Method of patterning a low-K dielectric film
Methods of patterning low-k dielectric films are described. For example, a method includes forming and patterning a mask layer above a low-k dielectric layer, the low-k dielectric layer disposed above a substrate. Exposed portions of the low-k dielectric layer are modified with a plasma process. The modified portions of the low-k dielectric layer are removed selective to the mask layer and unmodified portions of the low-k dielectric layer.
1. A method of patterning a low-k dielectric film, the method comprising:
forming and patterning a mask layer above a low-k dielectric layer to provide exposed and unexposed portions of the low-k dielectric layer, the low-k dielectric layer disposed above a substrate;
modifying a surface of the exposed portions of the low-k dielectric layer with a first plasma process without modifying the unexposed portions of the low-k dielectric layer;
removing the modified surface of the exposed portions of the low-k dielectric layer selective to the mask layer and to the unmodified unexposed portions of the low-k dielectric layer; and
repeating the modifying and the removing one or more times to form one or more trenches in the low-k dielectric layer.
2. The method of claim 1 , wherein modifying the surface of the exposed portions of the low-k dielectric layer with the first plasma process comprises removing carbon atoms from the surface of the exposed portions of the low-k dielectric layer.
3. The method of claim 1 , wherein modifying the surface of the exposed portions of the low-k dielectric layer with the first plasma process comprises increasing the dielectric constant of the surface of the exposed portions of the low-k dielectric layer.
4. The method of claim 1 , wherein modifying the surface of the exposed portions of the low-k dielectric layer with the first plasma process comprises using a plasma generated from a gas selected from the group consisting of helium (He), Xenon (Xe), nitrogen (N 2 ), and argon (Ar).
5. The method of claim 1 , wherein removing the modified surface of the exposed portions of the low-k dielectric layer comprises using a second plasma process.
6. The method of claim 5 , wherein the second plasma process comprises a plasma generated from a gas selected from the group consisting of NF 3 , ammonia (NH 3 ), or a combination thereof.
7. The method of claim 1 , wherein removing the modified surface of the exposed portions of the low-k dielectric layer comprises using a vapor selected from the group consisting of hydrogen fluoride (HF) vapor and NF 3 .HF vapor.
8. The method of claim 1 , wherein the modifying and the removing are performed in a same process chamber without removing the substrate from the process chamber between the modifying and the removing.
9. The method of claim 1 , wherein forming and patterning the mask layer above the low-k dielectric layer comprises forming and patterning a non-oxide mask layer.