Low dielectric glass and fiber glass
Glass compositions are provided that are useful in a variety of applications including, for example, electronics applications, reinforcement applications, and others. Some embodiments of glass compositions can provide desirable dielectric constants, desirable dissipation factors, and/or desirable mechanical properties while also having desirable fiber forming properties.
1. A glass composition suitable for fiber forming comprising:
SiO 2
60-68
weight percent;
B 2 O 3
7-13
weight percent;
Al 2 O 3
8.4-16
weight percent;
MgO
6-15
weight percent;
CaO
0-5
weight percent;
Li 2 O
0-2
weight percent;
Na 2 O
0-1
weight percent;
K 2 O
0-1
weight percent;
Fe 2 O 3
0-1
weight percent;
F 2
0-1
weight percent;
TiO 2
0-2
weight percent; and
other constituents
0-5
weight percent total.
2. The composition of claim 1 , comprising:
SiO 2
62-68
weight percent;
B 2 O 3
7-9
weight percent;
Al 2 O 3
10-15
weight percent; and
MgO
8-12
weight percent.
3. The composition of claim 2 , wherein the Li 2 O content is 1-2 weight percent.
4. The composition of claim 1 , wherein the MgO content is greater than 8 weight percent.
5. The composition of claim 1 , wherein the CaO content is 0-3 weight percent.
6. The composition of claim 1 , wherein the CaO content is at least 1 weight percent.
7. The composition of claim 1 , wherein the TiO 2 content is 0-1 weight percent.
8. The composition of claim 1 , wherein the B 2 O 3 content is 7-11 weight percent.
9. The composition of claim 1 , wherein the B 2 O 3 content is 7-9 weight percent.
10. The composition of claim 1 , wherein the Al 2 O 3 content is 9-15 weight percent.
11. The composition of claim 1 , wherein the Al 2 O 3 content is 10-15 weight percent.
12. The composition of claim 1 , wherein the SiO 2 content is greater than about 62 weight percent.
13. The composition of claim 1 , wherein the constituents are selected to provide a glass having a dielectric constant (D k ) less than 6.7 at 1 MHz frequency.
14. The composition of claim 1 , wherein the constituents are selected to provide a glass having a dielectric constant (D k ) less than 6 at 1 MHz frequency.
15. The composition of claim 1 , wherein the constituents are selected to provide a glass having a dielectric constant (D k ) less than 5.6 at 1 MHz frequency.
16. The composition of claim 1 , wherein the constituents are selected to provide a glass having a dielectric constant (D k ) less than 5.2 at 1 MHz frequency.
17. The composition of claim 1 , wherein the constituents are selected to provide a glass having a dielectric constant (D k ) less than 5.0 at 1 MHz frequency.
18. The composition of claim 1 , wherein the constituents are selected to provide a glass having a dissipation factor (Df) less than 0.007 at 1 GHz frequency.
19. The composition of claim 1 , wherein the constituents are selected to provide a glass having a dissipation factor (Df) less than 0.003 at 1 GHz frequency.
20. The composition of claim 1 , wherein the constituents are selected to provide a forming temperature T F at 1000 poise viscosity no greater than 1370° C.
21. The composition of claim 1 , wherein the constituents are selected to provide a forming temperature T F at 1000 poise viscosity no greater than 1320° C.
22. The composition of claim 1 , wherein the constituents are selected to provide a forming temperature T F at 1000 poise viscosity no greater than 1300° C.
23. The composition of claim 1 , wherein the constituents are selected to provide a forming temperature T F at 1000 poise viscosity no greater than 1290° C.
24. The composition of claim 1 , wherein the constituents are selected to provide a forming temperature T F at 1000 poise viscosity no greater than 1260° C.
25. The composition of claim 24 , wherein the constituents are selected to provide a liquidus temperature (T L ) at least 55° C. below the forming temperature.
26. The composition of claim 1 , wherein the Li 2 O content is 0.4-2.0 weight percent.
27. The composition of claim 1 , wherein the Li 2 O content is greater than the (Na 2 O+K 2 O) content.
28. The composition of claim 1 , wherein the (Li 2 O +Na 2 O+K 2 O) content is less than 2 weight percent.
29. The composition of claim 1 , the composition contains 0-1 weight percent of BaO and 0-2 weight percent ZnO.
30. The composition of claim 1 , wherein the composition contains essentially no BaO and essentially no ZnO.
31. The composition of claim 1 , wherein other constituents, if any, are present in a total amount of 0-2 weight percent.
32. The composition of claim 1 , wherein other constituents, if any, are present in a total amount of 0-1 weight percent.
33. A glass composition suitable for fiber forming comprising:
SiO 2
60-68
weight percent;
B 2 O 3
7-11
weight percent;
Al 2 O 3
8.4-16
weight percent;
MgO
6-15
weight percent;
CaO
0-5
weight percent;
Li 2 O
0-2
weight percent;
Na 2 O
0-1
weight percent;
K 2 O
0-1
weight percent;
Fe 2 O 3
0-1
weight percent;
F 2
0-1
weight percent;
TiO 2
0-2
weight percent; and
other constituents
0-5
weight percent total.
34. The composition of claim 33 , wherein the constituents are selected to provide a glass having a dielectric constant (D k ) less than 6.7 at 1 MHz frequency.
35. The composition of claim 33 , wherein the constituents are selected to provide a glass having a dielectric constant (D k ) less than 6 at 1 MHz frequency.
36. The composition of claim 33 , wherein the constituents are selected to provide a glass having a dielectric constant (D k ) less than 5.6 at 1 MHz frequency.
37. The composition of claim 33 , wherein the constituents are selected to provide a glass having a dielectric constant (D k ) less than 5.2 at 1 MHz frequency.
38. The composition of claim 33 , wherein the constituents are selected to provide a glass having a dielectric constant (D k ) less than 5.0 at 1 MHz frequency.
39. The composition of claim 33 , wherein the constituents are selected to provide a glass having a dissipation factor (Df) less than 0.007 at 1 GHz frequency.
40. The composition of claim 33 , wherein the constituents are selected to provide a glass having a dissipation factor (Df) less than 0.003 at 1 GHz frequency.
41. The composition of claim 33 , wherein the constituents are selected to provide a forming temperature T F at 1000 poise viscosity no greater than 1370° C.
42. The composition of claim 33 , wherein the constituents are selected to provide a forming temperature T F at 1000 poise viscosity no greater than 1320° C.
43. The composition of claim 33 , wherein the constituents are selected to provide a forming temperature T F at 1000 poise viscosity no greater than 1300° C.
44. The composition of claim 33 , wherein the constituents are selected to provide a forming temperature T F at 1000 poise viscosity no greater than 1290° C.
45. The composition of claim 33 , wherein the constituents are selected to provide a forming temperature T F at 1000 poise viscosity no greater than 1260° C.
46. The composition of claim 45 , wherein the constituents are selected to provide a liquidus temperature (T L ) at least 55° C. below the forming temperature.
47. The composition of claim 33 , wherein the Li 2 O content is 0.4-2.0 weight percent.
48. The composition of claim 33 , wherein the Li 2 O content is greater than the (Na 2 O+K 2 O) content.
49. The composition of claim 33 , wherein the (Li 2 O +Na 2 O,+K 2 O) content is less than 2 weight percent.
50. A glass composition suitable for fiber forming comprising:
SiO 2
60-68
weight percent;
B 2 O 3
7-10
weight percent;
Al 2 O 3
10-16
weight percent;
MgO
8-12
weight percent;
CaO
0-4
weight percent;
Li 2 O
0-2
weight percent;
Na 2 O
0-1
weight percent;
K 2 O
0-1
weight percent;
Fe 2 O 3
0-1
weight percent;
F 2
0-1
weight percent;
TiO 2
0-2
weight percent; and
other constituents
0-5
weight percent total.
51. A glass composition suitable for fiber forming comprising:
SiO 2
62-68
weight percent;
B 2 O 3
less than about 9
weight percent;
Al 2 O 3
10-16
weight percent;
MgO
8-12
weight percent; and
CaO
0-4
weight percent;
wherein the glass exhibits a dielectric constant (D k ) less than 6.7 at 1 MHz frequency and a forming temperature (T F ) at 1000 poise viscosity no greater than 1370° C.