Semiconductor device having metal carbon nitride electrodes with different work functions
A semiconductor device includes a substrate including a first region and a second region, a gate dielectric layer formed on the substrate, and a metal electrode layer formed on the gate dielectric layer and including a compound of carbon and nitrogen, wherein a metal electrode formed from the metal electrode layer in the first region has a work function lower than a work function of a metal electrode formed from the metal electrode layer in the second region and a nitrogen concentration of the metal electrode of the first region is smaller than a nitrogen concentration of the metal electrode of the second region.
1. A semiconductor device structure comprising:
a substrate including a first region and a second region;
a gate dielectric layer formed on the substrate; and
an electrode layer formed on the gate dielectric layer and composed of metal, carbon and nitrogen,
wherein the electrode layer in the first region has a work function lower than a work function of the electrode layer in the second region, and a nitrogen concentration of the electrode layer of the first region is smaller than a nitrogen concentration of the electrode layer of the second region so that the electrode layer of the first region and the electrode layer of the second region are composed of the same elements and differ from each other in nitrogen concentration.
2. The semiconductor device structure of claim 1 , wherein the electrode layer includes a tantalum carbon nitride (TaCN) layer.
3. The semiconductor device structure of claim 1 , wherein the first region is a region where an NMOSFET is formed and the electrode layer formed in the first region has a work function of 3.7 eV to 4.4 eV.
4. The semiconductor device structure of claim 1 , wherein the second region is a region where a PMOSFET is formed and the electrode layer formed in the second region has a work function of approximately 4.7 eV to approximately 5.2 eV.
5. The semiconductor device structure of claim 1 , wherein the gate dielectric layer includes a stack structure of a silicon oxide layer and a dielectric layer having a high dielectric constant.
6. The semiconductor device structure of claim 5 , wherein the dielectric constant layer includes hafnium silicate (HfSiO).
7. The semiconductor device structure of claim 1 , further comprising:
a silicon layer and a tungsten layer stacked on the electrode layer of the first region and the second region.
8. The semiconductor device structure of claim 7 , wherein the silicon layer includes an N-type doped silicon layer.
9. The semiconductor device structure of claim 1 , wherein the gate dielectric layer of the first region includes nitrogen while the gate dielectric layer of the second region does not include nitrogen.
10. The semiconductor device structure of claim 1 , wherein the gate dielectric layer of the first and second regions includes nitrogen, and a nitrogen concentration of the gate dielectric layer of the first region is larger than a nitrogen concentration of the gate dielectric layer of the second region.