Etching method and substrate processing apparatus
An etching method is provided for etching a multilayer film material that includes a metal laminated film having an insulating layer arranged between a first magnetic layer and a second magnetic layer. The etching method includes an etching step of generating a plasma by supplying a first gas to a processing chamber and etching the metal laminated film using the generated plasma. The first gas is a gas containing PF 3 gas.
1. An etching method for etching a multilayer film material that includes a metal laminated film having an insulating layer arranged between a first magnetic layer and a second magnetic layer, the etching method comprising:
an etching step of generating a plasma by supplying a first gas to a processing chamber and etching the metal laminated film using the generated plasma; and
a treatment step of supplying a second gas to the processing chamber and performing a treatment on the metal laminated film;
wherein
the second gas is a gas containing phosphorus trifluoride (PF 3 ) gas, and
a pressure within the processing chamber is controlled to be less than 100 mTorr (26.6 Pa) during execution of at least one of the etching step and the treatment step in which the gas containing PF 3 gas is supplied.
2. The etching method as claimed in claim 1 , wherein the treatment step is performed after the etching step.
3. The etching method as claimed in claim 1 , wherein the treatment step is performed during the etching step.
4. The etching method as claimed in claim 2 , wherein the etching step and the treatment step are repeated a predetermined number of times.
5. The etching method as claimed in claim 1 , wherein the etching method is used in a fabrication process for fabricating an MRAM element as the multilayer film material including the metal laminated film.