IP Library › Granted Patent US 8,124,536
Granted Patent B2
US 8,124,536 · App. 11/946,289 · Granted Feb 28, 2012

Manufacturing method of capacitor electrode, manufacturing system of capacitor electrode, and storage medium

Assignee: Tokyo Electron Limited
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Quick Facts
Patent No.
US 8,124,536
App. No.
11/946,289
Granted
Feb 28, 2012
Kind
B2
Abstract

A method for manufacturing a capacitor electrode by removing a silicon oxide film on a surface of a substrate, including: transforming the silicon oxide film into a reaction product by supplying a gas containing a halogen element to chemically react with the silicon oxide film while controlling temperature of the substrate to a first process temperature; and removing the silicon oxide film transformed to the reaction product while controlling the temperature of the substrate to a second process temperature higher than the first process temperature. The silicon oxide film is a BPSG film.

Claims (15)

1. A method for manufacturing a capacitor electrode comprising:

forming a silicon oxide film on a surface of a substrate;

etching a hole in the silicon oxide film,

depositing metal in the hole in the silicon oxide film to form the capacitor electrode;

removing the silicon oxide film surrounding the capacitor electrode by,

transforming the silicon oxide film into a reaction product by supplying a gas containing a halogen element to chemically react with the silicon oxide film while controlling temperature of the substrate to a first process temperature, and

removing the reaction product while controlling the temperature of the substrate to a second process temperature higher than the first process temperature,

wherein while removing the reaction product by heating, an alkaline gas is supplied.

2. The method of claim 1 , wherein the silicon oxide film is a BPSG film.

3. The method of claim 1 , wherein the capacitor electrode has a cylindrical shape.

4. The method of claim 1 , wherein the gas containing a halogen element is a gas containing HF.

5. The method of claim 1 , wherein the transforming the silicon oxide film to the reaction product is performed under a depressurized atmosphere.

6. The method of claim 1 , wherein the removing the reaction product by heating is performed under the depressurized atmosphere.

7. The method of claim 1 , wherein the alkaline gas is ammonia gas.

8. The method of claim 1 , wherein the reaction product is mainly formed of fluorosilicic acid (H 2 SiF 6 ).

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 28, 2007
From: NISHIMURA, EIICHI
To: TOKYO ELECTRON LIMITED
Reel/Frame 020169/0865 →
Priority Claims (1)
JP 2006-321680 · Nov 29, 2006 · national
Continuity (2)
Provisional Application 60883289 · Jan 3, 2007
Related Publication 20080124936A1 · May 29, 2008