Substrate transfer method with a second positioning step
A substrate transfer method includes a step of placing a first and a second substrate on a first and a second alignment part which are arranged to be vertically spaced from each other by using a first and a second pick. The method further includes a first positioning step of positioning the first pick at a first reception position determined based on an alignment position for the first substrate, a first receiving step of receiving the first substrate from the first alignment part by moving the first pick. The method further includes a second positioning step of positioning the second pick at a second reception position determined based on an alignment position for the second substrate, and a second receiving step of receiving the second substrate from the second alignment part by moving the second pick.
1. A substrate transfer method comprising:
a step of placing a first substrate and a second substrate on a first alignment part and a second alignment part which are arranged to be vertically spaced from each other, respectively, by using a first pick and a second pick for holding the first substrate and the second substrate to be vertically spaced from each other, respectively;
a first positioning step of positioning the first pick at a first reception position determined based on an alignment position for the first substrate aligned by the first alignment part;
a first receiving step of receiving the first substrate from the first alignment part by moving the first pick vertically;
a second positioning step of positioning the second pick at a second reception position determined based on an alignment position for the second substrate aligned by the second alignment part; and
a second receiving step of receiving the second substrate from the second alignment part by moving the second pick vertically;
wherein a first distance between the bottom surface of the first substrate held on the first pick and the bottom surface of the second substrate held on the second pick is different from a second distance between the bottom surface of the first substrate placed on the first alignment part and the bottom surface of the second substrate placed on the second alignment part;
wherein the second positioning step is performed by moving the first pick and the second pick horizontally in a state where the first pick holds the first substrate; and
wherein the first pick and the second pick are provided on a same arm and are simultaneously moved in a same direction.
2. The substrate transfer method of claim 1 , further comprising a retreating step of retreating the first and the second substrate from the first and second alignment part after performing the second receiving step in a state where the first and the second pick hold the first and the second substrate, respectively.
3. The substrate transfer method of claim 1 , wherein the first distance is smaller than the second distance.
4. The substrate transfer method of claim 1 , wherein the first distance is a minimal distance between the bottom surface of the first substrate and the bottom surface of the second substrate when the first substrate and the second substrate are held in a substrate transfer container.
5. The substrate transfer method of claim 1 , wherein the second receiving step is performed by moving the first pick and the second pick vertically in a state where the first pick holds the first substrate.
6. The substrate transfer method of claim 5 , further comprising a retreating step of retreating the first and the second substrate from the first and second alignment part after performing the second receiving step in a state where the first and the second pick hold the first and the second substrate, respectively.