IP Library › Assignment 070917/0043
Patent Assignment
Reel/Frame 070917/0043

Assignment of Assignor's Interest

Recorded: 2025-04-23 Pages: 11
Assignor
ZHANG, GUOBIAO, DR.
Executed: 2021-03-28
Assignee
HANGZHOU HAICUN INFORMATION TECHNOLOGY CO., LTD.
ROOM 699, UNIT 81, 6TH FLOOR, BUILDING 2E, 688 BINAN ROAD, BINJIANG DISTRICT, HANGZHOU, 310051, CHINA
Covered Properties (9)
Three-Dimensional Offset-Printed Memory with Multiple Bits-Per-Cell
Patent: 9,741,448 →
Application: 15/371,127 →
Publication: US 2017/0084348
Three-Dimensional 3D-oP-Based Package
Patent: 9,741,697 →
Application: 15/381,073 →
Publication: US 2017/0098632
Configurable Gate Array Based on Three-Dimensional Printed Memory
Patent: 9,948,306 →
Application: 15/450,017 →
Publication: US 2017/0257100
Offset-Printing Method for Three-Dimensional Printed Memory
Patent: 9,959,910 →
Application: 15/371,235 →
Publication: US 2017/0084621
Offset-Printing Method for Three-Dimensional Printed Memory with Multiple Bits-Per-Cell
Patent: 9,990,960 →
Application: 15/381,064 →
Publication: US 2017/0098650
Compact Three-Dimensional Mask-Programmed Read-Only Memory
Application: 15/455,178 →
Publication: US 2017/0186811
Music-Based Positioning Aided By Dead Reckoning
Application: 15/382,735 →
Publication: US 2017/0097239
Configurable Gate Array Based on Three-Dimensional Writable Memory
Application: 15/784,077 →
Publication: US 2018/0041216
Configurable Computing Array Die Based on Printed Memory and Two-Sided Integration
Application: 15/917,520 →
Publication: US 2018/0198448
Related Assignments (2)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 30, 2025
From: HANGZHOU HAICUN INFORMATION TECHNOLOGY CO., LTD.
To: SHENZHEN CUNYANG TECHNOLOGY CO., LTD.
Reel/Frame 072727/0345 →
Assignment of Assignor's Interest Oct 30, 2025
From: HANGZHOU HAICUN INFORMATION TECHNOLOGY CO., LTD.
To: SHENZHEN CUNTIAN TECHNOLOGY CO., LTD.
Reel/Frame 072727/0390 →