IP Library Granted Patent US 8,667,352
Granted Patent B2
US 8,667,352 · App. 12/990,873 · Granted Mar 4, 2014

Semiconductor device and method for validating a state thereof

Inventor: Oleksandr Sakada (Munich, DE)
Assignee: Freescale Semiconductor, Inc.
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Quick Facts
Patent No.
US 8,667,352
App. No.
12/990,873
Granted
Mar 4, 2014
Kind
B2
Abstract

A semiconductor device comprises processing logic arranged to execute program instructions. The semiconductor device further comprises signature generation logic arranged to receive at least one value from at least one internal location of the semiconductor device, and to generate a current signature value, based on the at least one received value. Validation logic is arranged to validate the current signature value generated by the signature generation logic. The processing logic is further arranged, upon execution of a signature validation instruction, to enable the validation of the current signature value provided by the validation logic.

Claims (59)

1. A semiconductor device comprising processing logic arranged to execute program instructions, whereby the semiconductor device further comprises:

signature generation logic arranged to receive at least one value from at least one internal location of the semiconductor device, generate a current signature value based on the at least one received value concurrently to the processing logic executing program instructions, and store the current signature value at a signature register; and

validation logic operably coupled to the signature register and arranged to read and validate the current signature value stored within the signature register;

wherein the processing logic is arranged, upon execution of a signature validation instruction, to enable the validation of the current signature value by the validation logic.

2. The semiconductor device claim 1 wherein the signature generation logic is arranged to receive at least one value from at least one internal location from a group consisting of:

(i) an instruction register for the processing logic;

(ii) internal buffers of an address generator module;

(iii) outputs of internal flip-flops of an integer unit; and

(iv) inputs/outputs of internal gates of multiplexers.

3. The semiconductor device of claim 1 wherein the signature generation logic is arranged to generate the current signature value by performing at least one operation from a group consisting of:

(i) cyclic redundancy check (CRC) compression; and

(ii) polynomial calculations.

4. The semiconductor device of claim 2 wherein the signature generation logic is operably coupled to a signature register, the signature generation logic arranged to store the generated current signature in the signature register; the validation logic is operably coupled to the signature register and arranged to read and validate the current signature value stored within the signature register.

5. The semiconductor device of claim 2 wherein the signature generation logic is arranged to generate the current signature value by performing at least one operation from a group consisting of:

(i) cyclic redundancy check (CRC) compression; and

(ii) polynomial calculations.

6. The semiconductor device of claim 1 wherein the signature generation logic is arranged to generate the current signature value further based at least partially on a previously generated current signature value.

7. The semiconductor device of claim 6 wherein the signature generation logic is arranged to generate the current signature value substantially synchronously with execution of instructions by the processing logic.

8. The semiconductor device of claim 6 wherein the validation logic comprises comparator logic arranged to receive the current signature value generated by the signature generation logic, compare the current signature value with a reference signature value, and to output an indication of whether the current signature value matches the reference signature value.

9. The semiconductor device of claim 1 wherein the signature generation logic is arranged to generate the current signature value substantially synchronously with execution of instructions by the processing logic.

10. The semiconductor device of claim 9 wherein the signature generation logic is arranged to generate a current signature value for every n instructions executed by the processing logic.

11. The semiconductor device of claim 1 wherein the signature generation logic is arranged to generate the current signature value substantially synchronously to a clock signal of the semiconductor device.

12. The semiconductor device of claim 11 wherein the clock signal is externally configurable.

13. The semiconductor device of claim 1 wherein the validation logic comprises comparator logic arranged to receive the current signature value generated by the signature generation logic, compare the current signature value with a reference signature value, and to output an indication of whether the current signature value matches the reference signature value.

14. The semiconductor device of claim 13 further wherein the comparator logic is arranged to receive the reference signature value from the processing logic.

15. The semiconductor device of claim 13 wherein the validation logic further comprises indicator logic, operably coupled to the comparator logic; the indicator logic operably coupled to the processing logic and arranged, upon receipt of an enabling signal from the processing logic, to output a validation indication based on the indication output by the comparator logic.

16. The semiconductor device of claim 1 wherein the processing logic is arranged, upon execution of a signature validation instruction, to extract a reference signature value from the signature validation instruction, and to provide the reference signature value to the validation logic.

17. The semiconductor device of claim 1 wherein the processing logic is arranged, upon execution of a signature validation instruction, to retrieve a reference signature value from a memory location within the semiconductor device, and to provide the reference signature value to the validation logic.

18. A processing system comprising:

processor logic arranged to execute program instructions;

signature generation logic arranged to receive at least one value from at least one internal location of the semiconductor device to generate a current signature value, based on the at least one received value, concurrently to the processing logic executing program instructions; and

validation logic comprising comparator logic arranged to receive the current signature value, compare the current signature value with a reference signature value, and to output an indication of whether the current signature value matches the reference signature value;

wherein the processor logic is arranged, upon execution of a signature validation instruction, to enable the validation of the current signature value by the validation logic.

19. A method for validating a state of a semiconductor device, comprising:

initialising signature generation logic at the semiconductor device, the signature generation logic to generate a current signature value based on at least one value from at least one internal location of the semiconductor device, and to store the current signature value at a signature register;

executing program instructions at the semiconductor device; and

upon receipt of a validation instruction to be executed, enabling validation logic at the semiconductor device, the validation logic arranged to read and validate the current signature value stored within the signature register.

20. A method for validating a state of a semiconductor device, comprising:

initialising signature generation logic at the semiconductor device, the signature generation logic to generate a current signature value based on at least one value from at least one internal location of the semiconductor device;

executing program instructions at the semiconductor device; and

upon receipt of a validation instruction to be executed, enabling validation logic at the semiconductor device, the validation logic comprising comparator logic arranged to receive the current signature value, compare the current signature value with a reference signature value, and to output an indication of whether the current signature value matches the reference signature value.

21. A semiconductor device comprising processing logic arranged to execute program instructions, whereby the semiconductor device further comprises:

signature generation logic arranged to receive at least one value from at least one internal location of the semiconductor device and to generate a current signature value based on the at least one received value concurrently to the processing logic executing program instructions; and

validation logic arranged to validate the current signature value generated by the signature generation logic;

wherein the processing logic is arranged, upon execution of a signature validation instruction, to extract a reference signature value from the signature validation instruction, to provide the reference signature value to the validation logic, and to enable the validation of the current signature value by the validation logic.

22. A semiconductor device comprising processing logic arranged to execute program instructions, whereby the semiconductor device further comprises:

signature generation logic arranged to receive at least one value from at least one internal location of the semiconductor device and to generate a current signature value based on the at least one received value concurrently to the processing logic executing program instructions; and

validation logic arranged to validate the current signature value generated by the signature generation logic;

wherein the processing logic is arranged, upon execution of a signature validation instruction, to retrieve a reference signature value from a memory location within the semiconductor device, to provide the reference signature value to the validation logic, and to enable the validation of the current signature value by the validation logic.

23. A semiconductor device comprising processing logic arranged to execute program instructions, whereby the semiconductor device further comprises:

signature generation logic arranged to receive at least one value from at least one internal location of the semiconductor device and to generate a current signature value based on the at least one received value concurrently to the processing logic executing program instructions; and

validation logic arranged to validate the current signature value generated by the signature generation logic;

wherein the processing logic is arranged, upon execution of a signature validation instruction, to enable the validation of the current signature value by the validation logic; and

wherein the signature generation logic is arranged to generate the current signature value by performing a cyclic redundancy check (CRC) compression.

24. A semiconductor device comprising processing logic arranged to execute program instructions, whereby the semiconductor device further comprises:

signature generation logic arranged to receive at least one value from at least one internal location of the semiconductor device and to generate a current signature value based on the at least one received value concurrently to the processing logic executing program instructions; and

validation logic arranged to validate the current signature value generated by the signature generation logic;

wherein the processing logic is arranged, upon execution of a signature validation instruction, to enable the validation of the current signature value by the validation logic; and

wherein the signature generation logic is arranged to generate the current signature value by performing polynomial calculations.

Assignments (30)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040925 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Feb 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 052917/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040928 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Jan 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 052915/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 037486 FRAME 0517. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Dec 10, 2019
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 053547/0421 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050744/0097 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE TO CORRECT THE APPLICATION NO. FROM 13,883,290 TO 13,833,290 PREVIOUSLY RECORDED ON REEL 041703 FRAME 0536. ASSIGNOR(S) HEREBY CONFIRMS THE THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS.. Recorded Feb 20, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: SHENZHEN XINGUODU TECHNOLOGY CO., LTD.
Reel/Frame 048734/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE PATENTS 8108266 AND 8062324 AND REPLACE THEM WITH 6108266 AND 8060324 PREVIOUSLY RECORDED ON REEL 037518 FRAME 0292. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Feb 1, 2017
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 041703/0536 →
MERGER Recorded Jan 3, 2017
From: FREESCALE SEMICONDUCTOR, INC.
To: NXP USA, INC.
Reel/Frame 041144/0363 →
RELEASE OF SECURITY INTEREST Recorded Nov 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 040928/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 21, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 040925/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12092129 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
SUPPLEMENT TO THE SECURITY AGREEMENT Recorded Jun 16, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039138/0001 →
SECURITY AGREEMENT SUPPLEMENT Recorded Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 038017/0058 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 13, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037518/0292 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 12, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037486/0517 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037357/0285 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037357/0387 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037357/0334 →
SECURITY AGREEMENT Recorded Nov 6, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 031591/0266 →
SECURITY AGREEMENT Recorded Jun 18, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 030633/0424 →
SECURITY AGREEMENT Recorded Jan 31, 2012
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 027622/0477 →
SECURITY AGREEMENT Recorded Jan 31, 2012
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 027621/0928 →
SECURITY AGREEMENT Recorded Jan 31, 2012
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 027622/0075 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 3, 2010
From: SAKADA, OLEKSANDR
To: FREESCALE SEMICONDUCTOR INC
Reel/Frame 025242/0318 →
Continuity (1)
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