Substrate processing apparatus and substrate processing method
The temperature of a chemical liquid supplied to a pot is detected while allowing a processing liquid discharge port to discharge the chemical liquid toward the pot at a pre-dispensing position. The temperature of the chemical liquid rises in response to the lapse of time. When the temperature of the chemical liquid supplied to the pot reaches a second target temperature, the processing liquid discharge port is allowed to stop the discharge of the chemical liquid. Thereafter, a positional relationship between the processing liquid discharge port and the pot is changed, and the processing liquid discharge port is allowed to discharge the chemical liquid toward the substrate at the processing position.
1. A substrate processing apparatus comprising:
a discharge port that discharges a processing fluid that processes a substrate;
a supply passage that guides the processing fluid to the discharge port;
a discharge valve interposed in the supply passage;
a substrate holding unit that rotates the substrate to be processed by the processing fluid discharged from the discharge port while horizontally holding the substrate;
a pot that receives the processing fluid discharged from the discharge port;
a position changing unit that changes a positional relationship between the discharge port and the pot between a processing position at which the processing fluid discharged from the discharge port is supplied to the substrate held by the substrate holding unit and a pre-dispensing position at which the processing fluid discharged from the discharge port is supplied to the pot;
a downstream temperature detection unit that detects a temperature of the processing fluid supplied from the discharge port to the pot; and
a controller that controls the discharge valve and the position changing unit, wherein
the controller performs:
a first step of allowing the discharge port to discharge the processing fluid at the pre-dispensing position at which the processing fluid discharged from the discharge port is supplied to the pot by opening the discharge valve interposed in the supply passage that guides the processing fluid to the discharge port that discharges the processing fluid that processes the substrate;
a second step of detecting the temperature of the processing fluid discharged from the discharge port with the downstream temperature detection unit in parallel with the first step;
a third step of, based on the temperature of the processing fluid detected in the second step, stopping supplying the processing fluid from the discharge port to the pot; and
a fourth step of, after finishing the third step, allowing the discharge port to discharge the processing fluid at the processing position at which the processing fluid discharged from the discharge port is supplied to the substrate held by the substrate holding unit.
2. The substrate processing apparatus according to claim 1 , wherein the downstream temperature detection unit includes a downstream contact surface disposed at a place against which the processing fluid discharged from the discharge port directly strikes.
3. The substrate processing apparatus according to claim 1 , wherein the downstream temperature detection unit includes a downstream contact surface that inclines obliquely with respect to a horizontal plane, and detects the temperature of the processing fluid contiguous to the downstream contact surface.
4. The substrate processing apparatus according to claim 3 , wherein the pot includes an exhaust port that discharges the processing fluid from an inside of the pot, and the downstream contact surface inclines obliquely downwardly toward the exhaust port.
5. The substrate processing apparatus according to claim 1 , wherein the downstream temperature detection unit includes a downstream contact surface made of a material including silicon carbide, and detects the temperature of the processing fluid contiguous to the downstream contact surface.
6. The substrate processing apparatus according to claim 1 further comprising an upstream temperature detection unit that detects the temperature of the processing fluid that is present in the supply passage on an upstream side of the discharge valve,
wherein the upstream temperature detection unit includes an upstream contact surface contiguous to the processing fluid that is present in the supply passage, and detects the temperature of the processing fluid contiguous to the upstream contact surface, and
wherein the downstream temperature detection unit includes a downstream contact surface made of a material having higher thermal conductivity than the upstream contact surface of the upstream temperature detection unit, and detects the temperature of the processing fluid contiguous to the downstream contact surface.
7. The substrate processing apparatus according to claim 1 , wherein a distance to the downstream temperature detection unit from the discharge port at the pre-dispensing position is equal to a distance to the substrate from the discharge port at the processing position.