Substrate processing apparatus and substrate processing method using same

1. A substrate processing method using a substrate processing apparatus including a chamber for accommodating a substrate, a lower electrode disposed in the chamber to mount the substrate, a first RF power applying unit for applying an RF power for plasma generation to the lower electrode, and a second RF power applying unit for applying an RF power for bias to the lower electrode, the method comprising:

controlling the first RF power applying unit for plasma generation to be intermittently changed by changing an output of the first RF power applying unit at a predetermined timing;

controlling the second RF power applying unit to apply RF power for bias to the lower electrode during application of power by the first RF power applying unit to generate a plasma such that, during a first period in which the first RF power applying unit is applying power to generate a plasma, the second RF power applying unit is continuously applying power throughout the first period or is applying power with a plurality of pulses throughout the first period; and

the method further including controlling the second RF power applying unit such that during a second period if no plasma state or an afterglow state exists in the chamber by a control of the first RF power applying unit, an output of the second RF power applying unit is controlled to be in an OFF state or decreased below an output of the second RF power applying unit when the output of the first RF power applying unit is a set output.

2. The substrate processing method of claim 1 , wherein, the output of the second RF power applying unit is adjusted to apply power at a decreased level greater than zero if no plasma state or an afterglow state exists and such that an amplitude (Vpp) of the RF power for bias when the output of the second RF power applying unit is decreased does not exceed an amplitude (Vpp) of the RF power for bias when the output of the first RF power applying unit is the set output.

3. The substrate processing method of claim 1 , wherein a period of time during which the output of the second RF power applying unit is in the OFF state or decreased is longer than a period of time during which no plasma state or the afterglow state exists in the chamber by the control of the first RF power applying unit.

4. The substrate processing method of claim 1 , wherein the RF power for bias is controlled to be intermittently changed by making the second RF power applying unit switch between an ON state and one of an OFF state and power-decreased state at a preset timing.

5. The substrate processing method of claim 4 , wherein a pulse duration during which the output of the first RF power applying unit is changed is different from a pulse duration during which the output of the second RF power applying unit is changed.

6. The substrate processing method of claim 5 , wherein a pulse frequency at which the output of the first RF power applying unit is changed ranges from 100 Hz to 100 kHz and a pulse frequency at which the output of the second RF power applying unit is changed ranges from 1 Hz to 1 kHz.

7. A substrate processing method using a substrate processing apparatus including a chamber for accommodating a substrate, a lower electrode disposed in the chamber to mount the substrate, an RF power applying unit for applying an RF power for plasma generation to the lower electrode, and a DC voltage applying unit for applying a DC voltage for bias to the lower electrode,

controlling the RF power applying unit for plasma generation to be intermittently changed by changing an output of the RF power applying unit at a predetermined timing;

controlling the DC voltage applying unit to apply DC voltage for bias to the lower electrode during application of power by the RF power applying unit to generate a plasma such that, during a first period in which the RF power applying unit is applying power to generate a plasma, the DC voltage applying unit is continuously applying a voltage throughout the first period or is applying a voltage with a plurality of pulses throughout the first period; and

the method further including controlling the DC voltage applying unit such that during a second period if no plasma state or an afterglow state exists in the chamber by a control of the RF power applying unit, an output of the DC voltage applying unit is controlled to be decreased below an output of the DC voltage applying unit when the output of the RF power applying unit is a set output.

8. The substrate processing method of claim 7 , wherein, the output of the DC voltage applying unit is adjusted such that an amount of heat generated by the DC voltage applied to the lower electrode when the output of the DC voltage applying unit is decreased does not exceed an amount of heat generated by the DC voltage applied to the lower electrode when the output of the RF power applying unit is the set output.

9. The substrate processing method of claim 7 , wherein a period of time during which the output of the DC voltage applying unit is decreased is longer than a period of time during which no plasma state or an afterglow state exists in the chamber by the control of the RF power applying unit.

10. The substrate processing method of claim 7 , wherein a DC voltage applied to the lower electrode is controlled to be intermittently changed by decreasing the output of the DC voltage applying unit at a preset timing.

11. The substrate processing method of claim 10 , wherein a pulse duration during which the output of the RF power applying unit is changed is different from a pulse duration during which the output of the DC voltage applying unit is changed.

12. The substrate processing method of claim 11 , wherein a pulse frequency at which the output of the RF power applying unit is changed ranges from 100 Hz to 100 kHz and a pulse frequency at which the output of the DC voltage applying unit is changed ranges from 100 kHz to 1 MHz.

13. A substrate processing method using a substrate processing apparatus including a chamber for accommodating a substrate, a lower electrode disposed in the chamber to mount the substrate, a first RF power applying unit for applying an RF power for plasma generation into the chamber, and a second RF power applying unit for applying an RF power for bias to the lower electrode, the method comprising:

controlling the RF power for plasma generation to be intermittently changed by changing an output of the first RF power applying unit at a predetermined timing; and

if no plasma state or an afterglow state exists in the chamber by a control of the first RF power applying unit while the second RF power applying unit is in an ON state, an output of the second RF power applying unit not to be in an OFF state and to be decreased below an output of the second RF power applying unit when the output of the first RF power applying unit is a set output.

14. The substrate processing method of claim 13 , wherein if no plasma state or the afterglow state exists in the chamber by the control of the first RF power applying unit while the second RF power applying unit is in an ON state, controlling the output of the second RF power applying unit to be set to be less than a set output of the second RF power applying unit multiplied by a duty ratio of the first RF power applying unit.

15. The substrate processing method of claim 13 , the method further comprising:

controlling the second RF power applying unit to apply RF power for bias to the lower electrode during application of power by the first RF power applying unit to generate a plasma such that, during a period in which the first RF power applying unit is applying power to generate a plasma, the second RF power applying unit is continuously applying power throughout the period or is applying power with a plurality of pulses throughout the period.

16. A substrate processing method using a substrate processing apparatus including a chamber for accommodating a substrate, a lower electrode disposed in the chamber to mount the substrate, an RF power applying unit for applying an RF power for plasma generation into the chamber, and a DC voltage applying unit for applying a DC voltage for bias to the lower electrode,

controlling the RF power for plasma generation to be intermittently changed by changing an output of the RF power applying unit at a predetermined timing; and

if no plasma state or an afterglow state exists in the chamber by a control of the RF power applying unit while the DC voltage applying unit is in an ON state, an output of the DC voltage applying unit not to be zero and to be decreased below an output of the DC voltage applying unit when the output of the RF power applying unit is a set output.

17. The substrate processing method of claim 16 , wherein if no plasma state or the afterglow state exists in the chamber by the control of the RF power applying unit while the DC voltage applying unit is in an ON state, controlling an output of the DC voltage applying unit to be set to be less than a set output of the DC voltage applying unit multiplied by a duty ratio of the RF power applying unit.

18. The substrate processing method of claim 16 , the method further comprising:

controlling the DC voltage applying unit to apply DC voltage for bias to the lower electrode during application of power by the RF power applying unit to generate a plasma such that, during a period in which the RF power applying unit is applying power to generate a plasma, the DC voltage applying unit is continuously applying a voltage throughout the period or is applying a voltage with a plurality of pulses throughout the period.