High speed SiGe HBT and manufacturing method thereof
A high-speed SiGe HBT is disclosed, which includes: a substrate; STIs formed in the substrate; a collector region formed beneath the substrate surface and located between the STIs; an epitaxial dielectric layer including two portions, one being located on the collector region, the other being located on one of the STIs; a base region formed both in a region between and on surfaces of the two portions of the epitaxial dielectric layer; an emitter dielectric layer including two portions, both portions being formed on the base region; an emitter region formed both in a region between and on surfaces of the two portions of the emitter dielectric layer; a contact hole formed on a surface of each of the base region, the emitter region and the collector region. A method of manufacturing high-speed SiGe HBT is also disclosed.
1. A high-speed SiGe HBT, comprising:
a substrate;
shallow trench isolations formed in the substrate;
a collector region formed beneath a surface of the substrate and located between the shallow trench isolations;
an epitaxial dielectric layer including two portions, a first one of the portions being located on the collector region, a second one of the portions being located on one of the shallow trench isolations;
a base region formed both in a region between the two portions of the epitaxial dielectric layer and on surfaces of the two portions of the epitaxial dielectric layer;
an emitter dielectric layer including two portions, both portions being formed on the base region;
an emitter region formed both in a region between the two portions of the emitter dielectric layer and on surfaces of the two portions of the emitter dielectric layer; and
a contact hole, formed on a surface of each of the base region, the emitter region and the collector region.
2. The high-speed SiGe HBT according to claim 1 , wherein the emitter region is formed on the surface of the base region and is located above the collector region.
3. The high-speed SiGe HBT according to claim 1 , further comprising base region isolation sidewalls that are formed on both sides of the base region and the epitaxial dielectric layer.
4. The high-speed SiGe HBT according to claim 1 , further comprising emitter region isolation sidewalls that are formed on both sides of the emitter region and the emitter dielectric layer.
5. The high-speed SiGe HBT according to claim 1 , further comprising metal wires, each metal wire being connected to one of the contact holes.
6. The high-speed SiGe HBT according to claim 1 , wherein the substrate is a P-type substrate.
7. The high-speed SiGe HBT according to claim 6 , wherein the collector region contains an N-type impurity.
8. The high-speed SiGe HBT according to claim 6 , wherein the emitter region contains an N-type impurity.
9. The high-speed SiGe HBT according to claim 6 , wherein the base region contains a P-type impurity.
10. The high-speed SiGe HBT according to claim 1 , wherein a thickness of the epitaxial dielectric layer is 50 Å to 300 Å.
11. The high-speed SiGe HBT according to claim 1 , wherein the epitaxial dielectric layer and the emitter dielectric layer are both formed of an insulating material.