Semiconductor device and method for manufacturing the same
A semiconductor device includes a substrate, a low dielectric constant layer formed on the substrate, a first protection insulating layer formed on the low dielectric constant layer, and a trench with an interconnect embedded in formed in the first protection insulating layer and the low dielectric constant layer. The sidewall of the trench has a structure that the surface of the first protection insulating layer protrudes from the surface of the low dielectric constant layer, a second protection insulating layer formed by a chemical vapor deposition technique is embedded at the surface of the low dielectric constant layer in an area below the first protection insulating layer, and the sidewall of the trench is constituted by the second protection insulating layer and the first protection insulating layer.
1. A semiconductor device, comprising:
a substrate;
a low dielectric constant layer formed on said substrate and containing carbon;
a first protection insulating layer formed on said low dielectric constant layer;
a trench formed in said first protection insulating layer and said low dielectric constant layer; and
an interconnect embedded in said trench,
wherein the sidewall of said trench has a structure that the surface of said first protection insulating layer protrudes from the surface of said low dielectric constant layer, a second protection insulating layer formed by a chemical vapor deposition technique is embedded at the surface of said low dielectric constant layer in an area below said first protection insulating layer, and said second protection insulating layer and said first protection insulating layer are exposed at the sidewall of said trench.
2. The semiconductor device according to claim 1 ,
wherein said low dielectric constant layer is a SiOC layer or a SiOCH layer.
3. The semiconductor device according to claim 1 ,
wherein said second protection insulating layer is made of the same material as said low dielectric constant layer.
4. The semiconductor device according to claim 1 , wherein said second protection insulating layer is a SiO 2 layer, a SiOF layer, a SiOH layer, a SiOC layer, or a SiOCH layer.
5. The semiconductor device according to claim 1 , wherein said first protection insulating layer is a SiO 2 layer.