Ultra-wideband assembly system and method
An ultra-wideband assembly is provided. The assembly includes a non-conductive tapered core having an outer surface, a proximate end and a distal end being larger than proximate end. The assembly includes a conductive wire having a proximate end and a distal end and being wound about at least a portion of the non-conductive tapered core. The proximate end of the conductive wire extends away from the proximate end of the tapered core and is being conductively coupled to a micro-strip line of a circuit board. The distal end of the conductive wire extends away from the distal end of the tapered core. The conductive wire contacts at least a portion of the outer surface of the non-conductive tapered core. The assembly includes a supporting bracket coupled to the non-conductive tapered core. The supporting bracket is configured to dispose the non-conductive tapered core at a predetermined angle to the circuit board.
1. A method of manufacturing an ultra-wideband assembly for placement in an electrical circuit having a circuit board with a conductive micro-strip line, comprising:
providing a non-conductive tapered core,
said core including
an outer surface;
a distal end; and
a proximate end,
said distal end being larger than proximate end;
providing a conductive wire having a proximate end and a distal end and winding said conductive wire about at least a portion of said non-conductive tapered core;
wherein
said proximate end of said conductive wire extends away from said proximate end of said non-conductive tapered core and is being conductively coupled to said micro-strip line of said circuit board;
said distal end of said conductive wire extends away from said distal end of said non-conductive tapered core;
said conductive wire contacts at least a portion of said outer surface of said non-conductive tapered core;
providing a supporting bracket for coupling to said non-conductive tapered core;
said supporting bracket having
a base portion; and
a core attachment portion;
said base portion is being conductively coupled to said circuit board;
said core attachment portion is being coupled to said distal end of said non-conductive tapered core and is further being conductively coupled to said distal end of said conductive wire;
while being coupled to said non-conductive tapered core, said supporting bracket is configured to dispose said non-conductive tapered core at a predetermined angle to said circuit board.
2. The method according to claim 1 , wherein said predetermined angle is in a range of greater than or equal to 10 degrees and up to substantially 90 degrees with respect to said circuit board.
3. The method according to claim 1 , further comprising providing a dielectric layer configured to be disposed on top of at least a portion of said conductive wire being wound on said non-conductive tapered core, said dielectric layer being disposed substantially near said proximate end of said non-conductive tapered core.
4. The method according to claim 3 , further comprising
providing a metal pad;
coupling said metal pad to said dielectric layer at said proximate end of said non-conductive tapered core.
5. The method according to claim 4 , wherein said metal pad is configured to contact said proximate end of said conductive wire to generate a robust contact with a micro-strip line of the circuit board.
6. The method according to claim 3 , wherein said dielectric layer is configured to extend away from said outer surface of said non-conductive tapered core.
7. The method according to claim 3 , wherein said dielectric layer has a thickness in range between approximately 0.004 inches to approximately 0.035 inches.
8. The method according to claim 7 , wherein said dielectric material is a hydrocarbon ceramic loaded glass.
9. The method according to claim 3 , wherein said metal pad has a thickness in the range of approximately 0.0005 inches to approximately 0.003 inches.
10. The method according to claim 3 , wherein said metal pad includes a copper layer, whereby the copper layer is configured to be initially electroless-deposited on said dielectric layer and then electroplated onto said dielectric layer and then said copper layer is configured to be plated with a metal selected from a group consisting of tin, lead/tin combination, silver, and gold.
11. The method according to claim 3 , wherein said supporting bracket and said distal end of said conductive wire provide a robust contact with said circuit board.
12. The method according to claim 3 , wherein the dielectric material is manufactured from a material selected from a group consisting of: a hydrocarbon ceramic loaded glass, ceramic, ceramic reinforced glass or PTFE-based materials, PTFE materials reinforced with glass fibers, hydrocarbon ceramic composites, and rigid plastic.
13. The method according to claim 3 , wherein said dielectric layer is manufactured from low loss dielectric material having a low dielectric constant.
14. The method according to claim 1 , wherein said non-conductive tapered core has a tetrahedron shape.
15. The method according to claim 1 , wherein said non-conductive tapered core has a triangular pyramid shape.
16. The method according to claim 1 , wherein said non-conductive tapered core has a multi-dimensional polygonal shape.
17. The method according to claim 1 , wherein said non-conductive tapered core is composed of powdered iron.
18. The method according to claim 1 , wherein the assembly is configured to reduce insertion loss in a frequency range from below 10 KHz to over 100 GHz.