IP Library Granted Patent US 8,748,276
Granted Patent B2
US 8,748,276 · App. 13/539,925 · Granted Jun 10, 2014

Method for manufacturing semiconductor device

Inventor: Hideki Hayashi (Osaka, JP)
Assignee: Sumitomo Electric Industries, Ltd.
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Quick Facts
Patent No.
US 8,748,276
App. No.
13/539,925
Granted
Jun 10, 2014
Kind
B2
Abstract

A through portion is formed on a semiconductor substrate. Into the semiconductor substrate, a first ion implantation is performed via the through portion. The through portion is at least partially removed in the thickness direction from a region of at least a portion of the through portion when viewed in a plan view. A second ion implantation is performed into the semiconductor substrate at the region of at least the portion thereof. An implantation energy for the first ion implantation is equal to an implantation energy for the second ion implantation.

Claims (11)

1. A method for manufacturing a semiconductor device, comprising the steps of:

forming a film on a semiconductor substrate;

performing a first ion implantation into said semiconductor substrate through said film;

at least partially removing said film; and

performing a second ion implantation into said semiconductor substrate through said film after at least partially removing said film, an implantation energy for said first ion implantation being equal to an implantation energy for said second ion implantation.

2. The method for manufacturing the semiconductor device according to claim 1 , wherein the step of at least partially removing said film includes the step of partially removing said film in a thickness direction.

3. The method for manufacturing the semiconductor device according to claim 1 , wherein:

the step of forming said film includes the step of forming a stacked film having a first film and a second film provided on said first film and made of a material different from that of said first film, and

the step of at least partially removing said film includes the step of removing said second film while said first film remains.

4. The method for manufacturing the semiconductor device according to claim 1 , wherein said semiconductor substrate is a silicon carbide substrate.

5. The method for manufacturing the semiconductor device according to claim 1 , further comprising the step of forming an ion implantation mask on said film.

Assignments (2)
NUNC PRO TUNC ASSIGNMENT Recorded Jul 1, 2026
From: SUMITOMO ELECTRIC INDUSTRIES, LTD.
To: MITSUMI ELECTRIC CO., LTD.
Reel/Frame 075871/0320 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 2, 2012
From: HAYASHI, HIDEKI
To: SUMITOMO ELECTRIC INDUSTRIES, LTD.
Reel/Frame 028477/0074 →
Priority Claims (1)
JP 2011-155287 · Jul 14, 2011 · national
Continuity (2)
Provisional Application 61507847 · Jul 14, 2011
Related Publication 20130017675A1 · Jan 17, 2013