IP Library Granted Patent US 9,202,808
Granted Patent B2
US 9,202,808 · App. 14/231,849 · Granted Dec 1, 2015

Integrated circuit electrical protection device

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Quick Facts
Patent No.
US 9,202,808
App. No.
14/231,849
Granted
Dec 1, 2015
Kind
B2
Abstract

An integrated circuit electrical protection device is disclosed that includes a semiconductor substrate and a plurality of transistor fingers partitioned into a plurality of segments. The segments are distinguished from one another by well-ties spaced apart from each other within a source/drain region that is shared by adjacent segments.

Claims (32)

1. An integrated circuit device comprising:

a Field Effect Transistor (FET) comprising a first transistor finger and a second transistor finger, wherein the first transistor finger and the second transistor finger share a first source/drain region of a first conductivity type residing in a well region having a second conductivity type, wherein the first conductivity type is opposite the second conductivity type; and

a first well-tie between a first portion of the first source/drain region and a second portion of the first source/drain region, the first well-tie coupled to a voltage reference terminal that provides a fixed bias voltage for the well region during normal operation of the integrated circuit.

2. The device of claim 1 , wherein the first well-tie is between the first and second portions of the first source/drain region in a lateral direction.

3. The device of claim 1 , wherein the first well-tie is between the first and second portions of the first source/drain region in a transverse direction.

4. The device of claim 1 , wherein the first well-tie is surrounded by the first source/drain region.

5. The device of claim 1 further comprising:

a second well-tie between the second portion of the first source/drain region and a third portion of the first source/drain region, wherein the first well-tie and a surrounding dielectric region are surrounded by the first source/drain region.

6. The device of claim 5 , wherein the second portion of the first source/drain region is at a center location of the first source/drain region in a transverse direction.

7. The device of claim 5 , wherein the first well-tie is at a center location of the first source/drain region in a transverse direction.

8. The device of claim 5 , wherein a gate of the first transistor finger and a gate of the second transistor finger are coupled together.

9. The device of claim 5 , wherein a ratio of a first dimension to a second dimension is at least 1:1, wherein the first dimension is a shortest distance in a transverse direction between a dielectric of the first well-tie and a dielectric of the second well-tie, and the second dimension is a length of the first well-tie and its surrounding dielectric in the transverse direction.

10. The device of claim 1 , wherein a gate of the first transistor finger and a gate of the second transistor are coupled together.

11. The device of claim 1 , wherein the first source/drain region is a source region that is coupled to a second voltage reference terminal.

12. A method comprising:

providing a first current from a source/drain region of a first Field Effect Transistor (a first FET) to a first well region of the first FET in response to an overstress event;

receiving a snapback portion of the first current at a second source/drain region of the first FET; and

receiving, via a current path, a biasing portion of the first current at a second well region closer to a second FET than to the first FET, wherein the current path includes a third well region abutting a shared source/drain region that is shared by the first FET and the second FET, and that extends continuously from a gate of the first FET to a gate of the second FET.

13. A device comprising:

an integrated circuit electrical protection device comprising

a Field Effect Transistor (FET) comprising a plurality of transistor fingers, including a first transistor finger and a second transistor finger, each of the plurality of transistor fingers comprising a gate portion, a source region, and a drain region shared with another one of the plurality of transistor fingers, wherein the first transistor finger shares a first drain region with the second transistor finger, and the source region is coupled to a fixed voltage reference terminal, and

a first well-tie between a first portion of the first drain region and a second portion of the first drain region, the first well-tie coupled to the fixed voltage reference terminal that is to provide a fixed voltage during normal operation.

14. The device of claim 13 wherein the first well-tie is surrounded by the first drain region.

15. The device of claim 13 further comprising:

a second well-tie is between the second portion of the first drain region and a third portion of the first drain region.

16. The device of claim 15 , wherein the second portion of the first drain region is at a center location of the first drain region relative a width of the first drain region.

17. The device of claim 15 , wherein the first well-tie is at a center location of the first drain region in a transverse direction.

18. The device of claim 15 , wherein ratio of a dimension between a dielectric surrounding the first well-tie and a dielectric surrounding the second well-tie to a width of the first well-tie is at least 1:1, wherein the dimension and the width are relative to a width of the first drain region.

19. The device of claim 13 , wherein

the plurality of transistor fingers further include a third transistor finger and a fourth transistor finger, the third transistor finger shares a second drain region with the fourth transistor finger; and

the FET transistor further includes a second well-tie between a first portion of the second drain region and a second portion of the second drain region, the second well-tie coupled to the fixed voltage reference terminal, and the second and third transistor fingers are members of a set of the plurality of transistor fingers, wherein no well-ties reside between gates of the members of the set.

20. The device of claim 19 , wherein the first well-tie is one of a first plurality of well-ties within the first drain region, the second well-tie is one of a second plurality of well-ties within the second drain region.

Assignments (26)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040925 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Feb 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 052917/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040928 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Jan 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 052915/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050744/0097 →
CORRECTIVE ASSIGNMENT TO CORRECT THE NATURE OF CONVEYANCE PREVIOUSLY RECORDED AT REEL: 040632 FRAME: 0001. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER AND CHANGE OF NAME. Recorded Sep 21, 2017
From: FREESCALE SEMICONDUCTOR INC.
To: NXP USA, INC.
Reel/Frame 044209/0047 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
CHANGE OF NAME Recorded Nov 8, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: NXP USA, INC.
Reel/Frame 040632/0001 →
RELEASE OF SECURITY INTEREST Recorded Nov 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 040928/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 21, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 040925/0001 →
CORRECTIVE ASSIGNMENT OF INCORRECT APPLICATION 14/258,829 PREVIOUSLY RECORDED ON REEL 037444 FRAME 0109. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Aug 10, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039639/0208 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 14/258,829 AND REPLACE ITWITH 14/258,629 PREVIOUSLY RECORDED ON REEL 037444 FRAME 0082. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OFSECURITY INTEREST IN PATENTS. Recorded Aug 10, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039639/0332 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12092129 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
SUPPLEMENT TO THE SECURITY AGREEMENT Recorded Jun 16, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039138/0001 →
SECURITY AGREEMENT SUPPLEMENT Recorded Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 038017/0058 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 5, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
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ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 5, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037444/0109 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037357/0903 →
SUPPLEMENT TO IP SECURITY AGREEMENT Recorded Aug 1, 2014
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
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SUPPLEMENT TO IP SECURITY AGREEMENT Recorded Aug 1, 2014
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
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SUPPLEMENT TO IP SECURITY AGREEMENT Recorded Aug 1, 2014
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
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ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2014
From: STOCKINGER, MICHAEL A.; ZHANG, WENZHONG; ZHANG, XU
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 032570/0388 →