IP Library Granted Patent US 9,562,825
Granted Patent B2
US 9,562,825 · App. 14/535,960 · Granted Feb 7, 2017

Shock sensor with latch mechanism and method of shock detection

Inventor: Michael Naumann (Chandler, AZ)
Assignee: NXP USA, Inc.
G01M7/08G01P15/03G01P15/036G01P15/06G01P15/0891
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Quick Facts
Patent No.
US 9,562,825
App. No.
14/535,960
Granted
Feb 7, 2017
Kind
B2
Abstract

A micromechanical shock sensor includes a proof mass coupled to a surface of a substrate and a projection element extending laterally from the proof mass. The shock sensor further includes a latch mechanism and a retention anchor. The latch mechanism has a latch spring attached to the surface and a latch tip extending from a movable end of the latch spring. The retention anchor is attached to the surface and is located proximate the latch tip. The proof mass is configured for planar movement relative to the substrate when the proof mass is subjected to a force of at least a threshold magnitude. Movement of the proof mass in response to the force causes the latch tip to become retained between the projection element and the retention anchor to place the shock sensor in a latched state. The latched state may be detected by optical inspection, probe, or external readout.

Claims (65)

1. A micromechanical shock sensor comprising:

a proof mass coupled to a surface of a substrate and configured for planar movement relative to said substrate when said proof mass is subjected to a force of at least a threshold magnitude;

a projection element extending laterally from said proof mass;

a latch mechanism having a latch spring attached to said surface and a latch tip extending from a movable end of said latch spring, wherein said latch spring comprises:

a spring anchor attached to said surface of said substrate;

a first beam structure having a first end coupled to said spring anchor; and

a second beam structure, said first and second beam structures being suspended above said surface of said substrate, said second beam structure having a third end coupled to a second end of said first beam structure, said second beam structure being arranged approximately orthogonal to said first beam structure, and said latch tip being formed on a fourth end of said second beam structure, and wherein said fourth end is said movable end; and

a retention anchor attached to said surface and located proximate said latch tip, wherein movement of said proof mass in response to said force causes said latch tip to become retained between said projection element and said retention anchor to place said shock sensor in a latched state.

2. The micromechanical shock sensor of claim 1 wherein:

said first beam structure is characterized by a first lengthwise dimension that is arranged approximately parallel to a direction of movement of said proof mass; and

said second beam structure is characterized by a second lengthwise dimension that is arranged approximately perpendicular to said direction of movement of said proof mass, said first lengthwise dimension being greater than said second lengthwise dimension.

3. The micromechanical shock sensor of claim 1 wherein:

said first beam structure is characterized by a first stiffness; and

said second beam structure is characterized by a second stiffness, said second stiffness being greater than said first stiffness.

4. The micromechanical shock sensor of claim 1 wherein said latch mechanism further includes a mass element coupled to said first beam structure and suspended above said surface of said substrate.

5. The micromechanical shock sensor of claim 4 wherein said mass element is coupled to said first beam structure at a location that is distal from said second end of said first beam structure.

6. The micromechanical shock sensor of claim 1 wherein:

said second beam structure is positioned adjacent to a first side of said retention anchor; and

said latch tip extends laterally from said fourth end of said second beam structure so that said latch tip is positioned adjacent to a second side of said retention anchor when said shock sensor is in said latched state, said second side of said retention anchor facing said projection element.

7. The micromechanical shock sensor of claim 1 wherein:

said projection element includes a first strike surface and a first latch surface opposing said first strike surface; and

said latch tip includes a second strike surface and a second latch surface opposing said second strike surface, said second strike surface facing said first strike surface prior to movement of said proof mass, and said second latch surface abutting said first latch surface when said shock sensor is in said latched state.

8. The micromechanical shock sensor of claim 1 wherein said planar movement of said proof mass is in a first direction, said projection element is a first projection element, said latch mechanism is a first latch mechanism, said latch spring is a first latch spring, and said micromechanical shock sensor further comprises:

a beam structure coupled to said substrate and configured for said planar movement relative to said substrate, said beam structure being adapted to move in a second direction when subjected to a second force;

a second projection element extending laterally from said beam structure;

a second latch mechanism having a second latch spring attached to said surface and a second latch tip extending from a second movable end of said second latch spring; and

a second retention anchor attached to said surface and located proximate said second latch tip, wherein movement of said beam structure in said second direction in response to said second force causes said second latch tip to become retained between said second projection element and said second retention anchor.

9. The micromechanical shock sensor of claim 1 further comprising a plurality of projection elements extending from said proof mass, wherein when said proof mass moves in response to said force, said latch tip engages with one of said plurality of projection elements depending upon a magnitude of said force applied to said proof mass.

10. The micromechanical shock sensor of claim 1 further comprising an indicator for indicating that said shock sensor is in said latched state.

11. A micromechanical shock sensor comprising:

a proof mass coupled to a surface of a substrate and configured for planar movement relative to said substrate when said proof mass is subjected to a force of at least a threshold magnitude;

a projection element extending laterally from said proof mass, said projection element including a first strike surface and a first latch surface opposing said first strike surface;

a latch mechanism having a latch spring attached to said surface and a latch tip extending from a movable end of said latch spring, said latch tip including a second strike surface and a second latch surface opposing said second strike surface, said second strike surface facing said first strike surface prior to movement of said proof mass; and

a retention anchor attached to said surface and located proximate said latch tip, wherein movement of said proof mass in response to said force causes said latch tip to become retained between said projection element and said retention anchor to place said shock sensor in a latched state, and said second latch surface abuts said first latch surface when said shock sensor is in said latched state, wherein said second latch surface comprises an indent region and said first latch surface resides in said indent region when said shock sensor is in said latched state.

12. A micromechanical shock sensor comprising:

a proof mass coupled to a surface of a substrate and configured for planar movement relative to said substrate when said proof mass is subjected to a force of at least a threshold magnitude;

a first anchor attached to said surface of said substrate;

a second anchor attached to said surface of said substrate, said first and second anchors being located on opposing sides of an axis of said proof mass, wherein said proof mass is configured to move in a first direction that is approximately orthogonal to said axis;

a first spring attached between said first anchor and said proof mass;

a second spring attached between said second anchor and said proof mass;

a connector beam interconnecting said first spring with said second spring;

a projection element extending laterally from said proof mass;

a latch mechanism having a latch spring attached to said surface and a latch tip extending from a movable end of said latch spring; and

a retention anchor attached to said surface and located proximate said latch tip, wherein movement of said proof mass in response to said force causes said latch tip to become retained between said projection element and said retention anchor to place said shock sensor in a latched state.

13. A micromechanical shock sensor comprising:

a proof mass coupled to a surface of a substrate and configured for planar movement in a first direction relative to said substrate when said proof mass is subjected to a force of at least a threshold magnitude, wherein said proof mass comprises a retaining element extending laterally from said proof mass;

a first projection element extending laterally from said proof mass;

a first latch mechanism having a first latch spring attached to said surface and a first latch tip extending from a movable end of said latch spring;

a beam structure coupled to said substrate and configured for said planar movement relative to said substrate, said beam structure being adapted to move in a second direction when subjected to a second force, said beam structure comprising a fastener element extending laterally from said beam structure;

a second projection element extending laterally from said beam structure;

a second latch mechanism having a second latch spring attached to said surface and a second latch tip extending from a second movable end of said second latch spring;

a first retention anchor attached to said surface and located proximate said latch tip, wherein movement of said proof mass in response to said force causes said latch tip to become retained between said projection element and said retention anchor to place said shock sensor in a latched state; and

a second retention anchor attached to said surface and located proximate said second latch tip, wherein movement of said beam structure in said second direction in response to said second force causes said second latch tip to become retained between said second projection element and said second retention anchor, wherein:

prior to movement of said beam structure, said fastener element is engaged with said retaining element to prevent movement of said proof mass, and

when said second latch tip is retained between said second projection element and said second retention anchor, said fastener element is disengages from said retaining element to enable movement of said proof mass.

14. A device comprising:

a micromechanical shock sensor, said shock sensor including:

a proof mass coupled to a surface of a substrate and configured for planar movement relative to said substrate when said proof mass is subjected to a force of at least a predetermined magnitude;

a projection element extending laterally from said proof mass, said projection element including a first strike surface and a first latch surface opposing said first strike surface;

a latch mechanism having a latch spring and a latch tip, said latch spring including:

a spring anchor attached to said surface of said substrate;

a first beam structure having a first end coupled to said spring anchor; and

a second beam structure, said first and second beam structures being suspended above said surface of said substrate, and said second beam structure having a third end coupled to a second end of said first beam structure, said second beam structure being arranged approximately orthogonal to said first beam structure, said latch tip extending from a fourth end of said second beam structure, said latch tip including a second strike surface and a second latch surface opposing said second strike surface, said second strike surface facing said first strike surface prior to movement of said proof mass; and

a retention anchor attached to said surface and located proximate said latch tip, wherein movement of said proof mass in response to said force causes said first strike surface of said projection element to strike said second strike surface of said latch tip to cause said latch tip to become retained between said projection element and said retention anchor to place said shock sensor in a latch state, said second latch surface abutting said first latch surface when said shock sensor is in said latched state.

15. The device of claim 14 wherein said latch mechanism further comprises a mass element coupled to said first beam structure and suspended above said surface of said substrate, said mass element being coupled to said first beam structure at a location that is distal from said second end of said first beam structure.

Assignments (12)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 19, 2026
From: NXP USA, INC.
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 075126/0465 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050744/0097 →
CORRECTIVE ASSIGNMENT TO CORRECT THE NATURE OF CONVEYANCE PREVIOUSLY RECORDED AT REEL: 040626 FRAME: 0683. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER AND CHANGE OF NAME EFFECTIVE NOVEMBER 7, 2016. Recorded Jan 12, 2017
From: NXP SEMICONDUCTORS USA, INC. (MERGED INTO); FREESCALE SEMICONDUCTOR, INC. (UNDER)
To: NXP USA, INC.
Reel/Frame 041414/0883 →
CHANGE OF NAME Recorded Nov 16, 2016
From: FREESCALE SEMICONDUCTOR INC.
To: NXP USA, INC.
Reel/Frame 040626/0683 →
SUPPLEMENT TO THE SECURITY AGREEMENT Recorded Jun 16, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039138/0001 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 5, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037444/0444 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 5, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037444/0535 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037358/0001 →
SUPPLEMENT TO IP SECURITY AGREEMENT Recorded Feb 18, 2015
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 035033/0001 →
SUPPLEMENT TO IP SECURITY AGREEMENT Recorded Feb 18, 2015
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 035033/0923 →
SUPPLEMENT TO IP SECURITY AGREEMENT Recorded Feb 18, 2015
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 035034/0019 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 7, 2014
From: NAUMANN, MICHAEL
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 034128/0915 →
Continuity (1)
Related Publication 20160131552A1 · May 12, 2016