Cut last self-aligned litho-etch patterning

1. A method of performing a semiconductor fabrication process, comprising:

forming a spacer material within openings in a first masking layer overlying a second masking layer;

forming a reverse material over a part of the spacer material;

forming a first plurality of openings within the spacer material that are separated by the reverse material;

forming a second plurality of openings within the first masking layer that are separated by the spacer material; and

patterning the second masking layer according to the first plurality of openings and the second plurality of openings.

2. The method of claim 1 , wherein the second masking layer is disposed over a dielectric layer overlying a semiconductor substrate.

3. The method of claim 2 , further comprising:

etching the dielectric layer according to the second masking layer.

4. The method of claim 1 ,

wherein the first plurality of openings are separated by the reverse material along a first direction; and

wherein the first plurality of openings are separated from the second plurality of openings by the spacer material along a second direction perpendicular to the first direction.

5. The method of claim 1 ,

wherein the first masking layer comprises a silicon layer; and

wherein the second masking layer comprises a TEOS (tetraethyl orthosilicate) layer abutting the silicon layer.

6. The method of claim 1 , further comprising:

depositing a first pattern transfer layer over the spacer material;

patterning the first pattern transfer layer according to a first photoresist layer to form a first pattern transfer opening that extends from a top surface of the first pattern transfer layer to the spacer material; and

depositing the reverse material into the first pattern transfer opening.

7. The method of claim 1 , further comprising:

forming a second pattern transfer layer over the first masking layer;

patterning the second pattern transfer layer according to a second photoresist layer to form a second pattern transfer opening; and

etching the first masking layer according to the second pattern transfer opening to form the second plurality of openings.

8. The method of claim 1 , further comprising:

etching the spacer material not covered by the reverse material to form the first plurality of openings.

9. The method of claim 1 , wherein the reverse material comprises an oxide or a nitride.

10. The method of claim 1 , wherein the spacer material comprises silicon oxide, silicon nitride, titanium oxide, or aluminum oxide.

11. The method of claim 1 ,

wherein the first plurality of openings are separated by a first space;

wherein the second plurality of openings are separated by a second space; and

wherein a ratio of the first space to the second space is approximately 1 to 1.

12. A method of semiconductor processing, comprising:

forming openings in a first masking layer overlying a second masking layer;

forming a spacer material within the openings;

forming a reverse material over the spacer material within a part of one or more of the openings;

forming a first plurality of openings within the spacer material, which are separated in a first direction by the reverse material;

forming a second plurality of openings within the first masking layer, wherein the second plurality of openings are separated in the first direction by the spacer material; and

patterning the second masking layer according to the first plurality of openings and the second plurality of openings.

13. The method of claim 12 ,

wherein the second plurality of openings are separated from the first plurality of openings in a second direction by the spacer material; and

wherein the first direction is perpendicular to the second direction.

14. The method of claim 12 , wherein the first plurality of openings are formed within the spacer material after forming the reverse material over the spacer material.

15. The method of claim 12 , wherein the second plurality of openings are formed within the first masking layer after forming the first plurality of openings within the spacer material.

16. A method of semiconductor processing, comprising:

forming a masking structure having a plurality of openings over a second masking layer;

patterning the second masking layer according to the masking structure to form a first plurality of openings within the second masking layer and a second plurality of openings within the second masking layer;

wherein one or more of the first plurality of openings are separated from one or more of the second plurality of openings in a first direction by a side-to-side space that is smaller than a space resolvable by a single lithographic exposure;

wherein the first plurality of openings are arranged in the first direction along a first pitch and have one or more openings separated in a second direction by a first end-to-end space, and the second plurality of openings are arranged in the first direction between adjacent ones of the first plurality of openings and have one or more openings separated in the second direction by a second end-to-end space; and

wherein a ratio of the first end-to-end space to the second end-to-end space is approximately equal to 1:1.

17. The method of claim 16 ,

forming a third plurality of openings in a first masking layer overlying the second masking layer, wherein a first cut material separates two or more of the third plurality of openings along the second direction;

forming a fourth plurality of openings in the first masking layer, wherein a second cut material overlying the first cut material separates one or more of the fourth plurality of openings into two separate segments along the second direction; and

patterning the second masking layer according to the first masking layer, the first cut material, and the second cut material to form the first plurality of openings and the second plurality of openings.

18. The method of claim 17 , wherein one of the first plurality of openings are interleaved between two of the second plurality of openings in the first direction.

19. The method of claim 18 , wherein the first cut material is arranged between the first plurality of openings and the second plurality of openings in the first direction.

20. The method of claim 17 , further comprising:

depositing a first pattern transfer layer over the first cut material;

patterning the first pattern transfer layer according to a first photoresist layer to form a first pattern transfer opening that extends from a top surface of the first pattern transfer layer to the first cut material; and

depositing the second cut material into the first pattern transfer opening.