Etching method, etching apparatus, and storage medium
An etching method for anisotropically etching a Cu film on a substrate surface includes providing a substrate having a Cu film on a surface thereof in a chamber and supplying an organic compound into the chamber while setting the inside of the chamber to a vacuum state and irradiating an oxygen gas cluster ion beam to the Cu film. The etching method further includes oxidizing Cu or the Cu film to a copper oxide by oxygen gas cluster ions in the oxygen gas cluster ion beam and anisotropically etching the Cu film by reacting the copper oxide and the organic compound.
1. An etching method for anisotropically etching a Cu film on a surface of a substrate, the method comprising:
providing the substrate in a chamber and supplying a gas of an organic compound into the chamber while setting an inside of the chamber to a vacuum state, the organic compound selected from one of a carboxylic acid, aldehyde, and alcohol;
irradiating an oxygen gas cluster ion beam to the Cu film; and
oxidizing Cu of the Cu film to a copper oxide by oxygen gas cluster ions in the oxygen gas cluster ion beam and anisotropically etching the Cu film by a reaction between the copper oxide and the gas of the organic compound,
wherein said supplying the gas of the organic compound and said irradiating the oxygen gas cluster ion beam are carried out simultaneously, and
wherein said anisotropically etching the Cu film is performed in a state where a processing temperature of the substrate is controlled to be between zero degrees Celsius and a temperature lower than or equal to a boiling point of the organic compound, wherein the organic compound remains a gas during the etching process, wherein a partial pressure of the organic compound is controlled between 10 −6 torr to 10 −4 torr.
2. The etching method of claim 1 , wherein energy required for the reaction between the copper oxide and the gas of the organic compound is supplied by heat generated by collision between the oxygen gas cluster ions and the Cu film, and wherein said anisotropically etching the Cu film is performed without heating the substrate in addition to said heat generated by said collision.
3. The etching method of claim 1 , wherein the processing temperature of the substrate is lower than or equal to about 90° C.
4. The etching method of claim 3 , wherein the processing temperature of the substrate is lower than or equal to room temperature.
5. The etching method of claim 1 , wherein the processing temperature of the substrate is controlled by cooling the substrate.