Integrated photodetector waveguide structure with alignment tolerance
An encapsulated integrated photodetector waveguide structures with alignment tolerance and methods of manufacture are disclosed. The method includes forming a waveguide structure bounded by one or more shallow trench isolation (STI) structure(s). The method further includes forming a photodetector fully landed on the waveguide structure.
1. A method comprising:
forming a waveguide structure bounded by one or more shallow trench isolation (STI) structure(s); and
forming a photodetector fully landed on the waveguide structure,
wherein the photodetector lies within lateral boundaries of the waveguide structure, as defined by divots or recesses formed in the STI structure(s), and
wherein the photodetector is landed directly on a planar surface of the waveguide structure.
2. The method of claim 1 , wherein the waveguide structure is formed from silicon material or silicon on insulator material.
3. The method of claim 1 , wherein the forming of the waveguide structure comprises:
patterning silicon based material to form one or more trenches extending to an underlying insulator layer; and
forming insulator material in the one or more trenches to form the STI structure(s).
4. The method of claim 1 , wherein the forming the photodetector comprises:
forming an encapsulating material with a window exposing a portion of the waveguide structure;
forming sensor material on the encapsulating material and the exposed portion of the waveguide structure;
forming an upper encapsulating material on the sensor material and landing on the encapsulating material to seal the sensor material; and
crystallizing the sensor material through an annealing process,
wherein the encapsulating material, the sensor material and the upper encapsulating material are formed within lateral boundaries of the waveguide structure.
5. A method comprising:
forming a waveguide structure bounded by one or more shallow trench isolation (STI) structure(s); and
forming a photodetector fully landed on the waveguide structure,
wherein the forming the photodetector comprises:
forming an encapsulating material with a window exposing a portion of the waveguide structure;
forming sensor material on the encapsulating material and the exposed portion of the waveguide structure;
forming an upper encapsulating material on the sensor material and landing on the encapsulating material to seal the sensor material; and
crystallizing the sensor material through an annealing process,
wherein the encapsulating material, the sensor material and the upper encapsulating material are formed within lateral boundaries of the waveguide structure as defined by divots or recesses formed in the STI structure(s), and
wherein the waveguide structure is formed with a tapered portion.
6. The method of claim 1 , wherein the divots or recesses are formed in the STI structure at a junction between the STI structure and the waveguide structure.
7. The method of claim 4 , further comprising removing the encapsulating material from an upper surface of each of the one or more shallow trench isolation (STI) structure(s).
8. The method of claim 4 , further comprising etching the encapsulating material from the divots or recesses.
9. The method of claim 5 , wherein the photodetector is landed directly on a planar surface of the waveguide structure.
10. The method of claim 5 , wherein the upper encapsulating material is formed on side walls and an upper surface of the sensor material to fully seal the sensor material.
11. The method of claim 5 , wherein the upper encapsulating material directly contacts an upper surface of the waveguide structure.
12. A method comprising:
forming a waveguide structure bounded by one or more shallow trench isolation (STI) structure(s); and
forming a photodetector fully landed on the waveguide structure,
wherein the photodetector lies within lateral boundaries of the waveguide structure, as defined by divots or recesses formed in the STI structure(s),
wherein the photodetector is formed with a tapered input end, fully landed on the waveguide structure, and
wherein the photodetector is landed directly on a planar surface of the waveguide structure.
13. A method comprising:
forming a waveguide structure bounded by one or more shallow trench isolation (STI) structure(s);
forming a photodetector fully landed on the waveguide structure, wherein the photodetector lies within lateral boundaries of the waveguide structure, as defined by divots or recesses formed in the STI structure(s), and wherein the photodetector is formed with a tapered input end, fully landed on the waveguide structure; and
forming an upper encapsulating material on sidewalls and an upper surface of a sensor material of the photodetector.