IP Library › Granted Patent US 9,164,405
Granted Patent B2
US 9,164,405 · App. 12/840,495 · Granted Oct 20, 2015

Measurement apparatus for calculation of substrate tilt, exposure apparatus, and device fabrication method

Inventor: Ryo Sasaki (Utsunomiya, JP)
Assignee: CANON KABUSHIKI KAISHA
G03F9/7049G01B9/0209G01B9/02019G01B9/02022G01B9/02028G01B11/2441G03B27/32G03F9/7034G01B2290/45G01B2290/60
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Quick Facts
Patent No.
US 9,164,405
App. No.
12/840,495
Granted
Oct 20, 2015
Kind
B2
Abstract

The present invention provides a measurement apparatus which measures a height of a test surface, the apparatus including an image sensing device including a plurality of detection units configured to detect interfering light formed by measurement light from the test surface and reference light from a reference surface, and an optical system configured to guide measurement light beams, reflected at a plurality of measurement points on the test surface, and reference light beams, reflected at a plurality of reference points on the reference surface, to the plurality of detection units, respectively, wherein the reference surface generates differences among optical path differences between the measurement light beams and the reference light beams which enter the plurality of detection units, respectively.

Claims (37)

1. A measurement apparatus which measures a height of a test surface, the apparatus comprising:

a stage configured to hold the test surface;

an image sensing device including a plurality of detection units configured to detect interfering light formed by measurement light from the test surface illuminated by white light and reference light from a reference surface illuminated by white light,

wherein the reference surface is arranged to generate a difference among optical path length differences between the measurement light and the reference light that enter said plurality of detection units, respectively;

an optical system configured to guide measurement light reflected at a plurality of measurement points on the test surface and the reference light reflected at a plurality of reference points on the reference surface, to said plurality of detection units; and

a processing unit configured to:

obtain a plurality of position data, within the plurality of detection units, indicating peaks or bottoms of intensities of the interfering light detected by the plurality of detection units and configured to calculate the height of the test surface using the obtained position data;

obtain the optical path length differences between the measurement light and the reference light corresponding to the detected peaks or bottoms of intensities of the interfering light; and

calculate a tilt of the test surface using the obtained optical path length differences and data of the optical path lengths of the reference light corresponding to the obtained positions within the plurality of detection units.

2. The apparatus according to claim 1 , further comprising a memory configured to store a relationship between the peaks or the bottoms of intensities and the height of the test surface.

3. An exposure apparatus comprising:

a projection optical system configured to project a pattern of a reticle onto a substrate;

a measurement apparatus configured to measure a height of the substrate to obtain a surface shape of the substrate; and

a stage configured to hold the substrate and adjust a position of the substrate based on the surface shape of the substrate measured by said measurement apparatus,

wherein said measurement apparatus comprises:

an image sensing device including a plurality of detection units configured to detect interfering light formed by measurement light from the substrate illuminated by white light and reference light from a reference surface illuminated by white light,

wherein the reference surface is arranged to generate a difference among optical path length differences between the measurement light and the reference light that enter said plurality of detection units, respectively;

an optical system configured to guide measurement light reflected at a plurality of measurement points on the substrate and the reference light reflected at a plurality of reference points on the reference surface, to said plurality of detection units; and

a processing unit configured to:

obtain a plurality of position data, within the plurality of detection units, indicating peaks or bottoms of intensities of the interfering light detected by the plurality of detection units and configured to calculate the height of the substrate using the obtained position data;

obtain the optical path length differences between the measurement light and the reference light corresponding to the detected peaks or bottoms of intensities of the interfering light; and

calculate a tilt of the substrate using the obtained optical path length differences and data of the optical path lengths of the reference light corresponding to the obtained positions within the plurality of detection units.

4. A device fabrication method comprising steps of:

exposing a substrate using an exposure apparatus; and

performing a development process for the substrate exposed,

wherein the exposure apparatus includes:

a projection optical system configured to project a pattern of a reticle onto the substrate;

a measurement apparatus configured to measure a height of the substrate to obtain a surface shape of the substrate; and

a stage configured to hold the substrate and adjust a position of the substrate based on the surface shape of the substrate measured by said measurement apparatus,

wherein said measurement apparatus includes:

an image sensing device including a plurality of detection units configured to detect interfering light formed by measurement light from the substrate illuminated by white light and reference light from a reference surface illuminated by white light,

wherein the reference surface is arranged to generate a difference among optical path length differences between the measurement light and the reference light that enter said plurality of detection units, respectively;

an optical system configured to guide measurement light reflected at a plurality of measurement points on the substrate and the reference light reflected at a plurality of reference points on the reference surface, to said plurality of detection units; and

a processing unit configured to:

obtain a plurality of position data, within the plurality of detection units, indicating peaks or bottoms of intensities of the interfering light detected by the plurality of detection units and configured to calculate the height of the substrate using the obtained position data;

obtain the optical path length differences between the measurement light and the reference light corresponding to the detected peaks or bottoms of intensities of the interfering light; and

calculate a tilt of the substrate using the obtained optical path length differences and data of the optical path lengths of the reference light corresponding to the obtained positions within the plurality of detection units.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 8, 2010
From: SASAKI, RYO
To: CANON KABUSHIKI KAISHA
Reel/Frame 025332/0966 →
Priority Claims (1)
JP 2009-186142 · Aug 10, 2009 · national
Continuity (1)
Related Publication 20110032503A1 · Feb 10, 2011