Method of controlling substrate processing apparatus, maintenance method of substrate processing apparatus and transfer method performed in substrate processing apparatus
Only a wafer for QC check may be transferred and a production wafer may prevent from being transferred into an assigned process chamber whose QC check is not completed after a maintenance task, and the production wafer may be processed the assigned process chamber after the completion of the QC check. The wafer for QC check is transferred while inhibiting a transfer of the production wafer into the assigned process chamber, and the production wafer is transferred into each of the process chambers of the plurality except the assigned process chamber.
1. A method of controlling a substrate processing apparatus comprising a transfer mechanism located inside a transfer chamber connected to a plurality of process chambers configured to process substrates and configured to transfer the substrates between the transfer chamber and the plurality of process chambers, a process controller connected to each of the plurality of process chambers to control a processing of the substrates in each of the plurality of process chambers, an integrated controller connected to the process controller to control an operation of the transfer mechanism and a manipulation unit connected to the integrated controller and the process controller, the manipulation unit being configured to transmit a command thereto and to receive an operation report from the transfer mechanism via the integrated controller, the method comprising:
(a) displaying a setting screen for selecting one of a maintenance mode wherein a maintenance check of the plurality of process chambers is performed, a QC mode wherein a quality control substrate is processed in the plurality of process chambers after performing the maintenance check and a production mode wherein a production substrate is processed in the plurality of process chambers,
(b) controlling the transfer mechanism to inhibit a transfer of the substrates into a predetermined process chamber of the plurality of process chambers when the predetermined process chamber is set to the maintenance mode on the setting screen;
(c) controlling the transfer mechanism to transfer the quality control substrate into the predetermined process chamber while inhibiting a transfer of the product substrate into the predetermined process when the predetermined process chamber is set to the QC mode on the setting screen; and
(d) controlling the transfer mechanism to transfer the product substrate into the predetermined process chamber while inhibiting a transfer of the quality control substrate into process chambers of the plurality of process chambers other than the predetermined process chamber when the predetermined process chamber is set to the production mode on the setting screen.
2. The method of claim 1 , wherein the step (b) comprises:
transmitting a command for closing a gate valve between the predetermined process chamber and the transfer chamber to the process controller when the predetermined process chamber is set to the maintenance mode on the setting screen;
transmitting an instruction for starting a recipe for the maintenance check to the process controller after the gate valve is closed and the transfer of the substrates into the predetermined process chamber is inhibited; and
performing a predetermined maintenance process by executing the recipe for the maintenance check in the predetermined process chamber.
3. The method of claim 1 , wherein the step (c) comprises:
changing a mode of the predetermined process chamber from the maintenance mode to the QC mode when the predetermined process chamber is set to the QC mode on the setting screen;
controlling the transfer mechanism to transfer the quality control substrate into the predetermined process chamber while inhibiting the transfer of the production substrate into the predetermined process chamber;
instructing the process controller to start a recipe for processing the quality control substrate after the quality control substrate is transferred into the predetermined process chamber; and
executing the recipe for processing the quality control substrate.
4. The method of claim 3 , wherein the step (c) further comprises:
(c-1) measuring a thickness of a film formed on the quality control substrate and checking number of particles adhered to the quality control substrate as a quality inspection after the recipe for processing the quality control substrate is complete; and
(c-2) accepting a re-set of an operation mode of the predetermined process chamber through the setting screen according to a result of the quality inspection.
5. The method of claim 4 , wherein the step (c-2) comprises:
accepting through the setting screen the re-set of the operation mode of the predetermined process chamber from the QC mode to the maintenance mode when the result of the quality inspection is out of a predetermined specification; and
accepting through the setting screen the re-set of the operation mode of the predetermined process chamber from the QC mode to the production mode when the result of the quality inspection is within the predetermined specification.
6. The method of claim 1 , further comprising:
setting the predetermined process chamber to the maintenance mode when an error occurs in the predetermined process chamber during the transfer of the product substrate; and
transferring the product substrate into the process chambers other than the predetermined process chamber while inhibiting the transfer of the product substrate into the predetermined process chamber.
7. The method of claim 6 , further comprising:
changing the maintenance mode to the QC mode when a maintenance operation is complete; and
transferring the product substrate while continuously inhibiting the transfer of the product substrate into the predetermined process chamber.
8. The method of claim 7 , further comprising performing a quality inspection of the quality control substrate, and wherein an operation mode of the predetermined process chamber is set to the production mode when the result of the quality inspection is within the predetermined specification, and the operation mode of the predetermined process chamber is changed from the QC mode to the maintenance mode when the result of the quality inspection is out of a predetermined specification.
9. A maintenance method of a substrate processing apparatus comprising a transfer mechanism located inside a transfer chamber connected to a plurality of process chambers configured to process substrates and configured to transfer the substrates between the transfer chamber and the plurality of process chambers, a process controller connected to each of the plurality of process chambers to control a processing of the substrates in each of the plurality of process chambers, an integrated controller connected to the process controller to control an operation of the transfer mechanism and a manipulation unit connected to the integrated controller and the process controller, the manipulation unit being configured to transmit a command thereto and to receive an operation report from the transfer mechanism via the integrated controller, the maintenance method comprising:
(a) displaying a setting screen for selecting one of a maintenance mode wherein a maintenance check of the plurality of process chambers is performed, a QC mode wherein a quality control substrate is processed in the plurality of process chambers after performing the maintenance check and a production mode wherein a production substrate is processed in the plurality of process chambers,
(b) transmitting a command for closing a gate valve between a predetermined process chamber of the plurality of process chambers and the transfer chamber to the process controller when the predetermined process chamber is set to the maintenance mode on the setting screen;
(c) transmitting an instruction for starting a recipe for the maintenance check to the process controller after the gate valve is closed and the transfer of the substrates into the predetermined process chamber is inhibited;
(d) performing a predetermined maintenance process by executing the recipe for the maintenance check in the predetermined process chamber;
(e) changing a mode of the predetermined process chamber from the maintenance mode to the QC mode when the predetermined process chamber is set to the QC mode on the setting screen;
(f) controlling the transfer mechanism to transfer the quality control substrate into the predetermined process chamber while inhibiting the transfer of the production substrate into the predetermined process chamber;
(g) instructing the process controller to start a recipe for processing the quality control substrate after the quality control substrate is transferred into the predetermined process chamber;
(h) executing the recipe for processing the quality control substrate;
(i) measuring a thickness of a film formed on the quality control substrate and checking number of particles adhered to the quality control substrate as a quality inspection after the recipe for processing the quality control substrate is complete; and
(j) accepting a re-set of an operation mode of the predetermined process chamber through the setting screen according to a result of the Quality inspection,
wherein the step (j) comprises:
accepting through the setting screen the re-set of the operation mode of the predetermined process chamber from the QC mode to the maintenance mode when the result of the quality inspection is out of a predetermined specification; and
accepting through the setting screen the re-set of the operation mode of the predetermined process chamber from the QC mode to the production mode when the result of the quality inspection is within the predetermined specification.
10. A transfer method performed in a substrate processing apparatus comprising a transfer mechanism located inside a transfer chamber connected to a plurality of process chambers configured to process substrates and configured to transfer the substrates between the transfer chamber and the plurality of process chambers, an integrated controller configured to control an operation of the transfer mechanism and a manipulation unit connected to the integrated controller, the manipulation unit being configured to transmit a command thereto and to receive an operation report from the transfer mechanism via the integrated controller, the transfer method comprising:
(a) selecting one of a maintenance mode wherein a maintenance check of the plurality of process chambers is performed, a QC mode wherein a quality control substrate is processed in the plurality of process chambers after performing the maintenance check and a production mode wherein a production substrate is processed in the plurality of process chambers,
(b) controlling the transfer mechanism to inhibit a transfer of the substrates into a predetermined process chamber of the plurality of process chambers when the predetermined process chamber is set to the maintenance mode;
(c) controlling the transfer mechanism to transfer the quality control substrate into the predetermined process chamber while inhibiting a transfer of the product substrate into the predetermined process when the predetermined process chamber is set to the QC mode; and
(d) controlling the transfer mechanism to transfer the product substrate into the predetermined process chamber while inhibiting a transfer of the quality control substrate into process chambers of the plurality of process chambers other than the predetermined process chamber when the predetermined process chamber is set to the production mode.
11. The transfer method of claim 10 , further comprising:
setting the predetermined process chamber to the maintenance mode when an error occurs in the predetermined process chamber during the transfer of the product substrate; and
transferring the product substrate into the process chambers other than the predetermined process chamber while inhibiting the transfer of the product substrate into the predetermined process chamber.
12. The transfer method of claim 11 , further comprising:
changing the maintenance mode to the QC mode when a maintenance operation is complete; and
transferring the product substrate while continuously inhibiting the transfer of the product substrate into the predetermined process chamber.