IP Library › Granted Patent US 9,194,043
Granted Patent B2
US 9,194,043 · App. 13/203,381 · Granted Nov 24, 2015

Atomic layer deposition apparatus

Inventors: Hiroyuki Tachibana (Tamano, JP); Kazutoshi Murata (Tamano, JP); Naomasa Miyatake (Tamano, JP); Yasunari Mori (Tamano, JP)
Assignee: MITSUI ENGINEERING & SHIPBUILDING
C23C16/4409C23C16/4407C23C16/45544C23C16/46C23C16/54C23C16/4583
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Quick Facts
Patent No.
US 9,194,043
App. No.
13/203,381
Granted
Nov 24, 2015
Kind
B2
Abstract

An atomic layer deposition apparatus for forming a thin film on a substrate, including a first container that defines a first inner space, a second container provided inside the first container to define a second inner space, the second container being canister-shaped and including a first opening at one end thereof, a source gas that forms the thin film on the substrate flowing to the second inner space through the first opening, and a pressing member including a gas supply port for supplying the source gas to the second inner space through the first opening, the pressing member being configured to press the second container in a longitudinal direction of the second container so that the second inner space be separated from the first inner space.

Claims (10)

1. An atomic layer deposition apparatus for forming a thin film on a substrate, comprising:

a first container that defines a first inner space, the first container including an upper portion and a lower portion configured to move vertically so as to separate from the upper portion;

a second container provided inside the first container to define a second inner space, the second container including a first opening at a first end of the second container in a lengthwise direction thereof, the lengthwise direction being a horizontal direction; a second opening at a second end of the second container opposite to the first end in the lengthwise direction thereof, the second opening being configured such that gas in the second inner space flows to an outside of the second inner space therethrough, the second end being configured to be pressed to an inner surface of the first container, and a distance between the first end and the second end being shorter than the maximum distance between the inner surfaces of the first container in the lengthwise direction; and

a substrate support portion configured to dispose the substrate horizontally thereon between the first opening and the second opening;

a support mechanism configured to support the second container on the lower portion, the support mechanism including a moving mechanism configured to move the support mechanism in the lengthwise direction on the lower portion; and a pressing member including a gas supply port configured to supply a source gas forming the thin film on the substrate to the second inner space through the first opening, the pressing member being configured to press the first end of the second container in the first inner space to move the second container and the support mechanism in the lengthwise direction so that the second end of the second container is pressed against an inner surface of the first container and the second inner space is closed from the first inner space.

2. The atomic layer deposition apparatus according to claim 1 , wherein

the second container includes a substrate support portion disposing the substrate thereon, the substrate support portion having a plurality of notches on the second opening side end thereof, the plurality of the notches configured to receive a shape corresponding to a fork shape of a substrate insertion leading end of a conveyance carriage that carries in and out the substrate.

3. The atomic layer deposition apparatus according to claim 2 , wherein the gas supply port is located above the substrate support portion, and located in the proximity of the first opening in a height direction.

4. The atomic layer deposition apparatus according to claim 1 , wherein

the second container is configured to detach from the first container after the lower portion separates from the upper portion.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 25, 2011
From: TACHIBANA, HIROYUKI; MURATA, KAZUTOSHI; MIYATAKE, NAOMASA; MORI, YASUNARI
To: MITSUI ENGINEERING & SHIPBUILDING CO., LTD.
Reel/Frame 026808/0976 →
Priority Claims (1)
JP 2009-056620 · Mar 10, 2009 · national
Continuity (1)
Related Publication 20110303147A1 · Dec 15, 2011