IP Library Granted Patent US 9,293,541
Granted Patent B2
US 9,293,541 · App. 14/734,029 · Granted Mar 22, 2016

Semiconductor device

Inventors: Shunpei Yamazaki (Tokyo, JP); Masahiro Takahashi (Kanagawa, JP); Takuya Hirohashi (Atsugi, JP); Masashi Tsubuku (Kanagawa, JP); Masashi Oota (Kanagawa, JP)
Assignee: Semiconductor Energy Laboratory Co., Ltd.
H01L29/247H01L29/24H01L29/7869H01L29/78693
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Quick Facts
Patent No.
US 9,293,541
App. No.
14/734,029
Granted
Mar 22, 2016
Kind
B2
Abstract

A highly reliable semiconductor device including an oxide semiconductor is provided. Provided is a semiconductor device including an oxide semiconductor layer, an insulating layer in contact with the oxide semiconductor layer, a gate electrode layer overlapping with the oxide semiconductor layer, and a source electrode layer and a drain electrode layer electrically connected to the oxide semiconductor layer. The oxide semiconductor layer includes a first region having a crystal whose size is less than or equal to 10 nm and a second region which overlaps with the insulating layer with the first region provided therebetween and which includes a crystal part whose c-axis is aligned in a direction parallel to a normal vector of the surface of the oxide semiconductor layer.

Claims (39)

1. An oxide semiconductor film comprising a crystalline part,

wherein the oxide semiconductor film includes carbon, a first metal, a second metal, and a third metal,

wherein the first metal is indium, the second metal is zinc, and the third metal is a different metal from indium and zinc,

wherein a size of the crystalline part is less than or equal to 10 nm, and

wherein a plurality of circumferentially distributed spots are observed in a measurement area greater than or equal to an area with a diameter of 5 nm φ and less than or equal to an area with a diameter of 10 nmφ in a nanobeam electron diffraction pattern of a cross-section of the oxide semiconductor film.

2. The oxide semiconductor film according to claim 1 , wherein a halo pattern is observed in a selected-area electron diffraction pattern of a plane of the oxide semiconductor film.

3. The oxide semiconductor film according to claim 1 , wherein the third metal is gallium.

4. The oxide semiconductor film according to claim 1 , wherein a size of the crystalline part is less than or equal to 5 nm.

5. The oxide semiconductor film according to claim 1 , further comprising an amorphous part.

6. The oxide semiconductor film according to claim 1 ,

wherein the oxide semiconductor film comprises a first region including the crystalline part, and

where the oxide semiconductor film further comprises a second region having a crystalline part whose c-axis is aligned in a direction parallel to a normal vector of a surface of the oxide semiconductor film.

7. An oxide semiconductor film comprising a crystalline part

wherein the oxide semiconductor film includes carbon, a first metal, a second metal, and a third metal,

wherein the first metal is indium, the second metal is zinc, and the third metal is a different metal from indium and zinc,

wherein a size of the crystalline part is less than or equal to 10 nm,

wherein a plurality of circumferentially distributed spots are observed in a measurement area greater than or equal to an area with a diameter of 5 nmφ and less than or equal to an area with a diameter of 10 nmφ in a nanobeam electron diffraction pattern of a cross-section of the oxide semiconductor film, and

wherein a crystalline peak is not observed in an XRD spectrum with respect to the oxide semiconductor film.

8. The oxide semiconductor film according to claim 7 , wherein a halo pattern is observed in a selected-area electron diffraction pattern of a plane of the oxide semiconductor film.

9. The oxide semiconductor film according to claim 7 , wherein the third metal is gallium.

10. The oxide semiconductor film according to claim 7 , wherein a size of the crystalline part is less than or equal to 5 nm.

11. The oxide semiconductor film according to claim 7 , wherein the XRD spectrum is measured by an out-of-plane method.

12. The oxide semiconductor film according to claim 7 , further comprising an amorphous part.

13. The oxide semiconductor film according to claim 7 ,

wherein the oxide semiconductor film comprises a first region including the crystalline part, and

where the oxide semiconductor film further comprises a second region having a crystalline part whose c-axis is aligned in a direction parallel to a normal vector of a surface of the oxide semiconductor film.

14. An oxide semiconductor film comprising a crystalline part,

wherein the oxide semiconductor film includes carbon, a first metal, a second metal, and a third metal,

wherein the first metal is indium, the second metal is zinc, and the third metal is a different metal from indium and zinc,

wherein a size of the crystalline part is less than or equal to 10 nm,

wherein a plurality of circumferentially distributed spots are observed in a nanobeam electron diffraction pattern in a measurement area greater than or equal to an area with a diameter of 5 nmφ and less than or equal to an area with a diameter of 10 nmφ in a cross-sectional direction of the measurement area of a film thinned from the oxide semiconductor film to be greater than 10 nm and less than or equal to 50 nm, and

wherein spots having order of regularity that represents a crystal state in which crystal parts are aligned with a specific plane are observed in the measurement area greater than or equal to an area with a diameter of 5 nmφ and less than or equal to an area with a diameter of 10 nmφ in the cross-sectional direction of the measurement area of a film thinned from the oxide semiconductor film to be less than or equal to 10 nm.

15. The oxide semiconductor film according to claim 14 , wherein a halo pattern is observed in a selected-area electron diffraction pattern of a plane of the oxide semiconductor film.

16. The oxide semiconductor film according to claim 14 , wherein the third metal is gallium.

17. The oxide semiconductor film according to claim 14 , wherein a size of the crystalline part is less than or equal to 5 nm.

18. The oxide semiconductor film according to claim 14 , further comprising an amorphous part.

19. The oxide semiconductor film according to claim 14 ,

wherein the oxide semiconductor film comprises a first region including the crystalline part, and

where the oxide semiconductor film further comprises a second region having a crystalline part whose c-axis is aligned in a direction parallel to a normal vector of a surface of the oxide semiconductor film.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 7, 2015
From: YAMAZAKI, SHUNPEI; TAKAHASHI, MASAHIRO; HIROHASHI, TAKUYA; TSUBUKU, MASASHI; OOTA, MASASHI
To: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Reel/Frame 036274/0951 →
Priority Claims (1)
JP 2012-288288 · Dec 28, 2012 · national
Continuity (2)
Continuation 14141538 · Dec 27, 2013
Related Publication 20150311291A1 · Oct 29, 2015