Plasma reactor with conductive member in reaction chamber for shielding substrate from undesirable irradiation
Placing a conductive member between a plasma chamber in a remote plasma reactor and a substrate to shield the substrate from irradiation of undesirable electromagnetic radiation, ions or electrons. The conductive member blocks the electromagnetic radiation, neutralizes ions and absorbs the electrons. Radicals generated in the plasma chambers flows to the substrate despite the placement of the conductive member. In this way, the substrate is exposed to the radicals whereas damages to the substrate due to electromagnetic radiations, ions or electrons are reduced or removed.
1. A plasma reactor comprising:
a body formed with:
a plasma chamber configured to receive gas and generate radicals of the gas by plasma,
a reaction chamber configured to inject the generated radicals onto a substrate passing by the reaction chamber, and
at least one perforation formed in the body of the plasma reactor between the plasma chamber and the reaction chamber, the radicals travelling from the plasma chamber to the reaction chamber via the at least one perforation; and
a single conductive member placed in the reaction chamber between the substrate and the at least one perforation to shield the substrate from undesirable irradiation generated in the plasma chamber by blocking straight linear paths between the plasma chamber and the substrate, the single conductive member having a width equal to or larger than a width of the at least one perforation and having a curved surface at least a portion of which faces the at least one perforation, the generated radicals flowing around the curved surface of the single conductive member to the substrate via paths between the single conductive member and the reaction chamber.
2. The plasma reactor of claim 1 , wherein the body is further formed with a channel configured to convey gas to the plasma chamber.
3. The plasma reactor of claim 1 , wherein the single conductive member is connected to ground.
4. The plasma reactor of claim 1 , further comprising an electrode placed within the plasma chamber to generate the plasma by applying a voltage signal to the electrode.
5. The plasma reactor of claim 1 , wherein the body is further formed with a passage and at least one exhaust port, the passage configured to discharge excess radicals or gas to the exhaust port.
6. The plasma reactor of claim 5 , wherein a distance from the substrate to a ceiling of the passage is less than ⅔ of a width of the reaction chamber and is less than ⅔ of a distance from the substrate to the perforation.
7. The plasma reactor of claim 1 , wherein the curved surface is smooth.
8. The plasma reactor of claim 7 , wherein the conductive member has a circular cross-sectional shape.
9. The plasma reactor of claim 1 , wherein the conductive member is formed with a channel configured to inject another gas into the reaction chamber.
10. The plasma reactor of claim 1 , wherein the width of the single conductive member is smaller than a width of the reaction chamber.
11. The plasma reactor of claim 1 , wherein a distance from the substrate to the perforation is equal to or less than 80 mm.