Semiconductor structure with an L-shaped bottom plate
A semiconductor structure having an electrical contact that is connected to source/drain structures of two different transistors. The semiconductor structure has a vertical channel and a source/drain semiconductor structure connected to the vertical channel such that the source/drain semiconductor structure has a vertical side that is substantially planar with a vertical side of the first vertical channel. The source/drain semiconductor structure extends horizontally from its vertical side farther than the first vertical channel extends from its vertical side such that a width of the source/drain is greater than a width of the first vertical channel. The first source/drain semiconductor structure is located on a layer of substrate and the vertical channel is perpendicular relative to the layer of substrate.
1. A semiconductor structure, the semiconductor structure comprising: an electrical contact that is connected to two different source/drain semiconductor structures of two different transistor structures that each have vertical channels; a first vertical channel included in one of the two different transistor structures; and a first source/drain semiconductor structure connected to the first vertical channel, wherein an end of the first vertical channel abuts a horizontal surface of the first source/drain semiconductor structure such that the first source/drain semiconductor structure has a vertical side that is substantially planar with a vertical side of the first vertical channel, the first source/drain semiconductor structure extending horizontally from the vertical side farther than the first vertical channel extends from the vertical side such that a length of the horizontal surface equals a width of the source/drain semiconductor structure as measured from the vertical side of the source/drain semiconductor structure to an opposite vertical side of the first source/drain semiconductor structure, wherein the width of the source/drain semiconductor structure is greater than a width of the first vertical channel, wherein the first source/drain semiconductor structure is located on a layer of substrate, and wherein the horizontal surface is parallel to the layer of substrate at a distance, the vertical channel being perpendicular relative to the layer of substrate, wherein a bottom surface of the source/drain semiconductor structure is in direct contact with a semiconductor-on-insulator (SOI) layer.
2. The semiconductor structure of claim 1 , the semiconductor structure further comprising: a first gate structure that is in contact with at least a portion of the first vertical channel; and a first layer of dielectric material that covers the gate, the first source/drain semiconductor structure, and at least a portion of the first vertical channel.
3. The semiconductor structure of claim 1 , the semiconductor structure further comprising:
a second source/drain semiconductor structure that is in contact with the first vertical channel wherein the first gate structure is interposed between the first source/drain semiconductor structure and the second source/drain semiconductor structure.
4. The semiconductor structure of claim 1 , the semiconductor structure further comprising: a first electrical contact that is connected to the first source/drain semiconductor structure.
5. The semiconductor structure of claim 4 , the semiconductor structure further comprising: a second layer of dielectric material that covers at least the first source/drain semiconductor structure, wherein the first electrical contact passes through at least a portion of the second layer of dielectric material.
6. The semiconductor structure of claim 1 , the semiconductor structure further comprising:
a third source/drain semiconductor structure located on the layer of substrate;
a fourth source/drain semiconductor structure located on the layer of substrate;
a second vertical channel connected to third source/drain semiconductor structure, the third source/drain semiconductor structure having a vertical side that is substantially planar with a vertical side of the second vertical channel, the vertical side of the first vertical channel faces vertical side of the second vertical channel;
a third vertical channel connected to fourth source/drain semiconductor structure, the fourth source/drain semiconductor structure having a vertical side that is substantially planar with a vertical side of the third vertical channel.
7. The semiconductor structure of claim 6 , the semiconductor structure further comprising:
the second vertical channel being interposed between the first vertical channel and the third vertical channel, a distance between the first vertical channel and the second vertical channel being substantially less than and a distance between the second vertical channel and the third vertical channel.
8. The semiconductor structure of claim 6 , wherein the electrical contact that is connected to source/drain semiconductor structures of two different transistor structures comprises:
a second electrical contact that is connected to both the third source/drain semiconductor structure and the fourth source/drain semiconductor structure.