Semiconductor device and method of manufacturing the same

1. A method of manufacturing a semiconductor device, comprising:

alternately forming first material layers and second material layers;

forming at least one channel layer penetrating the first material layers and the second material layers, and a charge trap layer surrounding the channel layer;

forming a slit passing through the first material layers and the second material layers;

forming recess regions exposing first regions of the charge trap layer by removing the first material layers exposed by the slits;

injecting first impurities into the first regions of the charge trap layer through the recess regions; and

forming word lines in the recess regions.

2. The method of claim 1 , wherein the charge trap layer is formed of a nitride layer undoped with impurities.

3. The method of claim 2 , after injecting the first impurities, the charge trap layer includes first regions doped with the first impurities and the second regions arranged between the first regions and undoped with impurities.

4. The method of claim 1 , wherein the charge trap layer is formed of a nitride layer doped with second impurities which is a different type from the first impurities.

5. The method of claim 1 , wherein the charge trap layer is formed of a nitride layer comprising nano-dots.

6. The method of claim 1 , further comprising:

forming nano-dots within the charge trap layer by using the first impurities as a seed after the injecting of the first impurities into the first regions of the charge trap layer.

7. The method of claim 1 , further comprising:

forming a sub-charge trap layer on inner sides of the recess regions, before the forming of the word line in the regions.

8. The method of claim 1 , further comprising:

forming a charge blocking layer on inner sides of the recess regions, before the forming of the word line in the regions.

9. The method of claim 1 , wherein the forming of the channel layer and the charge trap layer comprises:

forming a trench by etching the first material layers and the second material layers;

forming the charge trap layer on inner walls of the trench;

forming a tunnel insulating layer on the charge trap layer; and

forming the channel layer on the tunnel insulating layer.

10. The method of claim 9 , further comprising:

forming a first charge blocking layer on the inner walls of the trench before the forming of the charge trap layer; and

etching the first charge blocking layer exposed through the recess regions before the injecting of the first impurities; and

forming a second charge blocking layer on insides of the recess regions, after doping the first impurities.

11. A method of manufacturing a semiconductor device, comprising:

alternately Raining conductive layers and sacrificial layers;

forming at least one channel layer penetrating the conductive layers and the sacrificial layers, a charge trap layer surrounding the channel layer and doped with first impurities, and a charge blocking layer surrounding the charge trap layer;

forming a slit exposing the sacrificial layers by etching the conductive layers and the sacrificial layers;

removing the sacrificial layers exposed by the slits;

etching the charge blocking layer exposed by removing the sacrificial layers;

removing the charge trap layer exposed by etching the charge blocking layer; and

forming an inter-layer insulating layer in regions from which the sacrificial layers, the charge blocking layer, and the charge trap layer are removed.

12. The method of claim 11 , wherein the removing of the charge trap layer comprises etching the exposed charge trap layer.

13. The method of claim 11 , wherein the removing of the charge trap layer comprises oxidizing the exposed charge trap layer.

14. The method of claim 11 , wherein the charge trap layer is formed of a nitride layer comprising nano-dots.

15. The method of claim 11 , wherein the forming of the channel layer, the charge trap layer, and the charge blocking layer comprises:

forming a trench by etching the conductive layers and the sacrificial layers;

forming the charge blocking layer on inner walls of the trench;

forming the charge trap layer doped with the first impurities on the charge blocking layer;

forming a tunnel insulating layer on the charge trap layer; and

forming the channel layer on the tunnel insulating layer.

16. A method of manufacturing a semiconductor device, comprising:

alternately forming first material layers and second material layers;

forming at least one channel layer penetrating the first material layers and the second material layers, and a charge trap layer surrounding the channel layer;

forming a slit passing through the first material layers and the second material layers;

forming recess regions exposing first regions of the charge trap layer by removing the first material layers exposed by the slits;

injecting first impurities into the first regions of the charge trap layer through the recess regions; and

forming interlayer insulating layers in the recess regions.

17. The method of claim 16 , wherein a concentration of the first impurities injected into the first regions is higher than a concentration of second impurities included in the charge trap layers when the charge trap layers are formed.

18. The method of claim 17 , after the injecting of the first impurities, the charge trap layer includes first regions doped with the first impurities and second regions arranged between the first regions and doped with the second impurities.

19. The method of claim 16 , wherein the first impurities injected into the first regions offset the second impurities included in the charge trap layers when the charge trap layers are formed.

20. The method of claim 19 , after injecting the first impurities, the charge trap layer includes first regions undoped with impurities and the second regions arranged between the first regions and doped with the second impurities.