW resonator device as claimed in claim 1 , wherein the first and second portions of the first metal layer and the first further portions are spaced apart by gaps comprising dielectric material.

5. A BAW resonator device as claimed in claim 1 , wherein the third and the fourth portions of the second metal layer and the second further portions are spaced apart by gaps comprising dielectric material.

6. A BAW resonator device as claimed in claim 1 , wherein the second metal layer is arranged on a reflector and the reflector is arranged on a substrate.

7. A BAW resonator device as claimed in claim 1 , wherein at least one of the fingers comprises a longitudinal slot.

8. A BAW resonator device as claimed in claim 1 , further comprising one or more of:

at least some of the fingers of the first portion are of unequal length and/or at least some of the fingers of the second portion are of unequal length;

the length of at least some of the fingers of the first portion and the length of at least some of the fingers of the second portion are unequal;

at least some of the fingers of the first portion are of unequal width and/or at least some of the fingers of the second portion are of unequal width;

the width of at least some of the fingers of the first portion and the width of at least some of the fingers of the second portion are unequal;

the gaps between at least some of the fingers of the first portion are of unequal width and/or the gaps between at least some of the fingers of the second portion are of unequal width.

9. A filter comprising a BAW resonator device as claimed in claim 1 .

10. An electronic apparatus comprising a BAW resonator device as claimed claim 1 .

11. A BAW resonator device as claimed in claim 6 , wherein the reflector is a Bragg reflector.

Assignments (13)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
PATENT RELEASE Recorded Aug 17, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 039707/0471 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12092129 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
MERGER Recorded Jun 16, 2016
From: TRIQUINT SEMICONDUCTOR, INC.
To: QORVO US, INC.
Reel/Frame 039050/0193 →
SECURITY AGREEMENT SUPPLEMENT Recorded Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 038017/0058 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 4, 2011
From: NXP B.V.
To: TRIQUINT SEMICONDUCTOR, INC.
Reel/Frame 026703/0713 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 16, 2008
From: MILSOM, ROBERT F; VANHELMONT, FREDERIK W M; JANSMAN, ANDREAS B M; RUIGROK, JAAP; LOEBL, FILIPPO
To: NXP B.V.
Reel/Frame 020814/0289 →