Three-dimensional 3D-oP-based package
View Patent ↗The present invention discloses a three-dimensional 3D-oP (three-dimensional offset-printed memory)-based package (3D 2 -oP). The mask-patterns for different dice in a same 3D 2 -oP package are merged onto a same data-mask. At different printing steps, a wafer is offset by different values with respect to the data-mask. Accordingly, data-patterns from a same data-mask are printed into different dice in a same 3D 2 -oP package.
1. A three-dimensional 3D-oP (three-dimensional offset-printed memory)-based package (3D 2 -oP), comprising a first 3D-oP die and a second 3D-oP die with said second 3D-oP die stacked above said first 3D-oP die, wherein:
said first 3D-oP die comprises first and second data-coding layers with said second data-coding layer located above said first data-coding layer, said first data-coding layer storing a first data-array and said second data-coding layer storing a second data-array;
said second 3D-oP die comprises third and fourth data-coding layers with said fourth data-coding layer located above said third data-coding layer, said third data-coding layer storing a third data-array and said fourth data-coding layer storing a fourth data-array;
wherein all 3D2-oP packages in a same 3D2-oP batch have a same data-array set; and at least two 3D2-oP packages in said batch have different data-array sequences.
2. The 3D 2 -oP according to claim 1 , wherein said first 3D-oP die comprises first and second memory levels with said second memory level located above said first memory level, said first memory level comprising said first data-coding layer and said second memory level comprising said second data-coding layer.
3. The 3D 2 -oP according to claim 2 , wherein said first 3D-oP die further comprises a first configurable-input for configuring the input of said first 3D-oP die based on the data-array sequence in said first 3D-oP die.
4. The 3D 2 -oP according to claim 1 , wherein said second 3D-oP die comprises a third memory level and a fourth memory level above said third memory level, said third memory level comprising said third data-coding layer and said fourth memory level comprising said fourth data-coding layer.
5. The 3D 2 -oP according to claim 4 , wherein said second 3D-oP die further comprises a second configurable-input for configuring the input of said second 3D-oP die based on the data-array sequence in said second 3D-oP die.
6. The 3D 2 -oP according to claim 1 , wherein said first 3D-oP die comprises a first memory level having said first and second data-coding layers.
7. The 3D 2 -oP according to claim 6 , wherein said first 3D-oP die further comprises a first configurable-output for configuring the output of said first 3D-oP die based on the data-array sequence in said first 3D-oP die.
8. The 3D 2 -oP according to claim 7 , wherein said second 3D-oP die comprises a second memory level having said third and fourth data-coding layers.
9. The 3D 2 -oP according to claim 8 , wherein said second 3D-oP die further comprises a second configurable-output for configuring the output of said second 3D-oP die based on the data-array sequence in said second 3D-oP die.
10. A batch of three-dimensional 3D-oP (three-dimensional offset-printed memory)-based package (3D 2 -oP), comprising first and second 3D 2 -oP packages, wherein:
said first 3D2-oP package comprises at least a first 3D-oP die and a second 3D-oP die with said second 3D-oP die stacked above said first 3D-oP die, wherein:
said first 3D-oP die comprising first and second data-coding layers with said second data-coding layer located above said first data-coding layer, said first data-coding layer storing a first data-array and said second data-coding layer storing a second data-array; and
said second 3D-oP die comprising third and fourth data-coding layers with said fourth data-coding layer located above said third data-coding layer, said third data-coding layer storing a third data-array and said fourth data-coding layer storing a fourth data-array;
said second 3D2-oP package comprises at least a third 3D-oP die and a fourth 3D-oP die with said fourth 3D-oP die stacked above said third 3D-oP die, wherein:
said third 3D-oP die comprising fifth and sixth data-coding layers with said sixth data-coding layer located above said fifth data-coding layer, said fifth data-coding layer storing said second data-array and said sixth data-coding layer storing said first data-array; and
said fourth 3D-oP die comprising seventh and eighth data-coding layers with said eighth data-coding layer located above said seventh data-coding layer, said seventh data-coding layer storing said fourth data-array and said eighth data-coding layer storing said third data-array.
11. The 3D 2 -oP batch according to claim 10 , wherein:
said first 3D-oP die comprises first and second memory levels with said second memory level located above said first memory level, said first memory level comprising said first data-coding layer and said second memory level comprising said second data-coding layer;
said third 3D-oP die comprises fifth and sixth memory levels with said sixth memory level located above said fifth memory level, said fifth memory level comprising said fifth data-coding layer and said sixth memory level comprising said sixth data-coding layer.
12. The 3D 2 -oP batch according to claim 11 , wherein said first or third 3D-oP die further comprises a configurable-input for configuring the input of said 3D-oP die based on the data-array sequence.
13. The 3D 2 -oP batch according to claim 10 , wherein:
said second 3D-oP die comprises third and fourth memory levels with said fourth memory level located above said third memory level, said third memory level comprising said third data-coding layer and said fourth memory level comprising said fourth data-coding layer;
said fourth 3D-oP die comprises seventh and eighth memory levels with said eighth memory level located above said seventh memory level, said seventh memory level comprising said seventh data-coding layer and said eighth memory level comprising said eighth data-coding layer.
14. The batch of 3D 2 -oP according to claim 13 , wherein said third or fourth 3D-oP die further comprises a configurable-input for configuring the input of said 3D-oP die based on the data-array sequence.
15. The 3D 2 -oP batch according to claim 10 , wherein:
said first 3D-oP die comprises a first memory level, said first memory level comprising said first and second data-coding layers;
said third 3D-oP die comprises a third memory level, said third memory level comprising said fifth and sixth data-coding layers.
16. The batch of 3D 2 -oP according to claim 15 , wherein said first or third 3D-oP die further comprises a configurable-output for configuring the output of said 3D-oP die based on the data-array sequence.
17. The 3D 2 -oP batch according to claim 10 , wherein:
said second 3D-oP die comprises a second memory level, said second memory level comprising said third and fourth data-coding layers;
said fourth 3D-oP die comprises a fourth memory level, said fourth memory level comprising said seventh and eighth data-coding layers.
18. The batch of 3D 2 -oP according to claim 17 , wherein said second or fourth 3D-oP die further comprises a configurable-output for configuring the output of said 3D-oP die based on the data-array sequence.