Circuit element including a layer of a stress-creating material providing a variable stress and method for the formation thereof
A transistor includes a source region, a drain region, a channel region, a gate electrode and a layer of a stress-creating material. The stress-creating material provides a stress that is variable in response to a signal acting on the stress-creating material. The layer of stress-creating material is arranged to provide a stress in at least the channel region. The stress provided in at least the channel region is variable in response to the signal acting on the stress-creating material. Layers of stress-creating material providing a stress that is variable in response to a signal acting on the stress-creating material may also be used in circuit elements other than transistors, for example, resistors.
1. A circuit element, comprising:
a semiconductor region; and
a layer of a stress-creating material, said stress-creating material providing a stress that is variable in response to a signal acting on said stress-creating material;
wherein said layer of stress-creating material is arranged to provide a stress in said semiconductor region, said stress provided in said semiconductor region being variable in response to said signal acting on said stress-creating material.
2. The circuit element of claim 1 , wherein said circuit element comprises a transistor comprising a source region, a drain region, a channel region and a gate electrode, and said semiconductor region wherein the variable stress is provided comprises at least said channel region.
3. The circuit element of claim 2 , wherein said signal acting on said layer of stress-creating material comprises at least one of an electric field, an electric current and a magnetic field.
4. The circuit element of claim 3 , wherein said layer of stress-creating material comprises at least one of a piezoelectric material, an electrostrictive material, a magnetostrictive material and a current-strictive material.
5. The circuit element of claim 2 , wherein said layer of stress-creating material comprises at least one of an electrostrictive material and a piezoelectric material, said circuit element comprising at least one stress-control electrode adjacent said layer of stress-creating material for applying an electric field to said layer of stress-creating material, said electric field providing said signal acting on said stress-creating material.
6. The circuit element of claim 5 , wherein said at least one stress-control electrode comprises a first and a second stress-control electrode provided on opposite sides of said layer of stress-creating material.
7. The circuit element of claim 5 , wherein said at least one stress-control electrode is provided on a side of said layer of stress-creating material that is opposite said gate electrode, wherein a voltage difference between said gate electrode and said stress-control electrode creates the electric field providing said signal acting on said stress-creating material.
8. The circuit element of claim 2 , wherein said layer of stress-creating material is formed above said source region, said drain region and said gate electrode.
9. The circuit element of claim 2 , wherein said source region, said drain region and said channel region are formed in a semiconductor material, said gate electrode is formed above said semiconductor material, and said layer of stress-creating material is formed above said semiconductor material and said gate electrode.
10. The circuit element of claim 2 , wherein said stress-creating material has a stress hysteresis, wherein at least a portion of said stress provided in response to said signal is maintained after removal of said signal.
11. The circuit element according to claim 10 , wherein said stress-creating material comprises at least one of [Pb(Zn 1/3 Nb 2/3 )O 3 ] (1-x) —[PbTiO 3 ] x , wherein x is greater than 0 and less than about 0.1, [Pb(Mg 1/3 Nb 2/3 )O 3 ] (1-x) —[PbTiO 3 ] x , wherein x is greater than 0 and less than about 0.5, and 0.99[Bi 1/2 (Na 0.82 K 0.18 ) 1/2 (Ti 1-x Zr x )O 3 ]-0.01LiSbO 3 , wherein x is in a range from about 0 to about 0.03.
12. The circuit element of claim 11 , wherein said stress-creating material comprises [Pb(Mg 1/3 Nb 2/3 )O 3 ] (1-x) —[PbTiO 3 ] x , wherein x is in a range from about 0.3 to about 0.4.
13. The circuit element of claim 2 , wherein said stress-creating material has at least one of substantially no stress hysteresis and a small stress hysteresis.
14. The circuit element of claim 13 , wherein said stress-creating material comprises Pb(Mg 1/3 Nb 2/3 )O 3 .
15. The circuit element of claim 2 , wherein said stress-creating material comprises at least one of a relaxor ferroelectric and a piezoceramic material.
16. A method, comprising:
providing a substrate comprising a semiconductor material;
forming a gate insulation layer and a gate electrode over said semiconductor material;
forming a source region and a drain region in said semiconductor material adjacent said gate electrode, a portion of said semiconductor material below said gate electrode providing a channel region; and
forming a layer of a stress-creating material over said source region, said drain region and said gate electrode, said stress-creating material providing a stress in said channel region that is variable in response to a signal acting on said stress-creating material.
17. The method of claim 16 , wherein said layer of stress-creating material comprises a magnetostrictive material, and wherein the method further comprises:
forming a dielectric material over said layer of stress-creating material; and
forming a source contact providing an electrical connection to said source region, a drain contact providing an electrical connection to said drain region and a gate contact providing an electrical connection to said gate electrode in said dielectric material.
18. The method of claim 16 , wherein said layer of stress-creating material comprises at least one of an electrostrictive material and a piezoelectric material, and wherein the method further comprises:
forming a first stress-control electrode over said layer of stress-creating material;
forming a dielectric material over said first stress-control electrode; and
forming a source contact providing an electrical connection to said source region, a drain contact providing an electrical connection to said drain region, a gate contact providing an electrical connection to said gate electrode and a first stress-control contact providing an electrical connection to said first stress-control electrode in said dielectric material.
19. The method of claim 16 , wherein the formation of said layer of stress-creating material comprises performing a pulsed laser deposition process.
20. The method of claim 19 , wherein at least one of [Pb(Zn 1/3 Nb 2/3 )O 3 ] (1-x) —[PbTiO 3 ] x , wherein x is greater than 0 and less than about 0.1, [Pb(Mg 1/3 Nb 2/3 )O 3 ] (1-x) —[PbTiO 3 ] x , wherein x is greater than 0 and less than about 0.5, in particular in a range from about 0.3 to about 0.4, Pb(Mg 1/3 Nb 2/3 )O 3 , 0.99[Bi 1/2 (Na 0.82 K 0.18 ) 1/2 (Ti 1-x Zr x )O 3 ]-0.01LiSbO 3 , wherein x is in a range from about 0 to about 0.03, a relaxor ferroelectric and a piezoceramic material is deposited in said pulsed laser deposition process.
21. A circuit element, comprising:
a semiconductor region;
a layer of a stress-creating material, said stress-creating material providing a stress that is variable in response to a signal acting on said stress-creating material, wherein said layer of stress-creating material is arranged to provide a stress in said semiconductor region, said stress provided in said semiconductor region being variable in response to said signal acting on said stress-creating material; and
a resistor, wherein said semiconductor region is electrically connected between a first resistor contact and a second resistor contact and provides a substantially ohmic resistance that is variable in response to the variable stress provided by said layer of stress-creating material.
22. The circuit element of claim 21 , wherein said layer of stress-creating material comprises at least one of an electrostrictive and a piezoelectric material, and wherein said circuit element further comprises at least one stress-control electrode adjacent said layer of stress-creating material, said electric field providing said signal acting on said stress-creating material.
23. The circuit element of claim 22 , wherein said stress-creating material has a stress hysteresis, wherein at least a portion of said stress provided in response to said signal is maintained after removal of said signal.
24. The circuit element of claim 22 , wherein said stress-creating material has at least one of substantially no stress hysteresis and a small stress hysteresis.
25. A method, comprising:
providing a substrate comprising a semiconductor material;
forming a gate insulation layer and a gate electrode over said semiconductor material;
forming a source region and a drain region in said semiconductor material adjacent said gate electrode, a portion of said semiconductor material below said gate electrode providing a channel region;
forming an electrically insulating layer over said source region, said drain region and said gate electrode;
forming a first stress-control electrode over said electrically insulating layer;
forming a layer of a stress-creating material comprising at least one of an electrostrictive material and a piezoelectric material over said first stress-control electrode and over said source region, said drain region and said gate electrode, said stress-creating material providing a stress in said channel region that is variable in response to a signal acting on said stress-creating material;
forming a second stress-control electrode over said layer of stress-creating material;
forming a dielectric material over said first stress-control electrode; and
forming a source contact providing an electrical connection to said source region, a drain contact providing an electrical connection to said drain region, a gate contact providing an electrical connection to said gate electrode and a first stress-control contact providing an electrical connection to said second stress-control electrode in said dielectric material.
26. The method of claim 25 , further comprising forming a second stress-control contact providing an electrical connection to said second stress-control electrode in said dielectric material.