Patent Assignment
Reel/Frame 056508/0762
Assignment of Assignor's Interest
Recorded: 2021-03-11
Pages: 6
Assignors
KAGAWA, YOSHIHISA
Executed: 2014-09-24
AOYAGI, KENICHI
Executed: 2014-09-14
HAGIMOTO, YOSHIYA
Executed: 2014-09-24
FUJII, NOBUTOSHI
Executed: 2014-09-24
Assignee
SONY CORPORATION
1-7-1 KONAN, MINATO-KU, TOKYO, 108-0075, JAPAN
Covered Properties
(6)
Semiconductor Device, Fabrication Method for a Semiconductor Device and Electronic Apparatus
Semiconductor Device, Fabrication Method for a Semiconductor Device and Electronic Apparatus
Semiconductor Device, Fabrication Method for a Semiconductor Device and Electronic Apparatus
Semiconductor Device, Fabrication Method for a Semiconductor Device and Electronic Apparatus
Semiconductor Device, Fabrication Method for a Semiconductor Device and Electronic Apparatus
Semiconductor Device, Fabrication Method for a Semiconductor Device and Electronic Apparatus