IP Library Granted Patent US 8,187,924
Granted Patent B2
US 8,187,924 · App. 12/826,235 · Granted May 29, 2012

Method, design program and design support device for semiconductor integrated circuit, and semiconductor integrated circuit

Assignee: Renesas Electronics Corporation
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Quick Facts
Patent No.
US 8,187,924
App. No.
12/826,235
Granted
May 29, 2012
Kind
B2
Abstract

A design method for a semiconductor integrated circuit, includes: a first calculating step; a second calculating step; and a setting step. The first step is a step of calculating a consumption current amount of a layout target circuit based on circuit information. The second calculating step is a step of calculating a suppliable current amount per unit area in a region where a power can be supplied from a power wiring line. The setting step is a step of setting a cell size of the layout target circuit based on the consumption current amount so that a consumption current amount per unit area of the layout target circuit is smaller than the suppliable current amount per unit area.

Claims (81)

1. A design method for a semiconductor integrated circuit, comprising:

calculating a consumption current amount of a layout target circuit based on circuit information;

calculating a suppliable current amount per unit area in a region where a power can be supplied from a power wiring line;

setting a cell size of said layout target circuit based on said consumption current amount so that a consumption current amount per unit area of said layout target circuit is smaller than said suppliable current amount per unit area.

2. The design method for a semiconductor integrated circuit according to claim 1 , further comprising:

selecting a circuit that a driving current amount is larger than a threshold value as said layout target circuit.

3. The design method for a semiconductor integrated circuit according to claim 1 , further comprising:

selecting a circuit that an operation frequency is higher than a threshold value as said layout target circuit.

4. The design method for a semiconductor integrated circuit according to claim 1 , further comprising:

performing layout of cells of said layout target circuit based on said set cell size; and

storing layout information of said cells in a cell library.

5. The design method for a semiconductor integrated circuit according to claim 4 , further comprising:

placing said cells on a chip to perform layout of a semiconductor integrated circuit; and

storing layout information of said semiconductor integrated circuit as chip layout information in a storage device.

6. The design method for a semiconductor integrated circuit according to claim 1 , further comprising:

changing layout of cells of said layout target circuit based on said set cell size; and

storing changed layout information of said cells in a cell library.

7. The design method for a semiconductor integrated circuit according to claim 6 , further comprising:

placing said cells on a chip to perform layout of a semiconductor integrated circuit; and

storing layout information of said semiconductor integrated circuit as chip layout information in a storage device.

8. A computer-readable medium comprising code that, when executed, causes a computer to perform the following:

calculating a consumption current amount of a layout target circuit based on circuit information;

calculating a suppliable current amount per unit area in a region where a power can be supplied from a power wiring line;

setting a cell size of said layout target circuit based on said consumption current amount so that a consumption current amount per unit area of said layout target circuit is smaller than said suppliable current amount per unit area.

9. The computer-readable medium according to claim 8 , further comprising:

selecting a circuit that a driving current amount is larger than a threshold value as said layout target circuit.

10. The computer-readable medium according to claim 8 , further comprising:

selecting a circuit that an operation frequency is higher than a threshold value as said layout target circuit.

11. The computer-readable medium according to claim 8 , further comprising:

performing layout of cells of said layout target circuit based on said set cell size; and

storing layout information of said cells in a cell library.

12. The computer-readable medium according to claim 11 , further comprising:

placing said cells on a chip to perform layout of a semiconductor integrated circuit; and

storing layout information of said semiconductor integrated circuit as chip layout information in a storage device.

13. The computer-readable medium according to claim 8 , further comprising:

changing layout of cells of said layout target circuit based on said set cell size; and

storing changed layout information of said cells in a cell library.

14. The computer-readable medium according to claim 13 , further comprising:

placing said cells on a chip to perform layout of a semiconductor integrated circuit; and

storing layout information of said semiconductor integrated circuit as chip layout information in a storage device.

15. A design support device for a semiconductor integrated circuit, comprising:

a consumption current calculation portion configured to calculate a consumption current amount of a layout target circuit based on circuit information;

a suppliable current calculation portion configured to calculate a suppliable current amount per unit area in a region where a power can be supplied from a power wiring line;

a cell size setting portion configured to set a cell size of said layout target circuit based on said consumption current amount so that a consumption current amount per unit area of said layout target circuit is smaller than said suppliable current amount per unit area.

16. The design support device for a semiconductor integrated circuit according to claim 15 , further comprising:

a cell layout portion configured to perform layout of cells of said layout target circuit based on said set cell size to create layout information; and

a cell library configured to store said layout information of said cells.

17. The design support device for a semiconductor integrated circuit according to claim 16 , further comprising:

a chip layout portion configured to place said cells on a chip to perform layout of a semiconductor integrated circuit and create chip layout information; and

a storage device configured to store said chip layout information.

18. The design support device for a semiconductor integrated circuit according to claim 15 , further comprising:

a cell layout portion configured to change layout of cells of said layout target circuit based on said set cell size to create layout information; and

a cell library configured to store said layout information of said cells.

19. The design support device for a semiconductor integrated circuit according to claim 16 , further comprising:

a chip layout portion configured to place said cells on a chip to perform layout of a semiconductor integrated circuit and create chip layout information; and

a storage device configured to store said chip layout information.

20. A manufacturing method for a semiconductor integrated circuit, comprising:

forming a mask of a pattern based on chip layout information created by a design method for a semiconductor integrated circuit, said design method including:

calculating a consumption current amount of a layout target circuit based on circuit information,

calculating a suppliable current amount per unit area in a region where a power can be supplied from a power wiring line,

setting a cell size of said layout target circuit based on said consumption current amount so that a consumption current amount per unit area of said layout target circuit is smaller than said suppliable current amount per unit area,

performing layout of cells of said layout target circuit based on said set cell size,

storing layout information of said cells in a cell library,

placing said cells on a chip to perform layout of a semiconductor integrated circuit, and

storing layout information of said semiconductor integrated circuit as said chip layout information in a storage device; and

producing a semiconductor integrated circuit by using said mask.

21. A manufacturing method for a semiconductor integrated circuit, comprising:

forming a mask of a pattern based on chip layout information created by a design method for a semiconductor integrated circuit, said design method including:

calculating a consumption current amount of a layout target circuit based on circuit information,

calculating a suppliable current amount per unit area in a region where a power can be supplied from a power wiring line,

setting a cell size of said layout target circuit based on said consumption current amount so that a consumption current amount per unit area of said layout target circuit is smaller than said suppliable current amount per unit area,

changing layout of cells of said layout target circuit based on said set cell size, and

storing changed layout information of said cells in a cell library,

placing said cells on a chip to perform layout of a semiconductor integrated circuit, and

storing layout information of said semiconductor integrated circuit as said chip layout information in a storage device; and

producing a semiconductor integrated circuit by using said mask.

22. A semiconductor integrated circuit comprising:

a power wiring line; and

a plurality of cells configured to be supplied with power voltage from said power wiring line,

wherein a consumption current amount per unit area of each of said plurality of cells is equal to or smaller than a suppliable current amount per unit area in a region where said power voltage can be supplied from said power wiring line, and

wherein said plurality of cells includes a cell that a cell size is larger than a cell size corresponding to a logic area and there is no dead space.

Assignments (2)
CHANGE OF NAME Recorded Oct 26, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025191/0916 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 29, 2010
From: NAKAJIMA, YOHEI; NONAKA, MAKOTO
To: NEC ELECTRONICS CORPORATION
Reel/Frame 024612/0352 →
Priority Claims (1)
JP 2009-179305 · Jul 31, 2009 · national
Continuity (1)
Related Publication 20110024869A1 · Feb 3, 2011