Semiconductor package with conductive clip
A semiconductor package that includes a conductive can, a power semiconductor device electrically and mechanically attached to the inside surface of the can, and an IC semiconductor device copackaged with the power semiconductor device inside the can.
1. A semiconductor package comprising:
a conductive clip;
a dielectric body mounted to said conductive clip;
an integrated circuit mounted to said dielectric body;
at least one output terminal electrically connected to said integrated circuit, and said dielectric body electrically insulating said at least one output terminal from said conductive clip; and
a power semiconductor device mounted to said conductive clip adjacent to said dielectric body and separated therefrom said integrated circuit and including at least one power electrode electrically connected to said conductive clip.
2. The semiconductor package of claim 1 , wherein said power semiconductor device is a power MOSFET.
3. The semiconductor package of claim 1 , wherein said power semiconductor device is an IGBT.
4. The semiconductor package of claim 1 , wherein said conductive clip is can-shaped.
5. The semiconductor package of claim 1 , wherein said conductive clip comprises copper.
6. The semiconductor package of claim 1 , wherein said conductive clip is plated with either gold or silver.
7. The semiconductor package of claim 1 further comprising a conductive pad.
8. The semiconductor package of claim 1 further comprising a track connecting said conductive pad to said at least one output terminal.
9. The semiconductor package of claim 8 further comprising a solder resist body covering at least said track.
10. The semiconductor package of claim 1 , wherein said dielectric body comprises a polymer.
11. A semiconductor package comprising:
a conductive clip;
a stack formed by a dielectric body mounted on a surface of the conductive clip and an integrated circuit mounted on the dielectric body; and
a power semiconductor device mounted along the surface of the conductive clip adjacent to the stack and separated therefrom at least one electrode of the power semiconductor device is electrically connected to the conductive clip.