Semiconductor device, fabrication method for a semiconductor device and electronic apparatus
Disclosed herein is a semiconductor device, including: a first substrate including a first electrode, and a first insulating film configured from a diffusion preventing material for the first electrode and covering a periphery of the first electrode, the first electrode and the first insulating film cooperating with each other to configure a bonding face; and a second substrate bonded to and provided on the first substrate and including a second electrode joined to the first electrode, and a second insulating film configured from a diffusion preventing material for the second electrode and covering a periphery of the second electrode, the second electrode and the second insulating film cooperating with each other to configure a bonding face to the first substrate.
1. A solid-state imaging device comprising:
a first semiconductor substrate including a pixel array and a first multilayer wiring layer having a first connecting interconnect embedded in a first insulating layer; and
a second semiconductor substrate including a logic circuit and a second multilayer wiring layer having a second connecting interconnect embedded in a second insulating layer,
wherein the first semiconductor substrate and the second semiconductor substrate are configured such that the first multilayer wiring layer and the second multilayer wiring layer are opposed to one another and are connected to one another via the first connecting interconnect and the second connecting interconnect,
wherein an insulating thin film is sandwiched between a bonding face of the first substrate and a bonding face of the second substrate, and
wherein the insulating thin film is formed from one of SiCN, SiON, and SiC.
2. The solid-state imaging device of claim 1 , wherein the first insulating layer and the second insulating layer are formed from SiO2.
3. The solid-state imaging device of claim 1 , wherein the bonding face of the first semiconductor substrate includes a surface of the first connecting interconnect and a surface of the first insulating layer.
4. The solid-state imaging device of claim 3 , wherein the bonding face of the second semiconductor substrate includes a surface of the second connecting interconnect and a surface of the second insulating layer.
5. The solid-state imaging device of claim 1 , wherein the pixel array includes a plurality of photoelectric conversion portions.
6. The solid-state imaging device of claim 5 , further comprising:
a plurality of first electrodes, and
a plurality of second electrodes, wherein one first electrode and one second electrode are provided for each photoelectric conversion portion in the plurality of photoelectric conversion portions.
7. The solid-state imaging device of claim 6 , wherein each photoelectric conversion portion in the plurality of photoelectric conversion portions is connected to a wiring line in the first multilayer wiring layer.
8. The solid-state imaging device of claim 7 , wherein a protection film is formed on a first face side of the first semiconductor substrate.
9. The solid-state imaging device of claim 1 , wherein the first connecting interconnect is formed from Cu.
10. The solid-state imaging device of claim 9 , wherein the second connecting interconnect is formed from Cu.
11. The solid-state imaging device of claim 8 , wherein a color filter layer is disposed on the protection film.
12. The solid-state imaging device of claim 11 , wherein on-chip lenses are disposed on the color filter layer.