Vertical fin field-effect semiconductor device
View Patent ↗A vertical FinFET semiconductor device and a method of forming the same are disclosed. In one aspect, the semiconductor device includes a current-blocking structure formed over a semiconductor structure and a semiconductor fin formed on the current-blocking structure. The current blocking structure includes a first layer of a first conductive type, a layer of a second conductive type over the first layer, and a second layer of the first conductive type over the layer of the second conductive type. The semiconductor fin has a doped bottom portion contacting the current-blocking structure, a doped top portion formed vertically opposite to the doped bottom portion and a channel portion vertically interposed between the doped bottom portion and the doped top portion.
1. A vertical FinFET semiconductor device, comprising:
a semiconductor substrate that is not formed of silicon on insulator (SOI);
a current-blocking structure formed over the semiconductor substrate an extending in a lateral direction, the current-blocking structure comprising:
a first layer of a first conductive type,
a layer of a second conductive type over the first layer, and
a second layer of the first conductive type over the layer of the second conductive type; and
at least one semiconductor fin formed on the current-blocking structure and extending in a vertical direction, wherein the semiconductor fin has a first side and a second side opposing and substantially parallel to each other, and wherein the semiconductor fin comprises:
a doped bottom portion contacting the second layer of the current-blocking structure,
a doped top portion formed vertically opposite to the doped bottom portion, and
a channel portion vertically interposed between the doped bottom portion and the doped top portion.
2. The vertical FinFET semiconductor device according to claim 1 , wherein the semiconductor fin has a thickness in a range between about 2 nm and about 6 nm.
3. The vertical FinFET semiconductor device according to claim 2 , further comprising a gate electrode formed on the first side of the semiconductor fin and extending in the vertical direction, wherein the gate electrode is separated from the semiconductor fin by a gate dielectric.
4. The vertical FinFET semiconductor device according to claim 3 , wherein the gate electrode is formed only on the first side of the semiconductor fin.
5. The vertical FinFET semiconductor device according to claim 3 , further comprising a bottom electrode formed on and contacting the doped bottom portion of the semiconductor fin at least on the second side.
6. The vertical FinFET semiconductor device according to claim 5 , wherein the bottom electrode is formed only on the second side of the semiconductor fin, such that the gate electrode and the bottom electrode are formed on opposite sides of the semiconductor fin.
7. The vertical FinFET semiconductor device according claim 5 , further comprising a gate contact connected to the gate electrode and a bottom contact connected to the bottom electrode, wherein the gate contact and the bottom contact are formed on opposite sides of the semiconductor fin.
8. The vertical FinFET semiconductor device according to claim 5 , further comprising a gate contact connected to the gate electrode and a bottom contact connected to the bottom electrode, wherein the gate contact and the bottom contact are formed on a same side of the semiconductor fin.
9. The vertical FinFET semiconductor device according to claim 5 , wherein the bottom contact is situated in a prolongation of the length of the semiconductor fin.
10. The vertical FinFET semiconductor device according to claim 3 , further comprising a gate electrode formed on all vertically extending sides of the channel portion such that the gate electrode surrounds the semiconductor fin, the gate electrode separated from the semiconductor fin by a gate dielectric on all vertically extending sides of the semiconductor fin.
11. The vertical FinFET semiconductor device according to claim 10 , further comprising a bottom electrode formed on all vertically extending sides of the doped bottom portion such that the bottom electrode surrounds the semiconductor fin.
12. The vertical FinFET semiconductor device according to claim 1 , wherein the substrate is a monocrystalline semiconductor substrate.
13. The vertical FinFET semiconductor device according to claim 1 , wherein the semiconductor fin and the substrate are formed of a monocrystalline semiconductor material and are epitaxially aligned to each other.
14. The vertical FinFET semiconductor device according to claim 1 , wherein each of the doped bottom portion and the doped top portion is homogeneously doped.
15. The vertical FinFET semiconductor device according to claim 14 , wherein boundaries between the channel portion and the doped bottom portion and between the channel portion and the doped top portion are abruptly defined.
16. The vertical FinFET semiconductor device according to claim 14 , wherein each of the doped bottom portion, the channel portion and the doped top portion is homogeneously doped with a same dopant such that the semiconductor device is a junctionless FinFET device semiconductor device that does not have a semiconductor junction formed between the channel portion and the doped bottom portion or between the channel portion and the doped top portion.
17. A vertical FinFET semiconductor device, comprising:
a semiconductor substrate;
a current-blocking structure formed over the semiconductor substrate and extending in a lateral direction, the current-blocking structure comprising:
a first layer of a first conductive type,
a layer of a second conductive type over the first layer, and
a second layer of the first conductive type over the layer of the second conductive type;
at least one semiconductor fin formed on the current-blocking structure and extending in a vertical direction, wherein the semiconductor fin has a first side and a second side opposing and substantially parallel to each other, and wherein the semiconductor fin comprises:
a doped bottom portion contacting the second layer of the current-blocking structure,
a doped top portion formed vertically opposite to the doped bottom portion, and
a channel portion vertically interposed between the doped bottom portion and the doped top portion; and
a top electrode disposed on the doped top portion of the semiconductor fin.
18. A vertical FinFET semiconductor device, comprising:
a semiconductor substrate;
a current-blocking structure formed over the semiconductor substrate and extending in a lateral direction, the current-blocking structure comprising:
a first layer of a first conductive type,
a layer of a second conductive type over the first layer, and
a second layer of the first conductive type over the layer of the second conductive type; and
a plurality of semiconductor fins formed on the current-blocking structure, wherein each semiconductor fin extends in a vertical direction and has a first side and a second side opposing and substantially parallel to each other, and wherein each of the semiconductor fins comprises:
a doped bottom portion contacting the second layer of the current-blocking structure,
a doped top portion formed vertically opposite to the doped bottom portion, and
a channel portion vertically interposed between the doped bottom portion and the doped top portion,
wherein the plurality of semiconductor fins share a common gate electrode, a common bottom electrode and a common top electrode.