Slurry for chemical-mechanical polishing of metals and use thereof
A composition and a method for chemical mechanical polishing. The composition includes a surfactant anion an alkyl alcohol and a diluent. The composition further includes abrasive particles and an oxidizer. The method includes providing the composition on a surface to be polished and polishing the surface by contacting the surface with a polishing pad.
1. A method, comprising:
providing an aqueous slurry composition on a surface to be polished, said slurry composition comprising:
between about 0.5% by weight and about 6% by weight abrasive particles;
between about 1 gm/liter and about 50 gm/liter of ferric nitrate;
between about 0.1 ml/liter and about 100 ml/liter of surfactant anion;
between about 0.003 ml/liter and about 3.05 ml/liter of octanol; and
water as a diluent; and
polishing said surface by contacting said surface with a polishing pad.
2. The method of claim 1 , wherein said surface is selected from the group consisting of copper, aluminum, tungsten, alloys of copper, alloys of aluminum and alloys of tungsten.
3. The method of claim 1 , wherein during said polishing, said surface is pressed into said polishing pad with a down force while said surface and said polishing pad are rotating about axes perpendicular to said surface and a top surface of said polishing pad respectively.
4. The method of claim 1 , wherein said surfactant anion is derived from sodium octyl sulfate.
5. A method, comprising:
providing an aqueous slurry composition consisting essentially of:
between about 0.5% by weight and about 6% by weight abrasive particles;
between about 1 gm/liter and about 50 gm/liter of ferric nitrate;
between about 0.1 ml/liter and about 100 ml/liter of surfactant anion;
between about 0.1 gm/liter and about 5 gm/liter of a copper corrosion inhibitor;
between about 0.003 ml/liter and about 3.05 ml/liter of octanol; and
water as a diluent; and
polishing said surface by contacting said surface with a polishing pad.
6. The method of claim 5 , wherein said surface is selected from the group consisting of copper, aluminum, tungsten, alloys of copper, alloys of aluminum and alloys of tungsten.
7. The method of claim 5 , wherein during said polishing, said surface is pressed into said polishing pad with a down force while said surface and said polishing pad are rotating about axes perpendicular to said surface and a top surface of said polishing pad respectively.
8. The method of claim 5 , wherein said surfactant anion is derived from sodium octyl sulfate.
9. The method of claim 1 wherein said octanol is 1-octanol.
10. The method of claim 1 , said slurry composition further comprising:
between about 0.001 gm/liter and about 5 gm/liter of a chloride ion source; and
between about 0.001 gm/liter and about 20 gm/liter a sulfate ion source.
11. The method of claim 1 , said slurry composition further comprising:
between about 0.1 gm/liter and about 5 gm/liter a copper corrosion inhibitor.
12. The method of claim 5 , wherein said octanol is 1-octanol.
13. A method, comprising:
providing an aqueous slurry composition on a surface to be polished, said slurry composition comprising:
abrasive particles;
ferric nitrate;
a surfactant anion;
octanol; and
water as a diluent; and
polishing said surface by contacting said surface with a polishing pad.
14. the method of claim 13 , said slurry composition further comprising a copper corrosion inhibitor.
15. The method of claim 13 , said slurry composition further comprising:
a chloride ion source; and
a sulfate ion source.
16. The method of claim 1 , wherein the surface tension of said slurry composition is between 30 dynes/cm 2 and 27 dynes/cm 2 .
17. The method of claim 5 , wherein the surface tension of said slurry composition is between 30 dynes/cm 2 and 27 dynes/cm 2 .
18. The method of claim 13 , wherein the surface tension of said slurry composition is between 30 dynes/cm 2 and 27 dynes/cm 2 .