Semiconductor manufacturing apparatus member
In a semiconductor manufacturing apparatus member, paths that may become a discharge path between a wafer and a cooling device are a first path and a second path. The first path is the shortest path from a hole to a hole across a plug. The length of the first path is larger than the thickness of the plug. The second path is the shortest path that extends from one of holes to an outer peripheral surface of the plug along an adhesive layer, and the shortest path from a hole in a bonding sheet to the outer peripheral surface of the plug along the bonding sheet. The sum of the lengths of these respective paths is larger than the thickness of the plug.
1. A semiconductor manufacturing apparatus member in which an electrostatic chuck having a wafer placement surface is disposed on a cooling device, the member comprising:
a gas supply hole that extends through the cooling device from a joint surface of the cooling device that is joined to the electrostatic chuck to a surface of the cooling device that is opposite to the joint surface;
an insulating bonding sheet that is disposed between the electrostatic chuck and the cooling device and has a through hole at a position facing the gas supply hole;
a recessed portion that is formed in the electrostatic chuck from a surface of the electrostatic chuck that faces the gas supply hole toward the wafer placement surface, the recessed portion being connected to the gas supply hole;
a narrow hole that extends through the electrostatic chuck from a bottom surface of the recessed portion to the wafer placement surface;
an air permeable plug that is made of an insulating material and is fitted into the recessed portion; and
an insulating adhesive layer that is disposed between the bottom surface of the recessed portion and the air permeable plug and has a through hole at a position facing the narrow hole,
wherein the shortest distance from the narrow hole to the gas supply hole across the air permeable plug is larger than a thickness of the air permeable plug, and
wherein the sum of the shortest distance from an edge of the through hole in the adhesive layer to an outer peripheral surface of the air permeable plug along the adhesive layer and the shortest distance from the outer peripheral surface of the air permeable plug to an edge of the through hole in the bonding sheet along the bonding sheet is also larger than the thickness of the air permeable plug.
2. The semiconductor manufacturing apparatus member according to claim 1 , wherein the narrow hole is provided in a plurality, the through hole in the adhesive layer is formed at a position facing the plurality of narrow holes, and the shortest distance from one of the narrow holes that is nearest to the gas supply hole to the gas supply hole across the air permeable plug is larger than the thickness of the air permeable plug.
3. The semiconductor manufacturing apparatus member according to claim 2 , wherein the plurality of narrow holes are formed in a circular region having a predetermined radius from the center of the recessed portion.