Substrate having annealed aluminum nitride layer formed thereon and method for manufacturing the same

1. A multi-layered substrate comprising:

a base substrate made of a material selected from the group consisting of sapphire, silicon carbide (SiC), and aluminum nitride (AlN); and

an annealed aluminum nitride layer formed on the base substrate and having a thickness of at least 100 nm,

wherein the annealed aluminum nitride layer is formed by forming an aluminum nitride layer on the base substrate at a forming temperature; and annealing the aluminum nitride layer at an annealing temperature that is above the forming temperature and in a mixed gas atmosphere comprising nitrogen gas (N 2 ) and carbon monoxide gas (CO), and

wherein the mixed gas atmosphere has a mixture ratio of N 2 gas/CO gas that ranges from 0.95/0.05 to 0.4/0.6.

2. The multi-layered substrate according to claim 1 , wherein the annealing temperature and the mixture ratio of the mixed gas atmosphere are determined on the basis of a phase stability diagram of an Al 2 O 3 —AlN—C—N 2 —CO system so that the annealing temperature ranges from 1500° C. to 1750° C., and the mixture ratio ranges from 0.95/0.05 to 0.4/0.6.

3. The multi-layered substrate according to claim 1 , wherein the annealing temperature and the mixture ratio are set, within a phase stability diagram of an Al 2 O 3 —AlN—C—N 2 —CO system, to be in a vicinity of a temperature and a mixture ratio at which a chemical equilibrium coexistence state is exhibited between an AlN phase and an Al 2 O 3 phase so that the annealing temperature ranges from 1500° C. to 1750° C. and the mixture ratio ranges from 0.95/0.05 to 0.4/0.6.

4. The multi-layered substrate according to claim 1 , further comprising an upper layer made of Al x Ga y In (1-x-y) N layer where (0≦x≦1, 0≦y≦1, and x+y≦1), formed by regrowth on at least a portion of the annealed aluminum nitride layer.

5. The multi-layered substrate according to claim 4 , wherein the annealed aluminum nitride layer has a concentration of carbon (C) that is greater than that included in a region of the upper layer, excluding a surface portion in a vicinity of a surface thereof.

6. The multi-layered substrate according to claim 4 , wherein at least one of the annealed aluminum nitride layer and the upper layer has a (10-12) plane having at least one of:

(a) an x-ray diffraction rocking curve having a full width at half maximum of the (10-12) plane that is 300 arcsec or less, and

(b) a surface roughness root mean square (RMS) that is 1.5 nm or less.

7. The multi-layered substrate according to claim 4 , wherein the annealed aluminum nitride layer has a concentration of carbon (C) that is greater than that of the upper layer except for a portion of the upper layer that is adjacent to a boundary surface between the annealed aluminum nitride layer and the upper layer.

8. The multi-layered substrate according to claim 7 , wherein the annealed aluminum nitride layer has a concentration of carbon (C) that ranges from 10 18 to 10 19 atoms/cm 3 , and a concentration of oxygen (O) that is 10 20 atoms/cm 3 or greater.

9. The multi-layered substrate according to claim 7 , wherein the annealed aluminum nitride layer has a thickness ranging from 100 nm to 3000 nm.

10. The multi-layered substrate according to claim 9 , wherein the annealed aluminum nitride layer has the thickness ranging from 100 nm to 1000 nm.

11. The multi-layered substrate according to claim 1 , wherein the annealed aluminum nitride layer has a concentration of carbon (C) that ranges from 10 18 to 10 19 atoms/cm 3 , and a concentration of oxygen (O) that is 10 20 atoms/cm 3 or greater.

12. A method for manufacturing a multi-layered substrate, comprising:

forming an aluminum nitride layer having a thickness of at least 100 nm on a base substrate at a forming temperature; and

annealing the aluminum nitride layer to form an annealed aluminum nitride layer at an annealing temperature that is above the forming temperature and in a mixed gas atmosphere comprising nitrogen gas (N 2 ) and carbon monoxide gas (CO) present in a mixture ratio of N 2 gas/CO gas that ranges from 0.95/0.05 to 0.4/0.6.

13. The method according to claim 12 , wherein the annealing temperature and the mixture ratio during the annealing are determined on the basis of a phase stability diagram of an Al 2 O 3 —AlN—C—N 2 —CO system, the annealing temperature ranging from 1500° C. to 1750° C., and the mixture ratio ranging from 0.95/0.05 to 0.4/0.6.

14. The method according to claim 13 , further comprising regrowing an upper layer that is made of Al x Ga y In (1-x-y) N layer (0≦x≦1, 0≦y<1, and x+y≦1), on at least a portion of the annealed aluminum nitride-(AlN) layer.

15. The method according to claim 13 , wherein the aluminum nitride layer is formed on the base substrate to have a thickness that ranges from 100 nm to 3000 nm.

16. The method according to claim 12 , wherein the annealing temperature and the mixture ratio during annealing are set, within a phase stability diagram of an Al 2 O 3 —AlN—C—N 2 —CO system, to be in a vicinity of a temperature and mixture ratio at which a chemical equilibrium coexistence state is exhibited between an AlN phase and an Al 2 O 3 phase so that the annealing temperature ranges from 1500° C. to 1750° C. and the mixture ratio ranges from 0.95/0.05 to 0.4/0.6.

17. The method according to claim 12 , wherein forming the aluminum nitride layer is accomplished using any one of metal organic vapor phase epitaxy (MOVPE), sputtering, hydride vapor phase epitaxy (HVPE), and molecular beam epitaxy (MBE).