Warp-suppressed semiconductor device
A semiconductor device includes: a semiconductor chip mounted on a mounting substrate; a first resin filling a gap between the chip and the substrate; a frame-shaped stiffener surrounding the chip; a first adhesive for bonding the stiffener to the substrate; a lid for covering the stiffener and an area surrounded by the stiffener; and a second resin filling a space between the stiffener and the chip. A thermal expansion coefficient of the second resin is smaller than that of the first resin. The first resin includes an underfill part filling a gap between the chip and the substrate and a fillet part extended from the chip region.
1. A semiconductor device comprising:
a semiconductor chip having a first surface where bump electrodes are formed and a second surface opposite to said first surface, said semiconductor chip being mounted on a mounting substrate such that said first surface faces said substrate;
a first resin filling a gap between the semiconductor chip and the mounting substrate, wherein the first resin includes an underfill part filling the gap between the semiconductor chip and the mounting substrate, and a fillet part extended from a region of the semiconductor chip; and
a second resin in contact with the first resin and the mounting substrate, the second resin being smaller in a thermal expansion coefficient than the first resin,
wherein the first resin and the second resin include an inorganic filler component, and
wherein the inorganic filler component of the first resin is different in content amount than the inorganic filler component of the second resin,
and further comprising a lid configured to cover the semiconductor chip,
wherein the lid has a first surface having a first region facing a second surface of the semiconductor chip and a second region surrounding said first region and contacting said second resin.
2. The semiconductor device according to claim 1 , wherein the second resin surrounds the semiconductor chip.
3. The semiconductor device according to claim 1 , wherein the lid is bonded to a backside of the semiconductor chip with an adhesive.
4. The semiconductor device according to claim 1 , wherein an elastic modulus of the second resin is larger than an elastic modulus of the first resin.
5. The semiconductor device according to claim 1 , wherein the first resin and the second resin comprise an epoxy resin main component.
6. The semiconductor device according to claim 5 , wherein the epoxy resin main component is the same in the first resin and the second resin.
7. The semiconductor device according to claim 1 , wherein the second resin is in contact with the fillet part, the mounting substrate and each of side faces of the semiconductor chip.
8. The semiconductor device according to claim 1 , wherein the inorganic filler component of the first resin is different in density than the inorganic filler component of the second resin.
9. The semiconductor device according to claim 1 , wherein said second region comprises a primary second region where said substrate, said extended section of said first resin, said second resin, and said lid overlap in a plan view, and a secondary second region where said substrate, said second resin, and said lid overlap in a plan view.
10. The semiconductor device according to claim 1 , wherein said lid has a second surface opposite to said first surface, and said first surface is flat and parallel to said second surface.
11. The semiconductor device according to claim 1 , wherein said chip has a first side, and a distance from a line containing said first side to an end of said second resin is larger in a region which does not face said first side than in a region which faces said first side.
12. The semiconductor device according to claim 1 , wherein said first surface of said lid has a third region surrounding said second region which does not contact said second resin.