Semiconductor device and method of monitoring blowing of fuse in semiconductor device
View Patent ↗In some embodiments, a semiconductor device includes a fuse having a conductive portion configured to be blown when a current exceeding a rated value flows through the conductive portion, a first monitor wiring configured to monitor blowing of the conductive portion of the fuse, and a second monitor wiring configured to monitor blowing of the conductive portion of the fuse. The first monitor wiring and the second monitor wiring are connected to the conductive portion of the fuse so as to be away from a longitudinal center of the conductive portion.
1. A semiconductor device comprising:
a fuse having a conductive portion configured to be blown when a current exceeding a rated value flows through the conductive portion;
a first monitor wiring configured to monitor blowing of the conductive portion of the fuse; and
a second monitor wiring configured to monitor blowing of the conductive portion of the fuse,
wherein the first monitor wiring is connected to the conductive portion of the fuse so as to be away from a longitudinal center of the conductive portion, and
wherein the second monitor wiring is connected to the conductive portion of the fuse so as to be away from a longitudinal center of the conductive portion.
2. The semiconductor device as recited in claim 1 ,
wherein the fuse has a pair of pads and the conductive portion electrically connecting the pads, the first monitor wiring includes a pad and a wiring portion, and the second monitor wiring including a pad and a wiring portion,
wherein the wiring portion of the first monitor wiring is connected to a first portion of the conductive portion of the fuse which is away from the longitudinal center of the conductive portion by a certain distance, and
wherein the wiring portion of the second monitor wiring is connected to a second portion of the conductive portion of the fuse which is away from the longitudinal center of the conductive portion by a certain distance.
3. The semiconductor device as recited in claim 2 , wherein the first portion of the conductive portion is away from the longitudinal center of the conductive portion in one longitudinal direction of the conductive portion, and the second portion of the conductive portion is away from the longitudinal center of the conductive portion in the other longitudinal direction of the conductive portion.
4. The semiconductor device as recited in claim 2 , wherein the first portion of the conductive portion and the second portion of the conductive portion are away from the longitudinal center of the conductive portion in the same longitudinal direction of the conductive portion by the same distance.
5. The semiconductor device as recited in claim 2 , wherein the wiring portion of the first monitor wiring and the wiring portion of the second monitor wiring are connected to end portions of the conductive portion of the fuse to be blown.
6. The semiconductor device as recited in claim 2 , wherein the pad of the first monitor wiring is arranged adjacent to one of the pair of pads of the fuse at one side of the fuse and the wiring portion of the first monitor wiring is connected to the conductive portion of the fuse at the one side of the fuse, and the pad of the second monitor wiring is arranged adjacent to the other of the pair of pads of the fuse at the one side of the fuse and the wiring portion of the second monitor wiring is connected to the conductive portion of the fuse at the one side of the fuse.
7. The semiconductor device as recited in claim 6 , wherein the wiring portion of the first monitor wiring is connected to a first portion of the conductive portion of the fuse to be blown, wherein the wiring portion of the second monitor wiring is connected to a second portion of the conductive portion of the fuse to be blown, and wherein the first portion and the second portion are away from each other from the longitudinal center of the conductive portion of the fuse.
8. The semiconductor device as recited in claim 2 , wherein the pad of the first monitor wiring is arranged adjacent to one of the pair of pads of the fuse at one side of the fuse and the wiring portion of the first monitor wiring is connected to the conductive portion of the fuse at the one side of the fuse, and the pad of the second monitor wiring is arranged adjacent to the other of the pair of pads of the fuse at the other side of the fuse and the wiring portion of the second monitor wiring is connected to the conductive portion of the fuse at the other side of the fuse.
9. The semiconductor device as recited in claim 8 , wherein the wiring portion of the first monitor wiring is connected to a first portion of the conductive portion of the fuse to be blown, wherein the wiring portion of the second monitor wiring is connected to a second portion of the conductive portion of the fuse to be blown, and wherein the first portion and the second portion are away from each other from the longitudinal center of the conductive portion of the fuse.
10. The semiconductor device as recited in claim 2 , wherein the pad of the first monitor wiring is arranged adjacent to one of the pair of pads of the fuse at one side of the fuse and the wiring portion of the first monitor wiring is connected to the conductive portion of the fuse at the one side of the fuse, and the pad of the second monitor wiring is arranged adjacent to the one of the pair of pads of the fuse at the other side of the fuse and the wiring portion of the second monitor wiring is connected to the conductive portion of the fuse at the other side of the fuse.
11. The semiconductor device as recited in claim 9 , wherein the semiconductor device as recited in claim 5 , wherein the wiring portion of the first monitor wiring and the wiring portion of the second monitor wiring are connected to a portion of the conductive portion of the fuse to be blown.
12. The semiconductor device as recited in claim 2 , further comprising a third monitor wiring configured to monitor blowing of the conductive portion of the fuse, the third monitor wiring including a pad and a wiring portion, and a fourth monitor wiring configured to monitor blowing of the conductive portion of the fuse, the fourth monitor wiring including a pad and a wiring portion,
wherein the pad of the first monitor wiring is arranged adjacent to one of the pair of pads of the fuse at one side of the fuse and the wiring portion of the first monitor wiring is connected to the conductive portion of the fuse at the one side of the fuse, the pad of the second monitor wiring is arranged adjacent to the other of the pair of pads of the fuse at the one side of the fuse and the wiring portion of the second monitor wiring is connected to the conductive portion of the fuse at the one side of the fuse, the pad of the third monitor wiring is arranged adjacent to the other of the pair of pads of the fuse at the other side of the fuse and the wiring portion of the third monitor wiring is connected to the conductive portion of the fuse at the other side of the fuse, the pad of the fourth monitor wiring is arranged adjacent to the one of the pair of pads of the fuse at the other side of the fuse and the wiring portion of the fourth monitor wiring is connected to the conductive portion of the fuse at the other side of the fuse.
13. The semiconductor device as recited in claim 12 , wherein the wiring portion of the first monitor wiring and the wiring portion of the fourth monitor wiring are connected to a first portion of the conductive portion of the fuse to be blown, and the wiring portion of the second monitor wiring and the wiring portion of the third monitor wiring are connected to a second portion of the conductive portion of the fuse to be blown.
14. A semiconductor device comprising:
a fuse having a conductive portion configured to be blown when a current exceeding a rated value flows through the conductive portion;
a first monitor wiring configured to monitor blowing of the conductive portion of the fuse; and
a second monitor wiring configured to monitor blowing of the conductive portion of the fuse,
wherein the first monitor wiring and the second monitor wiring are connected to the conductive portion of the fuse so as to be positioned within a blow-off target area of the conductive portion of the fuse.
15. The semiconductor device as recited in claim 14 ,
wherein the fuse has a pair of pads and the conductive portion electrically connecting the pads, the first monitor wiring includes a pad and a wiring portion, and the second monitor wiring including a pad and a wiring portion,
wherein the wiring portions of the first monitor wiring and the second monitor wiring are connected to the conductive portion of the fuse so as to be away from the longitudinal center of the conductive portion.
16. A method of monitoring blowing of a fuse in a semiconductor device, the method comprising:
providing a fuse in the semiconductor device, the fuse having a conductive portion configured to be blown when a current exceeding a rated value flows through the conductive portion;
providing a first monitor wiring and a second monitor wiring in the semiconductor device so that the first and second monitor wirings are connected to the conductive portion of the fuse so as to be away from a longitudinal center of the conductive portion, the first monitor wiring and the second monitor wiring being configured to monitor blowing of the conductive portion of the fuse; and
monitoring electric disconnection of the conductive portion of the fuse using the first monitor wiring and second monitor wiring to confirm, after blowing of the conductive portion of the fuse, whether or not remaining portions of the fuse and the first and second monitor wirings are electrically disconnected with each other.