IP Library Granted Patent US 8,415,940
Granted Patent B2
US 8,415,940 · App. 12/991,820 · Granted Apr 9, 2013

Temperature compensation circuit and method for generating a voltage reference with a well-defined temperature behavior

Inventors: Yi Yin (Munich, DE); Ralf Reuter (Munich, DE)
Assignee: Freescale Semiconductor, Inc.
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Quick Facts
Patent No.
US 8,415,940
App. No.
12/991,820
Granted
Apr 9, 2013
Kind
B2
Abstract

A temperature compensation circuit, comprises a temperature sensor circuit. The circuit comprises two or more temperature sensitive devices. In use, the devices are operated at different current densities and sense virtually the same ambient temperature. The devices provide temperature dependent signals having linear components with slopes of identical signs. The circuit further comprises one of more differential signal providing device for generating a difference of the signals generated by the temperature sensitive devices. A method for generating a voltage reference with a well-defined temperature behavior, comprises applying different current densities to two or more temperature sensitive devices of a temperature sensor circuit; sensing virtually the same ambient temperature with the two or more temperature sensitive devices. Each temperature sensitive devices generates a slightly different temperature dependent signal; and provide at least one differential signal based on said temperature dependent signals.

Claims (28)

1. A temperature compensation circuit for generating a voltage reference with a well-defined temperature behavior, comprising:

a temperature sensor circuit, said circuit comprising;

two or more temperature sensitive devices which when operated have different current densities, for sensing virtually the same ambient temperature and providing temperature dependent signals having linear components with slopes of identical signs; and

at least one differential signal providing device, for generating a difference of said signals generated by said temperature sensitive devices, said difference forming the voltage reference.

2. The temperature compensation circuit as claimed in claim 1 , wherein said differential signal providing device is a differential amplifier configuration.

3. The temperature compensation circuit as claimed in claim 1 , wherein said temperature sensitive devices comprises a semiconducting device with a junction having a temperature dependent conductivity.

4. The temperature compensation circuit as claimed in claim 1 , wherein said different current densities are generated by metal oxide semiconducting devices with differing dimensions.

5. The temperature compensation circuit as claimed in claim 1 , wherein said voltage reference is a virtually linear function of the temperature over at least some range of the temperature.

6. The temperature compensation circuit as claimed in claim 1 , wherein said voltage reference is used as a bias voltage for an electronic circuit being subject to virtually the same temperature changes.

7. The temperature compensation circuit as claimed in claim 6 , wherein said voltage reference at least partially compensates for a gain variation of said electronic circuit.

8. The temperature compensation circuit as claimed in claim 6 , wherein said electronic circuit is an electronic amplifier.

9. The temperature compensation circuit as claimed in claim 8 , wherein said bias voltage is a bias voltage for at least one cascode stage of said electronic amplifier.

10. The temperature compensation circuit as claimed in claim 9 , wherein said temperature compensation circuit for generating a voltage reference comprises at least a second differential signal providing device providing a second voltage reference being used as a bias voltage for a buffer stage following said at least one cascode stage of said electronic amplifier.

11. The temperature compensation circuit as claimed in claim 8 , wherein said electronic amplifier is operable within a frequency range located between 50 and 120 GHz.

12. A method for generating a voltage reference with a well-defined temperature behavior, comprising:

applying different current densities to two or more temperature sensitive devices of a temperature sensor circuit;

sensing virtually the same ambient temperature with said two or more temperature sensitive devices;

each temperature sensitive devices generating a temperature dependent signal; and

providing at least one differential signal based on said temperature dependent signals, wherein said temperature dependent signals all comprise linear components with slopes of identical signs.

13. The method as claimed in claim 12 , wherein said temperature dependent signal is generated from a temperature dependent conductivity of a junction of a semiconducting device of said temperature sensitive devices.

14. The method as claimed in claim 12 , wherein said different current densities are generated by metal oxide semiconducting devices with differing dimensions.

15. The method as claimed in claim 12 , wherein a plot of said voltage reference against temperature comprises at least one virtually linear section.

16. The method as claimed in claim 12 , comprising:

using said voltage reference as a bias voltage for an electronic circuit being subject to virtually the same temperature changes.

17. The method as claimed in claim 16 , wherein said electronic circuit is an electronic amplifier.

18. The method as claimed in claim 16 , wherein said using of said voltage reference at least partially compensates for a gain variation of said electronic circuit.

19. A low-noise amplifier (LNA) comprising a temperature compensation circuit as claimed in claim 1 .

20. A vehicle radar device comprising a low-noise amplifier as claimed in claim 19 .

Assignments (31)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040925 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Feb 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 052917/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040928 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Jan 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 052915/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 037486 FRAME 0517. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Dec 10, 2019
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 053547/0421 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050744/0097 →
CORRECTIVE ASSIGNMENT TO CORRECT THE TO CORRECT THE APPLICATION NO. FROM 13,883,290 TO 13,833,290 PREVIOUSLY RECORDED ON REEL 041703 FRAME 0536. ASSIGNOR(S) HEREBY CONFIRMS THE THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS.. Recorded Feb 20, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: SHENZHEN XINGUODU TECHNOLOGY CO., LTD.
Reel/Frame 048734/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE NATURE OF CONVEYANCE PREVIOUSLY RECORDED AT REEL: 040632 FRAME: 0001. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER AND CHANGE OF NAME. Recorded Sep 21, 2017
From: FREESCALE SEMICONDUCTOR INC.
To: NXP USA, INC.
Reel/Frame 044209/0047 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE PATENTS 8108266 AND 8062324 AND REPLACE THEM WITH 6108266 AND 8060324 PREVIOUSLY RECORDED ON REEL 037518 FRAME 0292. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Feb 1, 2017
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 041703/0536 →
CHANGE OF NAME Recorded Nov 8, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: NXP USA, INC.
Reel/Frame 040632/0001 →
RELEASE OF SECURITY INTEREST Recorded Nov 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 040928/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 21, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 040925/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12092129 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
SUPPLEMENT TO THE SECURITY AGREEMENT Recorded Jun 16, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039138/0001 →
SECURITY AGREEMENT SUPPLEMENT Recorded Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 038017/0058 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 13, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037518/0292 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 12, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037486/0517 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037357/0334 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037357/0387 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037357/0285 →
SECURITY AGREEMENT Recorded Nov 6, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 031591/0266 →
SECURITY AGREEMENT Recorded Jun 18, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 030633/0424 →
SECURITY AGREEMENT Recorded Jan 31, 2012
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 027621/0928 →
SECURITY AGREEMENT Recorded Jan 31, 2012
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 027622/0477 →
SECURITY AGREEMENT Recorded Jan 31, 2012
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 027622/0075 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 9, 2010
From: YIN, YI; REUTER, RALF
To: FREESCALE SEMICONDUCTOR INC.
Reel/Frame 025335/0553 →
Continuity (1)
Related Publication 20110080154A1 · Apr 7, 2011