Electrical through contact

1. A method of fabricating an electrical contact, the method comprising:

providing a first substrate comprising at least one contact pad on any of a first surface and of a second surface;

providing at least one second substrate comprising at least one through hole from a first surface to a second surface;

stacking the second substrate on the first substrate, such that the through hole of the second substrate at least overlaps with the contact pad of the first substrate;

applying a first ambient low pressure to the through hole;

providing a liquid conductive material to the through hole;

applying a second ambient pressure to the liquid conductive material until the through hole is at least partly filled with the liquid conductive material; and

taking the stack of substrates off the liquid conductive material.

2. The method as claimed in claim 1 , the providing of the through hole comprising:

a providing of a blind hole on the first surface of the second substrate; and

a flattening of the second substrate from the second surface, the second surface being an opposite surface to the first surface.

3. The method as claimed in claim 1 , the first low pressure being below atmospheric pressure and the second pressure being increased to atmospheric pressure.

4. The method as claimed in claim 1 , the first low pressure being below atmospheric pressure and the second pressure being increased to a pressure being in the range of 1 bar to 5 bar.

5. The method as claimed in claim 1 , first low pressure being at atmospheric pressure and the second pressure being increased to a pressure being in the range of 1 bar to 5 bar.

6. The method as claimed in claim 1 , the stack of substrates being heated prior to applying the liquid conductive material.

7. The method as claimed in claim 1 , the method comprising a providing of a passivating coating on an inner wall of the through hole.

8. The method as claimed in claim 1 , the providing of the first substrate comprising a providing of a blind hole in the first substrate in an area of the contact pad.

9. The method as claimed in claim 8 , the increasing the second pressure being such that the through hole and the blind hole in the first substrate are at least in part filled by the liquid conductive material.

10. The method as claimed in claim 8 , the method comprising a providing of a passivating coating on an inner wall of the blind hole of the first substrate.

11. The method as claimed in claim 8 , the method comprising a providing of a passivating coating on a bottom side of the second substrate.

12. The method as claimed in claim 1 , a ball comprising the conductive material being formed on the top second substrate in an area of the through contact after the solidifying of the liquid conductive material.

13. The method as claimed in claim 1 , the conductive material comprising a soldering metal.

14. A method of fabricating an electrical contact, the method comprising:

providing a first substrate comprising at least one contact pad;

providing at least one second substrate comprising at least one blind hole on a first surface of the second substrate;

applying a first ambient low pressure in the blind hole;

providing a liquid conductive material to the blind hole;

applying a second ambient pressure acting to the liquid conductive material, such that the blind hole is at least partly filled with the liquid conductive material;

taking the second substrate off the liquid conductive material;

flattening the second substrate from a second surface, the second surface being an opposite surface to the first surface, such that the blind hole is opened and a through contact through the second substrate is provided; and

stacking the first substrate and the at least one second substrate, such that the through contact of the second substrate overlaps with the contact pad of the first substrate, such, that the electrical contact is provided to the through contact.

15. The method as claimed in claim 14 , the method comprising after stacking the substrates a heating of the stack of substrates and a providing of an electrical connection from the through contact to the contact pad.

16. The method as claimed in claim 14 , the first low pressure being below atmospheric pressure and the second pressure being increased to atmospheric pressure.

17. The method as claimed in claim 14 , the first low pressure being below atmospheric pressure and the second pressure being increased to a pressure being in the range of 1 bar to 5 bar.

18. The method as claimed in claim 14 , the first low pressure being at atmospheric pressure and the second pressure being increased to a pressure being in the range of 1 bar to 5 bar.

19. The method as claimed in claim 14 , the second substrate being heated to the temperature of the liquid conductive material.

20. The method as claimed in claim 14 , the method comprising a providing of a passivating coating on an inner wall of the blind hole.

21. The method as claimed in claim 14 , the providing of the first substrate comprising a providing of a blind hole in the first substrate in an area of the contact pad.

22. The method as claimed in claim 21 , the providing of the first substrate comprising an at least in part filling of the blind hole with the conductive material.

23. The method as claimed in claim 21 , the method comprising a providing of a passivating coating on an inner wall of the blind hole of the first substrate.

24. The method as claimed in claim 14 , the method comprising a providing of a passivating coating on a bottom side of the second substrate.

25. The method as claimed in claim 14 , a ball comprising the conductive material being formed on the top second substrate in an area of the through contact after the solidifying of the liquid conductive material.

26. The method as claimed in claim 14 , the conductive material comprising a soldering metal.

27. A method of fabricating an electrical contact, the method comprising:

providing a first substrate comprising a through hole and a contact pad, the contact pad being arranged on a surface of the first substrate in an area of an aperture of the through hole;

providing at least one second substrate comprising a through hole and a contact pad, the contact pad being arranged on a surface of the second substrate in an area of an aperture of the through hole;

stacking the second substrate on top of the first substrate, such that the aperture of the through hole of the first substrate at least in part overlaps with the aperture of the through hole of the second substrate;

providing a liquid conductive material adjacent to an exposed surface of the first substrate; and

applying a first ambient pressure to the through hole and a second ambient pressure to the liquid conductive material, such that the through hole of the first substrate and the second substrate are filled with the liquid conductive material.

28. The method as claimed in claim 27 , the first pressure being below atmospheric pressure and the second pressure of the liquid conductive material being increased to atmospheric pressure.

29. The method as claimed in claim 27 , the first pressure being below atmospheric pressure and the second pressure being increased to a pressure in a range of 1 bar to 5 bar.

30. The method as claimed in claim 27 , the first pressure being at atmospheric pressure and the second pressure being increased to a pressure in a range of 1 bar to 5 bar.

31. The method as claimed in claim 27 , the stack of substrates being heated prior to the providing a liquid conductive material adjacent to an exposed surface of the first substrate.

32. The method as claimed in claim 27 , the method comprising a providing of a passivating coating on an inner wall of the through holes.

33. The method as claimed in claim 27 , the method comprising a providing of a passivating coating on a bottom side of the second substrate.

34. The method as claimed in claim 27 , a ball comprising the conductive material being formed on the top second substrate in an area of the aperture of the through hole after solidifying the liquid conductive material.

35. The method as claimed in claim 27 , the conductive material comprising a soldering metal.

36. A method of fabricating an electrical contact, the method comprising:

providing a first substrate comprising a through hole and a contact pad, the contact pad being arranged on a surface of the first substrate in an area of an aperture of the through hole;

providing at least one second substrate comprising a through hole and a contact pad, the contact pad being arranged on a surface of the second substrate in an area of an aperture of the through hole;

stacking the second substrate on top of the first substrate, such that the aperture of the through hole of the first substrate at least in part overlaps with the aperture of the through hole of the second substrate;

providing a bath of a liquid conductive material; and

applying the stack of substrates to the bath of the liquid conductive material and applying a first ambient pressure to the through hole and a second ambient pressure to the liquid conductive material, such that the through holes of the first substrate and the second substrate are filled with the liquid conductive material.

37. The method as claimed in claim 36 , the stack of substrates being heated prior to the providing a liquid conductive material adjacent to an exposed surface of the first substrate.

38. The method as claimed in claim 36 , the method comprising a providing of a passivating coating on an inner wall of the through holes.

39. The method as claimed in claim 36 , the method comprising a providing of a passivating coating on a bottom side of the second substrate.

40. The method as claimed in claim 36 , a ball comprising the conductive material being formed on the top second substrate in an area of the aperture of the through hole after solidifying the liquid conductive material.

41. The method as claimed in claim 36 , the conductive material comprising a soldering metal.