Lead frame for semiconductor device
View Patent ↗A lead frame for reducing detrimental effects of burr formation includes a lead frame that has leads where a portion of a top surface is removed from a first lead and a portion of a bottom surface is removed from a second lead adjacent to the first lead to reduce spacing between leads while reducing the detrimental effects of burr formation, such as shorting and the like, caused during singulation of a semiconductor device manufactured with the lead frame.
1. A lead frame for supporting a semiconductor die within a semiconductor package device, the lead frame comprising:
a die bond area for receiving a semiconductor die; and
a plurality of leads arranged around and spaced apart from the die bond area for being electrically interconnected with the semiconductor die and for providing electrical interconnection for the semiconductor package device, the leads having a top surface and a bottom surface, wherein a first lead in the plurality of leads has a recessed portion from the top surface, and a second lead adjacent to the first lead has a recessed portion from the bottom surface for reducing burr formation effects;
wherein the first lead and the second lead are adjacent and are separated by a first distance, and the first lead and a third lead adjacent to the second lead are separated by a second distance, wherein the second distance extends beyond a zone of potential burr formation from the first lead.
2. The lead frame of claim 1 , wherein the plurality of leads are arranged in a single row around the perimeter of the die bond area.
3. The lead frame of claim 1 , wherein the plurality of leads comprise a plurality of first leads with the recessed portion from the top surface that form a first row, and a plurality of second leads with a recessed portion from the bottom surface that form a second row.
4. A semiconductor package device, comprising:
a semiconductor die;
a lead frame for supporting the semiconductor die; and
a semiconductor package body at least partially encapsulating the semiconductor die;
the lead frame comprising:
a die bond area for receiving the semiconductor die;
a plurality of leads arranged around and spaced apart from the die bond area for being electrically interconnected with the semiconductor die and for providing electrical interconnection for the semiconductor package device, the leads having a top surface and a bottom surface, wherein a first lead in the plurality of leads has a recessed portion from the top surface, and a second lead adjacent to the first lead has a recessed portion from the bottom surface for reducing burr formation effects, wherein a surface of the recessed portions of the first and second leads are exposed on a surface of the semiconductor package body,
wherein the first lead and the second lead are adjacent and are separated by a first distance, and the first lead and a third lead adjacent to the second lead are separated by a second distance, wherein the second distance extends beyond a zone of potential burr formation from the first lead; and
wherein the semiconductor die has first and second surfaces, the first surface attached on the die bond area of the lead frame and the second surface electrically interconnected with at least one lead of the plurality of leads.
5. The semiconductor package device of claim 4 , wherein the plurality of leads of the lead frame are arranged in a single row around the perimeter of the die bond area.
6. The semiconductor package device of claim 4 , wherein the plurality of leads of the lead frame comprise a plurality of first leads with a recessed portion from the top surface that form a first row exposed on a surface of the semiconductor package body, and a plurality of second leads with a recessed portion from the bottom surface that form a second row exposed on a surface of the semiconductor package body.
7. A method of forming a lead frame for a semiconductor package device, comprising:
providing a lead frame having a die bond area for receiving a semiconductor die and a plurality of leads arranged around and spaced apart from the die bond area for being electrically interconnected with the semiconductor die and for providing electrical interconnection for the semiconductor package device, the leads having a top surface and a bottom surface;
removing a portion from the top surface of a first lead in the plurality of leads to form a recessed portion; and
removing a portion from the bottom surface of a second lead that is adjacent to the first lead to form a recessed;
wherein the first lead and the second lead are adjacent and are separated by a first distance, and the first lead and a third lead adjacent to the second lead are separated by a second distance, wherein the second distance extends beyond a zone of potential burr formation from the first lead.
8. The method of claim 7 , further comprising:
attaching a semiconductor die to the die bond area of the lead frame; and
electrically connecting the semiconductor die with a lead of the lead frame, and encapsulating the die and the lead frame, thereby forming a semiconductor package device.