Configurable gate array based on three-dimensional printed memory
View Patent ↗The present invention discloses a configurable gate array based on three-dimensional printed memory (3D-P). It comprises an array of configurable computing elements, an array of configurable logic elements and a plurality of configurable interconnects. Each configurable computing element can selectively realize a math function from a math library. It comprises a plurality of 3D-P arrays storing the look-up tables (LUT) for the math functions in the math library.
1. A configurable computing element selectively realizing a first or second math function, comprising:
a semiconductor substrate including transistors thereon;
at least first and second three-dimensional printed memory (3D-P) arrays stacked above said semiconductor substrate, wherein said first 3D-P array stores at least a first portion of a first look-up table (LUT) for said first math function, and said second 3D-P array stores at least a second portion of a second LUT for said second math function;
at least a configurable interconnect coupling with said first and second 3D-P arrays, wherein said configurable computing element selectively realizes said first or second math function depending upon at least a configuration signal on said configurable interconnect.
2. The configurable computing element according to claim 1 , wherein said first and second 3D-P arrays are placed side-by-side on said substrate.
3. The configurable computing element according to claim 1 , wherein said second 3D-P array is stacked above said first 3D-P array.
4. The configurable computing element according to claim 3 , wherein said second 3D-P array at least partially covers said first 3D-P array.
5. The configurable computing element according to claim 1 , wherein data are recorded into said 3D-P using a printing method during manufacturing.
6. The configurable computing element according to claim 5 , wherein said printing method is photo-lithography.
7. The configurable computing element according to claim 5 , wherein said printing method is nano-imprint.
8. The configurable computing element according to claim 5 , wherein said printing method is e-beam lithography.
9. The configurable computing element according to claim 5 , wherein said printing method is DUV lithography.
10. The configurable computing element according to claim 5 , wherein said printing method is laser-programming.
11. A configurable gate array realizing a complex math function, comprising:
an array of configurable computing elements comprising at least a configurable computing element, wherein said configurable computing element selectively realizes a math function from a math library;
an array of configurable logic elements comprising at least a configurable logic element, wherein said configurable logic element selectively realizes a logic function from a logic library;
a plurality of configurable interconnects coupling said array of configurable computing elements and said array of configurable logic elements;
wherein said configurable gate array realizes said complex math function by programming said array of configurable computing elements, said array of configurable logic elements and said plurality of configurable interconnects; and said complex math function is a combination of the math functions from said math library.
12. The configurable gate array according to claim 11 , wherein said configurable computing element comprises at least first and second three-dimensional printed memory (3D-P) arrays stacked above a semiconductor substrate, said first 3D-P array storing at least a first portion of a first look-up table (LUT) for a first math function from said math library, said second 3D-P array storing at least a second portion of a second LUT for a second math function from said math library.
13. The configurable gate array according to claim 12 , wherein said first and second 3D-P arrays are placed side-by-side on said substrate.
14. The configurable gate array according to claim 12 , wherein said second 3D-P array is stack above said first 3D-P array.
15. The configurable gate array according to claim 14 , wherein said second 3D-P array at least partially covers said first 3D-P array.
16. The configurable gate array according to claim 12 , wherein data are recorded into said 3D-P using a printing method during manufacturing.
17. The configurable gate array according to claim 11 , wherein said first or second 3D-P array is stack above at least a selected one of said configurable logic elements.
18. The configurable gate array according to claim 17 , wherein said first or second 3D-P array at least partially covers said selected one of said configurable logic elements.
19. The configurable gate array according to claim 11 , wherein said first or second 3D-P array is stack above at least a selected one of said configurable interconnects.
20. The configurable gate array according to claim 19 , wherein said first or second 3D-P array at least partially covers said selected one of said configurable interconnects.