Semiconductor device

1. A semiconductor device including a digital region and an analog region embedded therein, the semiconductor device comprising:

a substrate;

an insulating interlayer formed over the substrate;

a seal ring comprising a first electro-conductive film embedded in the insulating interlayer, and surrounding an outer circumference of the digital region and the analog region in a plan view;

a guard ring comprising a second electro-conductive film embedded in the insulating interlayer, provided in an area surrounded by the seal ring, between the digital region and the analog region, so as to isolate the analog region from the digital region, and so as to be electrically connected to the seal ring; and

a first electrode pad being electrically connected to the guard ring in the vicinity of the guard ring,

wherein the second electro-conductive film of the guard ring is connected to the substrate, while being routed through an impurity-diffused layer having a same conductivity type as that of the substrate and a first well having a same conductivity type as the substrate, and

wherein the first electro-conductive film of the seal ring is connected to the substrate through an impurity-diffused layer having a same conductivity type as that of the substrate and a second well having an opposite conductivity type to that of the substrate.

2. The semiconductor device as claimed in claim 1 ,

wherein the first electrode pad is coupled to a ground terminal.

3. The semiconductor device as claimed in claim 1 ,

wherein the first electrode pad is coupled to an external grounding terminal.

4. The semiconductor device as claimed in claim 1 ,

wherein the first electrode pad is disposed in the vicinity of the guard ring in the analog region in a plan view.

5. The semiconductor device as claimed in claim 1 ,

wherein the first electrode pad is connected to the first electro-conductive film or the second electro-conductive film through an electro-conductive film embedded in the insulating interlayer.

6. The semiconductor device as claimed in claim 1 ,

wherein the first electrode pad is connected to the first electro-conductive film through an electro-conductive film embedded in the insulating interlayer, and the first electrode pad is connected to the guard ring through the seal ring.

7. The semiconductor device as claimed in claim 1 , containing a plurality of the first electrode pads,

wherein a part of the plurality of first electrode pads are respectively connected to the first electro-conductive film through an electro-conductive film embedded in the insulating interlayer, and

other part of the plurality of first electrode pads are respectively connected to the second electro-conductive film through an electro-conductive film embedded in the insulating interlayer.

8. A semiconductor device including a digital region and an analog region embedded therein, the semiconductor device comprising:

a substrate;

an insulating interlayer formed over the substrate;

a seal ring comprising a first electro-conductive film embedded in the insulating interlayer, and surrounding an outer circumference of the digital region and the analog region in a plan view;

a guard ring comprising a second electro-conductive film embedded in the insulating interlayer, provided in an area surrounded by the seal ring, between the digital region and the analog region, so as to isolate the analog region from the digital region, and so as to be electrically connected to the seal ring; and

a first electrode pad being electically connected to the guard ring in the vicinity of the guard ring,

wherein the second electro-conductive film of the guard ring is connected to the substrate, without being routed through an impurity-diffused layer having a conductivity type opposite to that of the substrate, and

wherein the first electro-conductive film of the seal ring is connected to the substrate through an impurity-diffused layer having a same conductivity type as that of the substrate and a well having an opposite conductivity type to that of the substrate.

9. The semiconductor device as claimed in claim 1 ,

wherein the substrate is grounded.

10. A semiconductor device including a digital region and an analog region embedded therein, the semiconductor device comprising:

a substrate;

an insulating interlayer formed over the substrate;

a seal ring comprising a first electro-conductive film embedded in the insulating interlayer, and surrounding an outer circumference of the digital region and the analog region in a plan view;

a guard ring comprising a second electro-conductive film embedded in the insulating interlayer, provided in an area surrounded by the seal ring, between the digital region, and the analog region, so as to isolate the analog region from the digital region, and so as to be electrically connected to the seal ring; and

a first electrode pad being electrically connected to the guard ring in the vicinity of the guard ring,

wherein the analog region includes a noise-susceptible circuit to be protected formed therein, and

wherein the first electrode pad is connected to the guard ring so as to make impedance Z 2 which is calculated based on an electro-conduction route to the first electrode pad from an intersection, where a propagation route of noise from the digital region to the circuit to be protected crosses the guard ring, equivalent to ½ of impedance Z 1 which is calculated based on the propagation route from the intersection to the circuit to be protected, at a predetermined frequency.

11. The semiconductor device as claimed in claim 3 ,

wherein the first electrode pad is connected to the grounding terminal through a bonding wire.

12. The semiconductor device as claimed in claim 9 ,

wherein the first electrode pad is connected to a via formed in the insulating interlayer, at a position not overlapping a point of connection with a bonding wire in a plan view, and is connected to the first electro-conductive film or the second electro-conductive film through the via.

13. The semiconductor device as claimed in claim 3 ,

wherein the grounding terminal comprises a terminal provided to an interconnect substrate, a die pad on which the semiconductor device is mounted, or a lead.

14. The semiconductor device as claimed in claim 3 ,

wherein the grounding terminal comprises a die pad on which the semiconductor device is mounted, and the substrate is grounded through the die pad.

15. The semiconductor device as claimed in claim 1 ,

wherein the analog region has a noise-susceptible circuit to be protected formed therein, and the semiconductor device further comprising:

an electrode pad electrically connected to the seal ring or the guard ring in the vicinity of the circuit to be protected, the electrode pad being set to the ground potential while being coupled to a ground terminal.

16. The semiconductor device as claimed in claim 1 ,

wherein the analog region has a noise-susceptible circuit to be protected formed therein, and the semiconductor device further comprising:

an electrode pad electrically connected to the seal ring or the guard ring in the vicinity of the circuit to be protected, the electrode pad being set to the ground potential while being coupled to an external grounding terminal.

17. A semiconductor device including a digital region and an analog region embedded therein, the semiconductor device comprising:

a substrate;

an insulating interlayer formed over the substrate;

a seal ring comprising a first electro-conductive film embedded in the insulating interlayer, and surrounding an outer circumference of the digital region and the analog region in a plan view; and

a guard ring comprising a second electro-conductive film embedded in the insulating interlayer, provided in an area surrounded by the seal ring, between the digital region and the analog region, so as to isolate the analog region from the digital region, and so as to be electrically connected to the seal ring,

wherein the second electro-conductive film of the guard ring is connected to the substrate, while being routed through a first conductivity type first impurity-diffused layer and a first conductivity type well, and

wherein the first electro-conductive film of the seal ring is connected to the substrate through a first conductivity type second impurity-diffused layer and a second conductivity type well.

18. The semiconductor device as claimed in claim 17 ,

wherein the analog region has a noise-susceptible circuit to be protected formed therein, and

wherein the first electrode pad is connected to the guard ring so as to make impedance Z 2 which is calculated based on an electro-conduction route to the first electrode pad from an intersection, where a propagation route of noise from the digital region to the circuit to be protected crosses the guard ring, equivalent to ½ of impedance Z 1 which is calculated based on the propagation route from the intersection to the circuit to be protected, at a predetermined frequency.

19. The semiconductor device as claimed in claim 17 , wherein the substrate is of a first conductivity type.

20. The semiconductor device as claimed in claim 1 ,

wherein the analog region includes a noise-susceptible circuit to be protected formed therein, and

wherein the first electrode pad is connected to the guard ring according to determined impedances therebetween.

21. The semiconductor device as claimed in claim 1 , further comprising a plurality of electrode pads being electrically connected to the seal ring,

wherein the number of the electrode pads disposed in the analog region is more than the number of the electrode pads disposed in the digital region.